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SIEMENS[Siemens Semiconductor Group]
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| Part No. |
Q67120-C850 SAB88C166-5M SAB88C166W-5M Q67120-C934 SAB88C166
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| OCR Text |
...eet for the Non-Flash device. A detailled description of the SAB 88C166(W)'s instruction set can be found in the "C16x Family Instruction Set Manual".
Semiconductor Group
7
SAB 88C166(W)
Memory Organization The memory space of t... |
| Description |
16-Bit CMOS Single-Chip Microcontrollers with/without oscillator prescaler with 32 KByte Flash EPROM
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| File Size |
610.05K /
58 Page |
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it Online |
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ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
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| Part No. |
145
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| OCR Text |
...ntation date: April 2003
1.2 detailled DESCRIPTION OF CHANGE
New Process Assembly site Assembly flow + Control Plan Frame (material) Die attach material Wire material Wire diameter Mold compound Wire bond method Lead finishing ST Muar... |
| Description |
PRODUCT/PROCESS CHANGE NOTIFICATION
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| File Size |
429.29K /
12 Page |
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it Online |
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VECTRON[Vectron International, Inc]
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| Part No. |
TFS211C
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| OCR Text |
...0
Reason of Changes generate detailled specification - add terminating impedances - add matching circuit - add tape and reel dimensions, stability characteristics and reflow profile
Name Steiner
Date 24.01.2001
VI TELEFILTER Pot... |
| Description |
Filter specification
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| File Size |
41.27K /
5 Page |
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it Online |
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意法半导
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| Part No. |
145
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| OCR Text |
...ntation date: April 2003
1.2 detailled DESCRIPTION OF CHANGE
New Process Assembly site Assembly flow + Control Plan Frame (material) Die attach material Wire material Wire diameter Mold compound Wire bond method Lead finishing ST Muar... |
| Description |
PRODUCT/PROCESS CHANGE NOTIFICATION
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| File Size |
433.81K /
12 Page |
View
it Online |
Download Datasheet |
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