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4.2v to 18v, 2a 1ch synchronous buck converter integrated fet bd932 8 efj - lb general description this is the product guarantees long time support in industrial market. the bd 9328efj -lb is a synchronous step - down switching regulator with built - in two low - resistance n-c hannel mosfets. this ic can supply continuous output current of 2a over a wide input range , and provides not only fast transient response, but also easy phase compensation because of current mode control . features ? long time support product f or industrial applications. ? uses low esr output ceramic capacitors ? low stan d by current ? 380 khz fixed operating frequency ? feedback v oltage ? 0.9v 1.5%( ta = 2 5 c) ? 0.9v 2.0 %(ta= -25 c to + 85 c) ? protection c ircuit s ? under voltage l ock o ut p rotection ? thermal s hutdown ? over current p rotection applications industrial equipment . distributed power system s pre- regulator for linear regulator s key specifications ? i nput v oltage r ange: 4.2 v to 18 v ? o utput v oltage r ange: 0.9 v to (v in x 0.7)v ? o utput current: 2a ( max) ? switching f requency: 380 khz(typ) ? hi -s ide fet o n-r esistance: 0.15 (typ) ? lo-s ide fet o n-r es istance: 0.13 (typ) ? s tandby current: 15 a (typ) ? operating t emperature r ange : - 40 c to +85 c package w (typ) d (typ) h (max) htsop -j8 4.90mm x 6.00mm x 1.00mm typical application circuit r_ bs protect from v in - bst short destruction. fig ure 1. typical application circuit htsop - j8 c_co1 r _ pc 7.5k r_up c_bs 0.1 f 10 h c_vc 1 10 f c _pc 3300pf r_dw 10 k 27k 20 f c _ss 0.1 f l ss en comp fb bst vin gnd sw thermal pad (to be shorted to gnd) vin 12v v out 3.3v r _b s 22 product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 tsz02201 - 0323aaj00450 -1-2 16.feb.2015 rev.004 datashee t
bd932 8e fj - lb pin configuration block diagram figure 2. pin configuration figure 3 . block diagram pin description pin no. pin name function 1 bst high -s ide g ate d rive b oost i nput 2 vin power i nput 3 sw power s witching o utput 4 gnd ground 5 fb feed b ack i nput 6 comp compensation n ode 7 en enable i nput 8 ss soft s tart c ontrol i nput block operation (1) vreg this block generates a constant volta ge for dc/dc boosting. (2) vref this block generates an internal reference voltage of 5.1 v (typ). (3) tsd/uvlo tsd (thermal shutdown)/uvlo (under voltage lockout) protection block. the tsd circuit shuts down the ic at high temperature. the uvlo circuit shuts dow n the ic when the v in voltage is l ow. (4) error amp b lock (err) this block compares the reference voltage and the feedback voltage from the output. the output voltage of this block, which is connected to comp pin, determines the switching duty cycle. at the ti me of start up , since the soft start is operated by the ss pin voltage, the comp pin voltage is limited to the ss pin voltage. (5) oscillator b lock (osc) this block generates the oscillating frequency. (6) slope b lock this block generates the triangular wave form wi th the use of the clock created by osc. the generated triangular wave form is sent to the pwm comparator. (7) pwm b lock the comp pin voltage output of the error amp is compared to the slope block's triangular waveform to determine the switching duty. since the switching duty cycle is limited by the maximum duty ratio which is determined internally, 100% duty cycle cannot be achieved. (8) drv b lock a dc/dc driver block that accepts signal from the pwm block to drive the p ower fets. (9) ocp b lock ocp (over current protec tion) block. the current that flows through the fet s is detected , and ocp starts when it reached 3.0a (min). after ocp detection , switching is turned off and the ss capacitor is discharged. ocp is not a ? latch type? but an ? auto restart ?. (10) soft start c ircui t this circuit prevents output voltage overshoot or inrush current by making the output voltage rise gradually while restricting the current at the time of startup. (top v in 2 / 18 16.feb.2015 rev.004 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2
bd9328efj - lb absolute maximum ratings (ta = 25 c ) parameter symbol rating unit supply voltage v in 20 v switch voltage v sw 20 v power dissipation for htsop - j8 pd 3 . 76 (note 1 ) w package t hermal r esistance ja (note 2 ) ja 29.27 c /w package t hermal r esistance jc (note 2 ) jc 3.75 c /w operating temperature range topr - 40 to + 85 c storage temperature range ts t g - 55 to + 150 c maximum junction temperature tjmax 150 c bst voltage v bst v sw +7 v en voltage v en 20 v all o ther p ins v oth 20 v (note 1 ) derating i s done 30.08 mw/ c when operating above ta 25 c (mount on 4 - layer 70.0mm x 70.0mm x 1.6mm board) (note 2 ) mount on a 4 - layer 50mm x 30mm x 1.6mm application board caution: operating the ic over the absolu te maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the i c is operated over the absolute maximum ratings. recommended operating conditions (ta= - 40 c to + 85 c ) parameter symbol rating u nit min typ max supply voltage v in 4.2 12 18 v sw voltage v sw - 0.5 - + 1 8 v output c urrent i sw3 - - 2 a output v oltage r ange v range 0.9 - v in x 0.7 v electrical characteristics ( unless otherwise