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  71349-1011 Datasheet PDF File

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    0713491016 71349-1016

Molex Electronics Ltd.
Part No. 0713491016 71349-1016
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded36 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
File Size 421.88K  /  5 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0713491037

Molex Electronics Ltd.
Part No. 0713491037
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 421.50K  /  5 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0713491043 71349-1043

Molex Electronics Ltd.
Part No. 0713491043 71349-1043
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 22 Circuits, 0.38um
File Size 421.50K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

Official Product Page

    0713491014 71349-1014

Molex Electronics Ltd.
Part No. 0713491014 71349-1014
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded,32 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
File Size 421.47K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    0713491009 71349-1009

Molex Electronics Ltd.
Part No. 0713491009 71349-1009
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded22 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
File Size 421.88K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    0713491012 71349-1012

Molex Electronics Ltd.
Part No. 0713491012 71349-1012
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded28 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
File Size 421.88K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    0713491013 71349-1013

Molex Electronics Ltd.
Part No. 0713491013 71349-1013
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded,30 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
File Size 421.88K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

Official Product Page

    0713491002 71349-1002

Molex Electronics Ltd.
Part No. 0713491002 71349-1002
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded, 8 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
File Size 421.47K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

Official Product Page

    0713491042 71349-1042

Molex Electronics Ltd.
Part No. 0713491042 71349-1042
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 421.50K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

Official Product Page

    0713491075

Molex Electronics Ltd.
Part No. 0713491075
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 421.51K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

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