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datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. rrr040p03 pch -30v -4a power mosfet outline v dss 30v r ds(on) (max.) 45m i d 4a p d 1w features inner circuit 1) low on - resistance. 2) built-in g-s protection diode. 3) small surface mount package (tsmt3). 4) pb-free lead plating ; rohs compliant packaging specifications type packaging taping application reel size (mm) 180 dc/dc converters tape width (mm) 8 basic ordering unit (pcs) 3,000 drain - source voltage v dss 30 v taping code tl marking ug absolute maximum ratings (t a = 25c) parameter symbol value unit continuous drain current i d *1 4 a pulsed drain current i d,pulse *2 16 a power dissipation gate - source voltage v gss 20 v p d *3 1.0 w p d *4 0.54 w junction temperature t j 150 c range of storage temperature t stg 55 to 150 c (1) (2) (3) tsmt3 ate sore 3 rain ? 1 esd protection diode ? 2012.05 - rev.b 2016.06 - rev.b fra 5) aec-q101 qualified
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 *1 limited only by maximum temperature allowed. *2 pw 10 s, duty cycle 1% *3 mounted on a ceramic boad (30300.8mm) *4 mounted on a fr4 (12200.8mm) thermal resistance parameter symbol values unit min. typ. max. thermal resistance, junction - ambient r thja *4 - - 231 c/w thermal resistance, junction - ambient r thja *3 - - 125 c/w electrical characteristics (t a = 25c) parameter symbol conditions values unit min. typ. max. v breakdown voltage temperature coefficient v (br)dss t j i d = 1ma referenced to 25c - 25 - mv/c drain - source breakdown voltage v (br)dss v gs = 0v, i d = 1ma 30 - - a gate - source leakage current i gss v gs = 20v, v ds = 0v - - 10 a zero gate voltage drain current i dss v ds = 30v, v gs = 0v - - 1 v gate threshold voltage temperature coefficient v (gs)th t j i d = 1ma referenced to 25c - 3.9 - mv/c gate threshold voltage v gs (th) v ds = 10v, i d = 1ma 1 - 2.5 static drain - source on - state resistance r ds(on) *5 v gs = 10v, i d = 4a - 32 45 - 47 66 m v gs = 4.5v, i d = 2a - 45 63 v gs = 4.0v, i d = 2a - 52 72 v gs = 10v, i d = 4a, t j =125c transconductance g fs *5 v ds = 10v, i d = 4a 2.7 7.2 - s gate input resistannce r g f = 1mhz, open drain - 13 - 2/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 *5 pulsed electrical characteristics (t a = 25c) parameter symbol conditions values unit min. typ. max. pf output capacitance c oss v ds = 10v - 150 - reverse transfer capacitance c rss f = 1mhz input capacitance c iss v gs = 0v - 1000 - - 130 - unit min. typ. max. turn - on delay time t d(on) *5 v dd c 15v, v gs = 10v - 15 - ns rise time t r *5 i d = 2a - 30 - turn - off delay time t d(off) *5 r l = 7.5 - 85 - fall time v dd c 15v, i d = 4a v gs = 10v v dd c 15v, i d = 4a v gs = 5v - 10.5 - total gate charge q g *5 - gate charge characteristics (t a = 25c) parameter symbol conditions values t f *5 r g = 10 - 45 max. - 3.0 - gate - drain charge q gd *5 - 3.3 - body diode electrical characteristics (source-drain)(t a = 25c) parameter symbol conditions values unit min. typ. nc v dd c 15v, i d = 4a v gs = 10v - 20 40 gate - source charge q gs *5 a forward voltage v sd *5 v gs = 0v, i s = 4a - - 1.2 v inverse diode continuous, forward current i s *1 t a = 25c - - 0.8 3/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves 0.1 1 10 100 1000 10000 0.0001 0.01 1 100 t a =25oc single pulse 0.01 0.1 1 10 100 0.1 1 10 100 p w = 100 s dc operation t a =25oc single pulse mounted on a ceramic board. (30mm ?b 30mm ?b 0.8mm) operation in this area is limited by r ds (on) (v gs = 10v) p w = 10ms p w = 1ms 0 20 40 60 80 100 120 050100150 200 fig.1 power dissipati on derating curve power dissipation : p d /p d max. [%] junction temperature : tj [ r c] fig.2 maximum safe operating area drain current : -i d [a] drain - source voltage : -v ds [v] fig.3 normalized transient thermal resistance vs. pulse width normalized transient thermal resistance : r (t) pulse width : p w [s] fig.4 single pulse maxmum power dissipation pulse width : p w [s] peak transient power : p(w) 0.001 0.01 0.1 1 10 0.0001 0.01 1 100 t a =25oc single pulse rth(ch -a)=62.5oc/w rth(ch -a)(t)=r(t) ?b rth(ch-a) mounted on ceramic board. (30mm ?b 30mm ?b 0.8mm) top d=1 d=0.5 d=0.1 d=0.05 d=0.01 bottom signle 4/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves fig.5 typical output characteristics(i) drain current : -i d [a] drain - source voltage : -v ds [v] fig.6 typical output characteristics(ii) drain current : -i d [a] drain - source voltage : -v ds [v] 0 1 2 3 4 0 0.2 0.4 0.6 0.8 1 v gs = 2.5v t a =25oc pulsed v gs = 10v v gs = 4.5v v gs = 4.0v v gs = 2.8v 0 1 2 3 4 02468 10 v gs =-2.5v t a =25oc pulsed v gs = 