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doc. no : qw0905-LG-192HIRR-M3-CT rev : a date : 03 - mar. - 2016 data sheet LG-192HIRR-M3-CT led smd ligitek electronics co.,ltd. property of ligitek only lead-free part s pb l dcc
part no. LG-192HIRR-M3-CT part no LG-192HIRR-M3-CT device selection guide: gaalas material emitted infrared color lens water clear ! ligitek electronics co.,ltd. property of ligitek only page 1/11 features: 1. package in 8.0mm carrier t ape on 7" diameter reel. 2. compatible with automatic placement equipment. 3. compatible with reflow solder process. descriptions: 1. the lg-192 smd taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtai ned. 2. besides, lightweight makes them ideal for miniature applications. etc. applications: 1. pcb mounted infrared sensor 2. infrared emitting for miniature light barrier 3. floppy disk drive 4. optoelectronic switch 5. smoke detector
0.3 resin 1.6 0.4 led dice note : 1.all dimension are in millimeter tolerance is 0.1mm unless otherwise noted. 2.specifications are subject to change without notice. recommended soldering pad dimensions note : the tolerances unless mentioned is 0.1mm,angle 0.5. unit=mm. 0.8 0.7 0.8 0.8 1.0 0.3 1.0 pcb soldering terminal 0.6 package dimensions ! ligitek electronics co.,ltd. property of ligitek only anode mark 0.8 0.2 anode mark page 2/11 part no. LG-192HIRR-M3-CT
typical electrical & optical characteristics (ta=25 ) electrostatic discharge esd v ! ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 page 3/11 part no. LG-192HIRR-M3-CT led junction temperature thermal resistance tj r th j-c k/w parameter symbol ratings unit operating temperature storage temperature forward current reverse voltage t opr tstg vr i f -40 ~ +85 -40 ~ +85 5 50 v ma power dissipation peak forward current (300pps,10 s pulse) i fp pd 80 1 a mw viewing angle 2 1/2 reverse current radiant intensity vf ir po peak 1.4 130 deg nm 30 1.6 1.2 100 v a 855 2.0 nm mw/sr if=20ma if=20ma vr=5v if=20ma if=20ma parameter symbol min. test condition typ. max. unit peak emission wavelength spectral line half width forward voltage note : 1.the radiant intensity data did not including 15% testing tolerance. 2. chip use es-sasfpn14 ---- ---- ---- ---- ---- ---- ---- ---- ---- ---- 2000 115 430 if=20ma
! ligitek electronics co.,ltd. property of ligitek only part no. LG-192HIRR-M3-CT page 4/11 luminous intensity classification bin code min. max. po(mw/sr) at 20ma l 1.4 1.8 m 1.8 2.4 n2.4 3.2 p 3.2 4.2
typical electro-optical characteristics curve ! ligitek electronics co.,ltd. property of ligitek only part no. LG-192HIRR-M3-CT page 5/11 fig.3 relative radiant power vs. forward dc current fig.5 forward dc voltage vs. temperature i fdc [ma] forward dc voltage normalize @20ma, 25 ambient temperature [] relative radiant power normalize @20ma fig.4 relative radiant power i fpk [ma] relative radiant power normalize @100 ma forward voltage[v] fig.1 forward current vs. rorward voltage forward current[ma] wavelength[nm] fig.2 relative radiant power vs. wavelength relative radiant power normalize @20ma hirr chip 0.0 1.0 2.0 3.0 4.0 0.1 1 10 100 1000 10 0.1 1 0.1 -40 0.8 -40 0.0 relative radiant power normalize @ 20ma, 25 ambient temperature[ ] fig.6 relative radiant power vs. temperature vs. forward peak current 1.0 10.0 10 100 100 1000 1.0 10.0 0.9 1.0 1.1 1.2 -20 0 20 40 60 80 100 -20 0 40 20 60 100 80 0.5 1.0 1.5 2.0 2.5 3.0 0.5 0.0 800 1.0 850 900 950
