lvir63233/s2/a-pf doc. no : qw0905- rev. : date : - 2015 data sheet ligitek electronics co.,ltd. property of ligitek only infrared emitting diodes lvir63233/s2/a-pf 06 - jul. b lead-free parts pb l dcc
note : 1.all dimension are in millimeter tolerance is ligitek electronics co.,ltd. property of ligitek only water clear aigaas lvir63233/s2/a-pf part no device selection guide: lens color material features: 1. high radiant intensity. 2. suitable for pulsed applications. 3. low average degradation. descriptions: the lvir63233/s2/a-pfseries are high power solution grown efficiency gallium arsenide infrared emitting diodes encapsulated in water clear plastic part no. lvir63233/s2/a-pf 1/9 page t-1 3/4 package individually 5.8 2.54 - + 4.8 4.4 0.6 3.2
electrical optical characteristics (aa=25) ? v part no. lvir63233/s2/a-pf
ligitek electronics co.,ltd. property of ligitek only 42 a15 a14 35 50 42 24 a12 a13 29 a1120 29 35 24 vir chip min. radiant intensity(mw/sr) at 100 ma group max. brightness code for standard led lamps lvir63233/s2/a-pf part no. 3/9 page bin code a16 5060 75 60 a17
2.5 i fdc [ma] 40 ambient temperature [
circuit model a (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. drive method: led is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. storage time: 1.the operation of temperatures and rh are : 5
anode side(cathode side on gaalas chips) 15
part no. lvir63233/s2/a-pf dip soldering preheat: 120 0 preheat 0 25 100 50 150 time(sec) temp( 120 260
reliability test: operating life test test item low temperature storage test high temperature storage test thermal shock test high temperature high humidity test solder resistance test solderability test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=-40
packing specification 1. 500pcs / bag 2. 8 bag / inner box size : l x w x h 33.5cm x 19cm x 7.5cm h w l l 3. 12 inner boxes / carton size : l x w x h 58.5cm x 34cm x 34cm i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s c/no: made in china w h page9/9
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