2.5v v gs = 2.8v v gs = 10v v gs = 4.5v v gs = 4.0v v gs = 3.0v 5/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves 0 20 40 60 -50 0 50 100 150 v gs = 0v i d = 1ma pulsed 0 1 2 3 -50 050100 150 v ds = 10v i d = 1ma pulsed fig.7 breakdown voltage >>> vs. junction temperature drain - source breakdown voltage : -v (br)dss [v] junction temperature : t j [ r c ] fig.8 typical transfer characteristics gate - source voltage : -v gs [v] fig.9 gate threshold voltage vs. junction temperature gate threshold voltage : -v gs(th) [v] junction temperature : t j [ r c ] fig.10 transconductan ce vs. drain current transconductance : g fs [s] drain current : -i d [a] drain current : -i d [a] 0.001 0.01 0.1 1 10 100 0123 4 v ds = 10v pulsed t a = 125oc t a = 75oc t a = 25oc t a = 25oc 0.1 1 10 0.01 0.1 1 10 v ds = 10v pulsed t a = 25oc t a =25oc t a =75oc t a =125oc 6/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves fig.11 drain currentderating curve drain current dissipation : i d /i d max. (%) junction temperature : t j [oc] fig.13 static drain - source on - state resistance vs. drain current(i) static drain - sourc e on-state resistance : r ds(on) [m ] junction temperature : t j [oc] fig.14 static drain - source on - state resistance vs. j unction temperature static drain - sourc e on-state resistance : r ds(on) [m ] drain current : -i d [a] fig.12 static drain - source on - state resistance vs. gate source voltage static drain - sourc e on-state resistance : r ds(on) [m ] gate - source voltage : -v gs [v] 0 50 100 150 0510 15 t a =25oc pulsed i d = 4.0a i d = 2.0a 10 100 1000 0.1 1 10 t a =25oc pulsed v gs = 4.0v v gs = 4.5v v gs = 10v 0 0.2 0.4 0.6 0.8 1 1.2 -25 0 25 50 75 100 125 150 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 v gs = 10v i d = 4.0a pulsed 7/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves fig.16 static drain - source on - state resistance vs. drain current(iii) static drain - sourc e on-state resistance : r ds(on) [m ] drain current : -i d [a] fig.15 static drain - source on - state resistance vs. drain current(ii) static drain - sourc e on-state resistance : r ds(on) [m ] drain current : -i d [a] fig.17 static drain - source on - state resistance vs. drain current(iv) static drain - sourc e on-state resistance : r ds(on) [m ] drain current : -i d [a] 10 100 1000 0.1 1 10 v gs = 10v pulsed t a =125oc t a =75oc t a =25oc t a = 25oc 10 100 1000 0.1 1 10 v gs = 4.5v pulsed t a =125oc t a =75oc t a =25oc t a = 25oc 10 100 1000 0.1 1 10 v gs = 4.0v pulsed t a =125oc t a =75oc t a =25oc t a = 25oc 8/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 electrical characteristic curves fig.18 typical capacitance >>>>> vs. drain - source voltage capacitance : c [pf] drain - source voltage : -v ds [v] fig.20 dynamic input characteristics gate - source voltage : -v gs [v] total gate charge : q g [nc] fig.19 switching characteristics switching time : t [ns] drain current : -i d [a] fig.21 source current >>>>> vs. source drain voltage source current : -i s [a] source-drain voltage : -v sd [v] 10 100 1000 10000 0.01 0.1 1 10 100 t a =25oc f=1mhz v gs =0v ciss coss crss 1 10 100 1000 10000 0.01 0.1 1 10 t a =25oc v dd = 15v v gs = 10v r g =10 pulsed t f t d(on) t d(off) t r 0 2 4 6 8 0510 15 t a =25oc v dd = 15v i d = 4.0a r g =10 pulsed 0.01 0.1 1 10 0 0.5 1 1.5 v gs =0v pulsed t a =125oc t a =75oc t a =25oc t a = 25oc 9/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 measurement circuits fig.1-1 switching time measurement circuit fig.1-2 f switching waveforms fig.2-1 gate charg e measurement circuit fig.2-2 gate charge waveform 10/11 2012.05 - rev.b fra 2016.06 - rev.b
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. data sheet rrr040p03 dimensions (unit : mm) dimension in mm/inches tsmt3 patterm of terminal position areas >e >? >? >?? >?>y >>? ? > >>y >>t >? > ?>t ?>y >y ? ?>y >? ? ? ?$ >? > >>?> >>? >>?> >>? > > >y>>> > >>>>?>? >>y >>>> >>>y> > >>>>> >>t >>>?> >>>?> >>>>? >>>>?>? >>? ? >>>?> >>>> >>>>y> >>>>t ? >>>y> >>>t>a >>>>> >>>>y >e >t>>?> >?>>> >>>y>y >>>y>y>? >? >y>>> >y>>?> >>>>>? >>>>?>y ? >? >? >t>>a> >?>>> >>>y>>t >>>y>y>? >?>y >>>?> >>>a> >>>>y>t >>>>t> >?? >>>> >>>?> >>>>y>a >>>>t>? >y >>>> >>>t> >>>>>t >>>>y ?$ > >>>t> > >>>>>? >>?> >>? >>?> >>? ?>y ?>t >>>?> > >>>>t>? ?>y > >>>?> > >>>>?> >>>t> >>>>y >e>?> >>?>?>?>>??>?>t>? >?>>?>?>?>? >t>>y> >>>>? >e>?> >>?>?>?>>??>?>t>? >?>>?>?>?>? >>>?> >>>> 11/11 2012.05 - rev.b fra 2016.06 - rev.b
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet part number RRR040P03FRA package tsmt3 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes RRR040P03FRA - web page

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