| |
|
 |
Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0879145016 87914-5016
|
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
| File Size |
3,779.55K /
48 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
HN58X2416STI
|
| Description |
EEPROM, TSSOP(8), /
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0879143016 87914-3016
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
| |
|
|
Renesas Electronics Corporation |
| Part No. |
HN58X2416FPIAG
|
| Description |
EEPROM, SOP(8), /Embossed Taping
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
87914-3616 0879143616
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
| |
|
|
Renesas Electronics Corporation |
| Part No. |
ISL22416WFRT10Z
|
| Description |
Low Noise, Low Power, SPI® Bus, 128 Taps, TDFN, /Tube
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
87914-2216 0879142216
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
| |
|
|
Renesas Electronics Corporation |
| Part No. |
844S2416CKILF
|
| Description |
FemtoClock™ Crystal-to-Differential HCSL/LVCMOS Frequency Synthesizer
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
HN58X2416FPIE
|
| Description |
EEPROM, SOP(8), /Embossed Taping
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
HN58X2416TI
|
| Description |
EEPROM, TSSOP(8), /
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
ISL22416WFU10Z
|
| Description |
Low Noise, Low Power, SPI® Bus, 128 Taps, MSOP, /Tube
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
844S2416CKILFT
|
| Description |
FemtoClock™ Crystal-to-Differential HCSL/LVCMOS Frequency Synthesizer
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