specified v in =12v ta=25 c ) parameter symbol limit unit conditions min typ max error a mplifier b lock fb i nput b ias c urrent i fb - 0.02 2 a feedback v oltage1 v fb1 0.886 0.9 00 0.914 v voltage f ollower feedback v oltage2 v fb2 0.882 0.900 0.918 v ta = -25c to + 85c sw b lock ? sw hi -s ide fet o n -r esistance r onh - 0.15 - i sw = - 0.8a lo-s ide fet o n -r esistance r onl - 0.13 - i sw = 0.8a hi/lo -s ide fet leak c urrent i leakn - 0 10 a v in = 18v, v sw = 0v / 18v switch current limit i limit3 3 - - a maximum d uty c ycle m duty - 90 - % v fb = 0v general enable sink c urrent i en 90 180 270 a v en = 12v enable threshold v oltage v en 1.0 1.2 1.4 v under voltage lockout t hreshold v uvlo 3.5 3.75 4.0 v v in r ising under voltage lockout hysteresis v hys - 0.3 - v soft start current i ss 5 10 15 a v ss = 0 v soft start time t ss - 22 - ms c ss = 0.1 f operating frequency f osc 300 380 460 khz circuit current i cc - 1.2 3 ma v fb = 1.5v, v en = 12v standby current i qui - 15 27 a v en = 0v 3 / 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb typical performance curves (unless otherwise specified, v in = 12v ta= 25 c ) fig ure 6 . input bias current vs feedback voltage fig ure 5 . standby c urrent vs input voltage ( shutdown mode ) fig ure 4 . circuit current vs input voltage (no s witching) fig ure 7 . feedback v oltage vs temperature temperature [ c ] i fb ( a) v fb (v) i cc ( a) v in (v) i cc (ma) v in (v) 4 / 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb typical performance curves - continued fig ure 10 . step - down efficiency vs i o (v in = 12v v out = 3.3v l=10h) fig ure 9 . ope rating frequency vs temperature fig ure 8 . hi - side , low - side fet o n -r esistance vs temperature fig ure 11 . soft start time vs soft start capacitor soft start time [ms] c ss [ f] 50 55 60 65 70 75 80 85 90 95 0 500 1000 1500 2000 io[ma] efficiency[%] efficiency i o [ ma ] ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb typical waveforms fig ure 13. transient response (v in = 12v v out = 3.3v l= 10h c out =20f i out = 0. 2 - 1.0a ) fig ure 15. transient response (v in = 12v v out = 3.3v l= 10h c out =20f i out = 0.2 - 2.0 a) fig ure 14. output rippl e voltage (v in = 12v v out = 3.3v l= 10h c out =20f i out = 1.0a ) v out i out fig ure 12 . over current protection (v out is shorted to gnd) 6 / 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb typical waveforms - continued fig ure 17. start -u p w aveform (v in = 12v v out = 3.3v l= 10h c ss = 0. 1f) fig ure 16. output ripple voltage (v in = 12v v out = 3.3v l= 10 h c out =20f i out = 2.0a ) t ss 7 / 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb application information typical application circuit r_bs protect from v in - bst short destruction. fig ure 1 8 . typical application circuit symbol maker part no input c apacitor c_vc1 tdk c3225jb1e 106k 10 f/25v output c apacitor c_co1 tdk c3216jb 1c106m 10 f/16v inductor l tdk slf10165 - 100m3r8 10 h/3.8a c_co1 r _ pc 7.5k r_up c_bs 0.1 f 10 h c_vc 1 10 f c _pc 3300pf r_dw 10 k 27k f f l ss en comp fb bst vi n gnd sw thermal pad (to be shorted to gnd) v in = 12v v out = 3.3v r _bs 22 8 / 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb selecting application components (1) output lc f ilter c onstant s election (buck converter) the output lc filter is required to supply constant current to the output loa d. a larger inductance value at this filter results in less inductor ripple current (? i l ) and less output ripple voltage. however, inductors with large values tend to have slower load transient - response, a larger physical size, a lower saturation current , and a higher series resistance. a smaller value of inductance has almost opposite characteristics as above. so , c hoosing the inductor ripple current (? i l ) between 20 % to 40% of the averaged inductor current ( equivalent to the output load current) is a good compromise. fig ure 19 fig ure 20 setting ? i l = 30% x averaged inductor c urrent (2a) = 0.6 [a] where : v in = 12v, v out = 3.3v, f osc = 380 khz, f osc is the switching frequency also the inductor should ha ve a higher saturation current than i outmax + ? i l / 2. t he output capacitor c out affects the output ripple - voltage. choose a high - value capacitor to achieve a small er ripple - voltage that is enough to meet the application requirement. output ripple voltag e ? v rpl is calculated using the following equation : w here : r esr is the parasitic series resistance of the output capacitor. setting c out = 20f, r esr = 10m (2) loop compensation choosing compensation capacitor c cmp and resistor r cmp the current - mode buck converter has 2 - poles and 1 - zero system. choosing the appropriate compensation resistor and capacitor is important to achieve a good load - transient response and good stability. an example of a dc/dc converter application bode plot is shown in fig ure 22 . the compensation resistor , r cmp , determine s the cross over frequency f crs (the frequency at which the total dc - dc loop - gain falls to 0db). setting a higher cross - over frequency achieves good response speed, but less stability. on the other hand, setting the cross - over frequency to a lower value may result to better stability , but poorer response speed. setting the cross - over frequency to 1/10 of the switching frequency shows good performance at most applications. v out l v in c out i l t i out max + ? ( ) [ ] h i f v v v v l l osc in out in out = ? ? = [ ] v f c r i v osc out esr l rpl ? ? ? ? ? ? ? ? + ? = ? ? mv k m v rpl 8 . 