label label aluminum moist-proff bag LG-192HIRR-M3-CT part no. 8.0mm tape,7"reel description packing specifications ? note : the tolerances unless mentioned is 0.1mm,angle 0.5. unit=mm. 4000 devices quantity/reel ! ligitek electronics co.,ltd. property of ligitek only carrier type dimensions page 6/11 part no. LG-192HIRR-M3-CT 0.6 1.75 0.23 8.0 0.3 5.4 3.5 0.2 2.0 polarity 0.9 4.0 0.2 1.75 4.0 0.2 1.5 0.6 1.75 0.23
bin : luminous intensity hue : peak wavelength vf : forward voltage label explanation reel dimensions 6.0 1.0 9.0 1.0 12.0 1.0 178 1.5 13.5 1.0 0.4 0.8 0.6 0.2 0.2 0.6 0.8 0.4 2.0 0.5 ! ligitek electronics co.,ltd. property of ligitek only page 7/11 part no. LG-192HIRR-M3-CT ligitek electronics co., ltd. ! wg;2/2.2/7 !cjo0ivf! ; !n !ruz)qdt*; !mpu!; !qbsu!; pb ! mh.2:3ijss.n4.du ! ht22681279 ! 5111
box explanation 1. 5 bag / inner box 2. inner box size : l x w x h 23cm x 8.5cm x 26cm h l w ! ligitek electronics co.,ltd. property of ligitek only page 8/11 part no. LG-192HIRR-M3-CT 3. 10 inner boxes / carton 4. carton size : l x w x h 58cm x 34cm x 35cm l w h
! ligitek electronics co.,ltd. property of ligitek only recommended soldering conditions page 9/11 part no. LG-192HIRR-M3-CT 1. hand solder basic spec is 280 3 sec one time only. Q 3.after soldering,do not warp the circuit board. note: 1.reflow soldering should not be done more than two times. 2.when soldering,do not put stress on the leds during heating. 120 sec.max. preheat 180~200c 2 pb-free reflow solder 1~5c/sec 260c max. 10sec.max above 220c 60 sec.max. 1~5c/sec 6c/sec
esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. circuit model a led circuit model b led drive method: led is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. ! ligitek electronics co.,ltd. property of ligitek only page 10/11 part no. LG-192HIRR-M3-CT precautions for use: storage time: 1. calculated shelf life before opening is 18 months at < 30c and < 90% relative humidity (rh) 2. after bag is opened, devices which will be subjected to reflow soldering or other high temperature processes must be a) assemblied within one years in an environment of Q 30c / 60% rh, or b) stored at ambient of 10% rh or less 3. devices are required baking before assembly if: a) humidity indicator card reads >10% (for level 2a -5a) or >60% (for level 2) at ambient temperature 23 5c b) 2.a) or 2.b) doesn't meet 4. if baking is required, devices should be baked for >24 hours at 605c.performing baking only once, and using the baked devices within 72 hours..
! ligitek electronics co.,ltd. property of ligitek only reliability test: page 11/11 part no. LG-192HIRR-M3-CT environmental test 1.t=260c max. 10sec.max. 2. 6 min ir reflow 1.100c5c ~ -40c5c 30mins / 5mins / 30mins 2.100 cyeles temperature cycling endurance test classification 1.ta=85c 2.rh=85% 3.t=1000hrs(-24hrs,+72hrs) 1.ta=-40c5c 2.t=1000 hrs (-24hrs,+72hrs) 1.ta=100c5c ~ -40c5c 20min/ 10sec / 20min 2.total 100 cycles high temperature high humidity storage test thermal shock test low temperature storage test 1.ta=100c5c 2.t=1000 hrs (-24hrs,+72hrs) 1.ta=25c 2.if=20ma 3.t=1000 hrs (-24hrs,+72hrs) high temperature storage test test item operating life test test condition sample size 22 22 22 22 22 22 22

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