? semiconductor components industries, llc, 2014 july, 2014 ? rev. 3 1 publication order number: nz9f2v4s/d nz9f2v4st5g, sznz9f2v4st5g series zener voltage regulators 250 mw sod?923 surface mount this series of zener diodes is packaged in a sod?923 surface mount package. they are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. they are well suited for applications such as cellular phones, hand held portables, and high density pc boards. specification features ? standard zener breakdown voltage range ?2.4 v to 18 v ? steady state power rating of 250 mw ? small body outline dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm) ? low body height: 0.016 (0.40 mm) ? esd rating of class 3 (>16 kv) per human body model ? tight tolerance v z ? sz prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these are pb?free devices mechanical characteristics case: void-free, transfer-molded, thermosetting plastic epoxy meets ul 94, v?0 lead finish: 100% matte sn (tin) mounting position: any qualified max reflow temperature: 260 c device meets msl 1 requirements maximum ratings rating symbol max unit total device dissipation fr?5 board, (note 1) @ t a = 25 c derate above 25 c p d 250 2.0 mw mw/ c thermal resistance from junction?to?ambient r ja 500 c/w junction and storage temperature range t j , t stg ?65 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. fr?4 minimum pad. 1 cathode 2 anode see specific marking information in the device marking column of the electrical characteristics table on page 3 o f this data sheet. device marking information http://onsemi.com device package shipping ? ordering information nz9fxxxst5g, sznz9fxxxst5g sod?923 (pb?free) 8000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification s brochure, brd8011/d. sod?923 case 514ab x = specific device code m = month code = pb?free package (note: microdot may be in either location) marking diagram x m 1 2 12
nz9f2v4st5g, sznz9f2v4st5g series http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted, v f = 0.9 v max. @ i f = 10 ma for all types) symbol parameter v z reverse zener voltage @ i zt i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk i r reverse leakage current @ v r v r reverse voltage i f forward current v f forward voltage @ i f v z maximum temperature coefficient of v z c max. capacitance @v r = 0 and f = 1 mhz i f v i i r i zt v r v z v f figure 1. zener voltage regulator temperature ( c) 25 0 100 40 20 0 power dissipation (%) 50 75 100 125 150 80 60 figure 2. steady state power derating
nz9f2v4st5g, sznz9f2v4st5g series http://onsemi.com 3 electrical characteristics (v f = 0.9 max @ i f = 10 ma for all types) device*** device marking zener voltage vz test curren t izt ma z zt i z = izt @ 10% mod max z zk i z = 1.0 ma max i zk ma max ir @ vr d vz /dt (mv/k) @ i zt1 = 5 ma cpf max @ v r = 0 f = 1 mhz min max a v min max sz, nz9f2v4st5g 2* 2.43 2.63 5 100 1000 1 50 1 ?3.5 0 210 sz, nz9f2v7st5g 3* 2.67 2.91 5 100 1000 1 20 1 ?3.5 0 210 sz, nz9f3v0st5g 4* 2.94 3.26 5 100 1000 1 10 1 ?3.5 0 210 sz, nz9f3v3st5g 5* 3.32 3.53 5 100 1000 1 10 1 ?3.5 0 210 sz, nz9f3v6st5g 6* 3.6 3.85 5 100 1000 1 10 1 ?3.5 0 210 sz, NZ9F3V9ST5G a** 3.89 4.16 5 100 1000 1 5 1 ?3.5 ?2.5 210 sz, nz9f4v3st5g d** 4.17 4.43 5 100 1000 1 5 1 ?3.5 0 210 sz, nz9f4v7st5g e** 4.55 4.75 5 100 800 0.5 2 1 ?3.5 0.2 150 sz, nz9f5v1st5g f** 4.989 5.2 5 80 500 0.5 2 1.5 ?2.7 1.2 130 sz, nz9f5v6st5g j** 5.49 5.73 5 60 200 0.5 1 2.5 ?2.0 2.5 115 sz, nz9f6v2st5g k** 6.06 6.33 5 60 100 0.5 1 3 0.4 3.7 110 sz, nz9f6v8st5g l** 6.65 6.93 5 40 60 0.5 0.5 3.5 1.2 4.5 105 sz, nz9f7v5st5g p** 7.28 7.6 5 30 60 0.5 0.5 4 2.5 5.3 100 sz, nz9f8v2st5g q** 8.02 8.36 5 30 60 0.5 0.5 5 3.2 6.2 90 sz, nz9f9v1st5g r** 8.85 9.23 5 30 60 0.5 0.5 6 3.8 7 80 sz, nz9f10vst5g t** 9.77 10.21 5 30 60 0.5 0.1 7 4.5 8 80 sz, nz9f11vst5g v** 10.76 11.22 5 30 60 0.5 0.1 8 5.4 9 80 sz, nz9f12vst5g y** 11.74 12.24 5 30 80 0.5 0.1 9 6 10 80 sz, nz9f13vst5g 2** 12.91 13.49 5 37 80 0.5 0.1 10 7 11 75 sz, nz9f15vst5g 3** 14.34 14.98 5 42 80 0.5 0.1 11 9.2 13 70 sz, nz9f16vst5g 4** 15.85 16.51 5 50 80 0.5 0.1 12 10.4 14 65 sz, nz9f18vst5g 5** 17.56 18.35 5 50 80 0.5 0.1 14 12.4 16 60 *rotated 90 . **rotated 180 . ***sz prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable.
nz9f2v4st5g, sznz9f2v4st5g series http://onsemi.com 4 package dimensions sod?923 case 514ab issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. dim min nom max millimeters a 0.34 0.37 0.40 b 0.15 0.20 0.25 c 0.07 0.12 0.17 d 0.75 0.80 0.85 e 0.55 0.60 0.65 0.95 1.00 1.05 l 0.19 ref h e 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041 0.007 ref min nom max inches d e c a ?y? ?x? 2 1 dimensions: millimeters *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* see application note and8455/d for more mounting details 1.20 2x 0.25 2x 0.36 package outline b 2x 0.08 xy top view h e side view 2x bottom view l2 l 2x l2 0.05 0.10 0.15 0.002 0.004 0.006 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nz9f2v4s/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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