lfdbk2060/hv48-o-pf high voltage led lamps ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-: rev : date : 05 - mar. a - 2010 lfdbk2060/hv48-o-pf pb lead-free parts l dcc
?? 0.5 typ 29.6min pyrocondensation cannula + - 2.54typ 5.2 4.2 4.0 3.0 1. built-in ic chip manufactured by cmos technology note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 6. input current is around 7.3ma@voltage=48v 5. blink 64 times spend 25~60 seconds. 4. duty cycle 50% 3. led will blink 64 times before going stedy when power on. 2. a wide range of operating voltage:+5v~+48v 1/5 page lfdbk2060/hv48-o-pf part no. package dimensions ligitek electronics co.,ltd. property of ligitek only features: 7. luminous intensity at +48v is 65mcd min and 120mcd typ. 8. led emitting color is blue, lens of led is blue. applications: direct connect it to telephone circuits 11.02
luminous intensity volt=48v (mcd) operating voltage j j v v unit ligitek electronics co.,ltd. property of ligitek only page lfdbk2060/hv48-o-pf blue 120 470 30 2.5 1.6 65 note : the luminous intensity data did not including ? 15% testing tolerance. lens material part no emitted color spectral halfwidth ??f nm pulse rate(hz) volt=48v min. min. max. typ. typical electrical & optical characteristics (ta=25 j ) storage temperature operating temperature tstg t opr -20 ~ +85 -0 ~ +85 symbol forward voltage reverse voltage vr fv parameter 0.4 50 ratings absolute maximum ratings at ta=25 j 2/5 max. min. 5.0 50 dominant wave length f dnm ingan/gan blue diffused lfdbk2060/hv48-o-pf part no.
fig.5 relative intensity vs. wavelength typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 1.0 3.0 4.0 0 1 1.0 relative intensity@20ma wavelength (nm) 450 0.0 400 500 550 0.5 0.5 relative intensity@20ma normalize @25 j forward voltage@20ma normalize @25 j 20 ambient temperature( j ) ambient temperature( j ) 0 -20 -40 0.8 0 -40 -20 100 80 60 40 20 0.0 60 100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 relative intensity normalize @20ma forward current(ma) forward current(ma) forward voltage(v) 2.0 5.0 1 10 0.0 0.5 1.0 1.5 2.0 100 1000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 1 10 100 1000 dbk chip page 3/5 lfdbk2060/hv48-o-pf part no.
page 4/5 260 x c3sec max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 60 seconds max 0x 25x 120x 260x preheat 50 2 x /sec max 100 5 x /sec max time(sec) 150 dip soldering preheat: 120 x c max preheat time: 60seconds max ramp-up 2 x c/sec(max) ramp-down:-5 x c/sec(max) solder bath:260 x c max dipping time:3 seconds max distance:2mm min(from solder joint to body) temp( x c) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 x c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only lfdbk2060/hv48-o-pf part no.
mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. high temperature storage test 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles solderability test solder resistance test thermal shock test high temperature high humidity test low temperature storage test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) reliability test: operating life test test item this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition description reference standard page 5/5 lfdbk2060/hv48-o-pf part no.
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