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  71349-1011 Datasheet PDF File

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    0713491011 71349-1011

Molex Electronics Ltd.
Part No. 0713491011 71349-1011
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 26 Circuits, Tin (Sn) Plating
File Size 421.47K  /  5 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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HUA FENG CIRCUIT





    71349-2045

Molex Electronics Ltd.
Part No. 71349-2045
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 26 Circuits, 0.38um
File Size 420.26K  /  5 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Molex, Inc.
Part No. 71349-8037
Description CGrid SMT Shd Hdr w/peg 15 SAu 10Ckt T&R 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
File Size 311.17K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

Official Product Page

    71349-1069

Molex Electronics Ltd.
Part No. 71349-1069
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded, 6Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 421.50K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    71349-2042

Molex Electronics Ltd.
Part No. 71349-2042
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs
File Size 420.54K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    71349-2043

Molex Electronics Ltd.
Part No. 71349-2043
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs
File Size 421.87K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    71349-1057

Molex Electronics Ltd.
Part No. 71349-1057
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, Shrouded50 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, without Press-fit Plasti
File Size 421.50K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

Official Product Page

    71349-1056

Molex Electronics Ltd.
Part No. 71349-1056
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, Shrouded48 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, without Press-fit Plasti
File Size 421.50K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

Official Product Page

    71349-1052

Molex Electronics Ltd.
Part No. 71349-1052
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, Shrouded40 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, without Press-fit Plasti
File Size 421.50K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

Official Product Page

    71349-1051

Molex Electronics Ltd.
Part No. 71349-1051
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, Shrouded,38 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, without Press-fit Plast
File Size 421.62K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

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