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  71349-1011 Datasheet PDF File

For 71349-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0713492013

Molex Electronics Ltd.
Part No. 0713492013
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded30 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
File Size 420.24K  /  5 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0713492014

Molex Electronics Ltd.
Part No. 0713492014
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 32 Circuits, Tin (Sn) Plating
File Size 420.24K  /  5 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0713492027

Molex Electronics Ltd.
Part No. 0713492027
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded58 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
File Size 420.25K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

Official Product Page

    71349-2003 0713492003

Molex Electronics Ltd.
Part No. 71349-2003 0713492003
Description 2.54mm (.100
File Size 420.24K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    71349-2005 0713492005

Molex Electronics Ltd.
Part No. 71349-2005 0713492005
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded,14 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
File Size 420.24K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    71349-2001 0713492001

Molex Electronics Ltd.
Part No. 71349-2001 0713492001
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 6 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
File Size 420.25K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    71349-2002 0713492002

Molex Electronics Ltd.
Part No. 71349-2002 0713492002
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded, 8Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
File Size 420.24K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

Official Product Page

    0713492017

Molex Electronics Ltd.
Part No. 0713492017
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded38 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
File Size 421.58K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

Official Product Page

    0713492016

Molex Electronics Ltd.
Part No. 0713492016
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded36 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
File Size 421.58K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

Official Product Page

    0713492018

Molex Electronics Ltd.
Part No. 0713492018
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded,40 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
File Size 420.24K  /  5 Page

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Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

For 71349-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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