www.goodark.com page 1 of 4 rev.1.0 ssf 2301a 20v p-channel mosfet package marking and ordering information device marking device device package reel size tape width quantity 2301a SSF2301A sot23 ?180mm 8 mm 3000 units absolute maximum ratings (t a =25 unless otherwise noted) parameter symbol limit unit drain-source voltage v ds -20 v gate-source voltage v gs 12 v i d -4 a drain current-continuous@ current-pulsed (note 1) i dm -20 a maximum power dissipation p d 1.6 w operating junction and storage temperature range t j ,t stg -55 to 150 thermal characteristics thermal resistance,junction-to-ambient (note 2) r ja 156 /w general features v ds = -20v,i d = -4a r ds(on) < 80m @ v gs =-2.5v r ds(on) < 65m @ v gs =-4.5v high power and current handing capability lead free product surface mount package description the SSF2301A uses advanced trench technology to provide excellent r ds(on) , low gate charge and operation with gate voltages as low as 2.5v. this device is suitable for use as a load switch or in pwm applications. a pplication s pwm applications load switch power management schematic d iagram marking and p in assignment sot23 t op v iew d g s
www.goodark.com page 2 of 4 rev.1.0 ssf 2301a 20v p-channel mosfet electrical characteristics (t a =25 unless otherwise noted) parameter symbol condition min typ max unit off characteristics drain-source breakdown voltage bv dss v gs =0v i d =-250a -20 v zero gate voltage drain current i dss v ds =-20v,v gs =0v -1 a gate-body leakage current i gss v gs =12v,v ds =0v 100 na on characteristics (note 3) gate threshold voltage v gs(th) v ds =v gs ,i d =-250a -0.5 -1 v v gs =-4.5v, i d =-4a 46 65 drain-source on-state resistance r ds(on) v gs =-2.5v, i d =-3a 65 80 m forward transconductance g fs v ds =-5v,i d =-4a 7 s dynamic characteristics (note4) input capacitance c lss 640 pf output capacitance c oss 180 pf reverse transfer capacitance c rss v ds =-10v,v gs =0v, f=1.0mhz 100 pf switching characteristics (note 4) turn-on delay time t d(on) 27 ns turn-on rise time t r 60 ns turn-off delay time t d(off) 30 ns turn-off fall time t f v dd =-10v,i d =-1a v gs =-4.5v,r gen =6 10 ns total gate charge q g 9.6 nc gate-source charge q gs 1.5 nc gate-drain charge q gd v ds =-10v,i d =-4a,v gs =-4.5v 2.4 nc drain-source diode characteristics diode forward voltage (note 3) v sd v gs =0v,i s =-1a -1.2 v notes: 1. repetitive rating: pulse width limited by maximum junction temperature. 2. surface mounted on fr4 board, t 10 sec. 3. pulse test: pulse width 300s, duty cycle 2%. 4. guaranteed by design, not subject to production testing.
www.goodark.com page 3 of 4 rev.1.0 ssf 2301a 20v p-channel mosfet typical electrical and thermal characteristics square wave pluse duration(sec) figure 3: normalized maximum transient thermal impedance v in v out 10% 10% 50% 50% pulse width inverted t d(on) 90% t r t on 90% 10% t off t d(off) t f 90% v in v out 10% 10% 50% 50% pulse width inverted t d(on) 90% 90% t r t on 90% 10% t off t d(off) t f 90% figure 2:switching waveforms rgen vin g vdd rl vout s d vgs figure1:switching test circuit r(t),normalized effective transient thermal impedance
www.goodark.com page 4 of 4 rev.1.0 ssf 2301a 20v p-channel mosfet sot-23 package information dimensions in millimeters (unit: mm) dimensions in millimeters symbol min. max. a 0.900 1.150 a1 0.000 0.100 a2 0.900 1.050 b 0.300 0.500 c 0.080 0.150 d 2.800 3.000 e 1.200 1.400 e1 2.250 2.550 e 0.950typ e1 1.800 2.000 l 0.550ref l1 0.300 0.500 0 8 notes 1. all dimensions are in millimeters. 2. tolerance 0.10mm (4 mil) unless otherwise specified 3. package body sizes exclude mold flash and gate burrs. mold flash at the non-lead sides should be less than 5 mils. 4. dimension l is measured in gauge plane. 5. controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
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