creat by art - low power loss, high efficiency - ideal for automated placement - guardring for overvoltage protection - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test symbol unit v rrm v v rms v v dc v i f(av) a dv/dt v/ s r jc r ja t j o c t stg o c document number: ds_d1309043 version: f13 storage temperature range - 55 to +175 maximum reverse current @ rated vr t j =25 t j =125 i r 0.2 note 1: pulse test with pw=300 s, 1% duty cycle 50 operating junction temperature range v 0.90 maximum instantaneous forward voltage (note 1) i f =12.5a, t j =25 i f =12.5a, t j =125 i f =25a, t j =25 i f =25a, t j =125 v f 0.75 - 55 to +175 ma 1.5 o c/w typical thermal resistance maximum average forward rectified current 25 15 voltage rate of change (rated v r ) 10000 0.70 0.60 maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 150 a MBRS25H45CT 45 31 45 mechanical data to-263ab (d 2 pak) case: to-263ab (d 2 pak) maximum dc blocking voltage maximum repetitive peak reverse voltage maximum rms voltage polarity: as marked weight: 1.4 g (approximately) MBRS25H45CT dual common cathode schottk y rectifier features - moisture sensitivity level: level 1, per j-std-020 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec taiwan semiconductor
part no. part no. MBRS25H45CT MBRS25H45CT (ta=25 unless otherwise noted) document number: ds_d1309043 version: f13 green compound description 50 / tube 800 / 13" paper reel packing example preferred p/n packing code green compound code c0 d 2 pak ratings and characteristics curves MBRS25H45CT rn rn MBRS25H45CT rng rn g MBRS25H45CT MBRS25H45CT taiwan semiconductor ordering information packing code green compound code package rn suffix "g" d 2 pak 0 5 10 15 20 25 30 0 255075100125150175 average forward c urrent (a) case temperature ( ) fig.1 maximum forward current derating curve resistive or inductive load 0 25 50 75 100 125 150 110100 peak forward surge current(a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current per leg 8.3ms single half sine wave jedec method 0.0001 0.001 0.01 0.1 1 10 100 0 20406080100120140 instantaneous reverse current (ma) percent of vr (%) fig. 4 typical reverse characteristics per leg tj=25 tj=125 1 10 100 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 instantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics per leg tj=125 tj=25
min max min max a - 10.5 - 0.413 b 14.60 15.88 0.575 0.625 c 2.41 2.67 0.095 0.105 d 0.68 0.94 0.027 0.037 e 2.29 2.79 0.090 0.110 f 4.44 4.70 0.175 0.185 g 1.14 1.40 0.045 0.055 h 1.14 1.40 0.045 0.055 i 8.25 9.25 0.325 0.364 j 0.36 0.53 0.014 0.021 k 2.03 2.79 0.080 0.110 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1309043 version: f13 f9.5 g2.5 marking diagram c1.1 d3.5 e 16.9 suggested pad layout symbol unit (mm) a 10.8 b8.3 unit (inch) 0.425 MBRS25H45CT taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 0.327 0.043 0.138 0.665 0.374 0.098 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance ( / w) t-pulse duration(s) fig. 5 typical transient thermal impedance per leg
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1309043 version: f13 MBRS25H45CT taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
|