15 )) 380 20 8 /( 1 10 ( 6 . 0 = + = ? ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb phase margin 180 90 180 90 0 0 a (a) gbw(b) f f gain [db] phase f crs (a) choosing phase compensation resi stor r cmp the compensation resistor r cmp can be calculated by the following formula : where : v out is the output voltage f crs is the cross over frequency c out is the output c apacitor v fb is the i nternal feedback voltage ( 0.9v (typ) ) g mp is the current s ense gain ( 7.8a/v (typ) ) g ma is the error amplifier tran s - conductance ( 300a/v (typ) ) setting v out = 3.3v, f crs = 38khz, c out = 20 f ; (b) choosing phase compensation capacitor c cmp for stability of the dc/dc converter, cancel lation of the phase delay that d erives from output capacitor c out and resistive load r out is possible by inserting the phase advance . the phase advance can be added by the zero on compensation resistor r cmp and capacitor c cmp . making f z = f crs / 6 gives a first - order estimate of c cmp . compensation capacitor setting f z = f crs /6 = 6.3khz; compensation capacitor however, the best values for zero and f crs differ between applications. decide the values accordingly a fter calculation using the formula above and c onfirmation on the actual application . (c) the condition of the loop compensation stability the stability of dc/dc converter is important. to ensure operati on stability, check if the loop compensation has enough phase - margin. for the condition of loop compensation stability, the phas e - delay must be less than 150 degree s at 0 db gain . feed - forward capacitor , c rup , boosts phase margin over a limited frequency range and is sometimes used to improve loop response. c rup will be more effective if r up >> r up ||r dw fig ure 2 1 fig ure 22 (3) design of feedback resistance constant set the feedback resistance as shown below. fig ure 23 + [ ] ? = ma mp fb out crs out cmp g g v c f v r [ ] f fz r c cmp cmp = v r r r v out + = ? = = k k r cmp f k r c cmp cmp ? ? = = ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb 2. soft start function an adjustable soft - start function to prevent high inrush current during start - up is available. the soft - start time is set by the external capacitor connected to ss pin. the soft start time is given by the c harge time of c ss t he ss terminal rising time setting c ss = 0.1f please confirm the overshoot of the output voltage and inrush cur rent in deciding the ss capacitor value. 3. en function the en terminal contr ol s the ic?s shut down. leaving en terminal open shuts down the ic. to start the ic, the en terminal should be connected to v in or to another power source. when the en voltage exceed s 1.2v (typ), the ic start s operating. (attention) if the falling edge of en input is too slow, output chattering occurs. this may cause large inverse current from output to input to flow and v in voltage to increase, leading to destruction of t he ic. thus, set the fall time of en signal within 100 s when controlling the on/off operation of the ic. this requirement is not needed when en pin is connected with vin and en is not controlled . as a recommendation, control en with an open drain mosfe t connected as shown on fig ure 25. fig ure 25 c ss ss + + - comp i ss 10a erramp v in en 66 k [ ] ss ss ss i c s t / 2 . 2 = [ ] ss ss ss i c s t / 6 . 0 1 = [ ] ss ss ss i c s t / 6 . 1 2 = ] [ 22 10 / 1 . 0 ) 6 . 1 6 . 0 ( ] [ ms s t ss = + = ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb c in fet c out l v out v in 4. layout pattern consideration two high pulsing current loops exist in the buck regulator system. the first loop, when fet is on, starts from the input capacitors, to the vin terminal, to t he sw terminal, to the inductor, to the output capacitors, and then returns to the input capacitor through gnd. the second loop, when fet is off, starts from the low fet, to the inductor, to the output capacitor, and then returns to the low fet through gnd . to reduce the noise and improve the efficiency, please minimize these two loop area s . t he input capacitor, output capacitor and the low fet should be connected to the pcb?s gnd plain. pcb layout may greatly affect the thermal performance, noise and effic iency. so please take extra care when designing pcb layout patterns. (1) the thermal pad on the back side of the ic has the great est thermal conduction in to the chip. so using the gnd pla n e as broad and wide as possible can help thermal dissip ation. a dding thermal via for dissipation of heat in to the different layer s is also effective. (2) the input capacitors should be connected as close as possible to the vin terminal. (3) when there is an unused area on the pcb, please arrange the copper foil plai n of dc nodes, such as gnd, v in and v out for better heat dissipation of the ic or circumference parts. (4) to avoid the noise influence from ac coupling with the other