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  71349-1011 Datasheet PDF File

For 71349-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0713491040 71349-1040

Molex Electronics Ltd.
Part No. 0713491040 71349-1040
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded,16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 421.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713491017 71349-1017

Molex Electronics Ltd.
Part No. 0713491017 71349-1017
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded38 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 421.48K  /  5 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713491003 71349-1003

Molex Electronics Ltd.
Part No. 0713491003 71349-1003
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded10 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 421.48K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    0713491004 71349-1004

Molex Electronics Ltd.
Part No. 0713491004 71349-1004
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded12 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 421.48K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0713491086

Molex Electronics Ltd.
Part No. 0713491086
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 421.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0713491082

Molex Electronics Ltd.
Part No. 0713491082
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 32 Circuits, 0.76um

File Size 421.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    0713492040 71349-2040

Molex Electronics Ltd.
Part No. 0713492040 71349-2040
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs

File Size 420.26K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    0713491041 71349-1041

Molex Electronics Ltd.
Part No. 0713491041 71349-1041
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 421.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    0713491010 71349-1010

Molex Electronics Ltd.
Part No. 0713491010 71349-1010
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded24 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 421.48K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    0713491007 71349-1007

Molex Electronics Ltd.
Part No. 0713491007 71349-1007
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded18 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 421.48K  /  5 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

For 71349-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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