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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
HN58X2416STI
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| Description |
EEPROM, TSSOP(8), /
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
HN58X2416FPIAG
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| Description |
EEPROM, SOP(8), /Embossed Taping
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143435 87914-3435
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
3,776.94K /
48 Page |
 View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
| Part No. |
ISL22416WFRT10Z
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| Description |
Low Noise, Low Power, SPI® Bus, 128 Taps, TDFN, /Tube
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2816 0879142816
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.54K /
48 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
844S2416CKILF
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| Description |
FemtoClock™ Crystal-to-Differential HCSL/LVCMOS Frequency Synthesizer
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879144816
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.74K /
48 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
HN58X2416FPIE
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| Description |
EEPROM, SOP(8), /Embossed Taping
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143203 87914-3203
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
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| File Size |
759.86K /
11 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
HN58X2416TI
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| Description |
EEPROM, TSSOP(8), /
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
ISL22416WFU10Z
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| Description |
Low Noise, Low Power, SPI® Bus, 128 Taps, MSOP, /Tube
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143216 87914-3216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
844S2416CKILFT
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| Description |
FemtoClock™ Crystal-to-Differential HCSL/LVCMOS Frequency Synthesizer
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| Tech specs |
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Official Product Page
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