line s , keep the switching line s such as sw as short as possible, and coil traces as short and as thick as possible. (5) keep sensitive signal traces such as trace s connected to fb and comp away from sw pin. (6) the inductor and the output capacitors should be placed close to sw pin as much as possible. comp bst v in sw fb ss en gnd c out l v out c in fig ure 26 . current l oop in b uck r egulator s ystem fig ure 27 . an example of pcb l ayout p attern 12/ 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb i/o equivalen c e circuit 1.bst 3.sw 5.fb 6.comp 7.en 8.ss fig ure 28. i/o equivalen ce circuit power dissipation v in v in sw reg v in v in v in v in v in htsop - j8 package on 70mm x 70mm x 1.6 mm glass epo xy pcb (1) 1 - layer board ( backside c opper foil area 0 m m x 0 mm) (2) 2 - layer board ( backside c opper foil area 15 mm x 15 mm) (3) 2 - layer board ( backside c opper foil area 70 mm x 70 mm) (4) 4 - layer board ( backside c opper foil area 70 mm x 70 mm) 150 0 50 75 100 125 2000 4000 1000 3000 2 5 power dissipation: pd [mw ] ambient temperature: ta [ c ] (1)820mw (2)1100mw (3)2110mw (4)3760mw 0 power dissipation : pd [mw] ambient temperature : ta [ c ] 13/ 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can dam age the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance s upply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . co nsider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern w hen using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power diss ipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy boar d. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can b e approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow insta ntaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operat ion u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection pr ocess. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environ ment) and unintentional solder bridge deposited in between pins during assembly to name a few. 14/ 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb operational notes ? continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected ope ration of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction ope rates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operation al faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 29 . example of monolithic ic structure 13. thermal s hutdown c ircuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the j unction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situa tion that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. over c urrent p rotection c ircuit (ocp) this ic incorpora tes an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 15. en control speed chattering happens if standing lowering speed is slow when standing of en pin is lowered. the reverse current in which the input side and the pressure operation are don e from the output side is generated when chattering operates with the output voltage remained, and there is a case to destruction. please set to stand within 100us when you control on/off by the en signal. 16. about output voltage when en terminal on when restarting by en terminal , bd932 8 efj starts from 0v. when an electric charge is left in an output capacitance at this time, electric current discharge from an output capac itance is performed. when many electric charges are left in an output capacitance , this electrical current discharge becomes big, and bd932 8 efj sometimes comes to destruction. therefore please do the discharge control to follow condition s of output voltag e when en terminal on . in c ase of output capacit o r value is less than 100 f,: please set the output volta ge less than 2.0v when en terminal on. in case of output capacit or value is more than 100 f,: please set the output voltage based on the next formula . (output voltage when en terminal on [v]) < 9. 15 x ( output capacitance [f] ) (- 0.33) 15/ 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb ordering information b d 9 3 2 8 e f j - l b e 2 part number package efj: htsop -j8 product class lb for industrial applications packaging and forming specification e2: embossed tape and reel marking diagram htsop - j8(top view) d9328 part number marking lot number 1pin mark 16/ 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb physical dimension tape and reel information package name htsop - j8 17/ 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
bd9328efj - lb revision history date revision changes 05.aug.2013 001 new release 27.feb.2014 002 delete sentence ?and log life cycle? in general description and futures (page 1) . applied new style ( ? title ? and ? physical dimension tape and reel information? ) . 09.sep.2014 003 applied t he rohm standard style and i mproved understandability in all pages . 16.feb .201 5 00 4 add ? 16. a bout output voltage when en terminal on ? in o pe rationa l notes 18/ 18 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0323aaj00450 - 1 - 2 16.feb.2015 rev.004
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd9328efj-lb package htsop-j8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd9328efj-lb - web page

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