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  87914-2416 Datasheet PDF File

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    0879142416 87914-2416

Molex Electronics Ltd.
Part No. 0879142416 87914-2416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87914-4016

Molex Electronics Ltd.
Part No. 87914-4016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Renesas Electronics Corporation

Part No. HN58X2416STI
Description EEPROM, TSSOP(8), /
Tech specs    

Official Product Page

    87914-0807

Molex Electronics Ltd.
Part No. 87914-0807
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging

File Size 3,776.34K  /  48 Page

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Renesas Electronics Corporation

Part No. HN58X2416FPIAG
Description EEPROM, SOP(8), /Embossed Taping
Tech specs    

Official Product Page

    87914-1416

Molex Electronics Ltd.
Part No. 87914-1416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Renesas Electronics Corporation

Part No. ISL22416WFRT10Z
Description Low Noise, Low Power, SPI&reg; Bus, 128 Taps, TDFN, /Tube
Tech specs    

Official Product Page

    87914-0806

Molex Electronics Ltd.
Part No. 87914-0806
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.80K  /  11 Page

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Renesas Electronics Corporation

Part No. 844S2416CKILF
Description FemtoClock™ Crystal-to-Differential HCSL/LVCMOS Frequency Synthesizer
Tech specs    

Official Product Page

    87914-1816

Molex Electronics Ltd.
Part No. 87914-1816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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Renesas Electronics Corporation

Part No. HN58X2416FPIE
Description EEPROM, SOP(8), /Embossed Taping
Tech specs    

Official Product Page

    87914-4216

Molex Electronics Ltd.
Part No. 87914-4216
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Renesas Electronics Corporation

Part No. HN58X2416TI
Description EEPROM, TSSOP(8), /
Tech specs    

Official Product Page

    87914-1016

Molex Electronics Ltd.
Part No. 87914-1016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Renesas Electronics Corporation

Part No. ISL22416WFU10Z
Description Low Noise, Low Power, SPI&reg; Bus, 128 Taps, MSOP, /Tube
Tech specs    

Official Product Page

    87914-4616

Molex Electronics Ltd.
Part No. 87914-4616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 46 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.74K  /  48 Page

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Renesas Electronics Corporation

Part No. 844S2416CKILFT
Description FemtoClock™ Crystal-to-Differential HCSL/LVCMOS Frequency Synthesizer
Tech specs    

Official Product Page

    87914-1616

Molex Electronics Ltd.
Part No. 87914-1616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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