|
|
![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
75844-879-14LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
HN58X2416STI
|
Description |
EEPROM, TSSOP(8), /
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
HN58X2416FPIAG
|
Description |
EEPROM, SOP(8), /Embossed Taping
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
ISL22416WFRT10Z
|
Description |
Low Noise, Low Power, SPI® Bus, 128 Taps, TDFN, /Tube
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
844S2416CKILF
|
Description |
FemtoClock™ Crystal-to-Differential HCSL/LVCMOS Frequency Synthesizer
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
![0879143416 87914-3416](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
|
Part No. |
0879143416 87914-3416
|
Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet
|
|
|
![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
HN58X2416FPIE
|
Description |
EEPROM, SOP(8), /Embossed Taping
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
![87914-2815 0879142815](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
|
Part No. |
87914-2815 0879142815
|
Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet
|
|
|
![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
HN58X2416TI
|
Description |
EEPROM, TSSOP(8), /
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
ISL22416WFU10Z
|
Description |
Low Noise, Low Power, SPI® Bus, 128 Taps, MSOP, /Tube
|
Tech specs |
|
|
|
Official Product Page
|
|
|
![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
844S2416CKILFT
|
Description |
FemtoClock™ Crystal-to-Differential HCSL/LVCMOS Frequency Synthesizer
|
Tech specs |
|
|
|
Official Product Page
|
|
![](images/bom2buy.png)
Bom2Buy.com
![](images/findchips_sm.gif)
Price and Availability
|