? semiconductor components industries, llc, 2014 february, 2014 ? rev. 3 1 publication order number: mbr140esf/d mbr140esf, nrvb140esf surface mount schottky power rectifier plastic sod ? 123 package this device uses the schottky barrier principle with a large area metal ? to ? silicon power diode. ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. this package also provides an easy to work with alternative to leadless 34 package style. because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, pdas and pcmcia cards. typical applications are ac ? dc and dc ? dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? guardring for stress protection ? low reverse leakage ? 175 c operating junction temperature ? epoxy meets ul 94 v ? 0 @ 0.125 in ? package designed for optimal automated board assembly ? esd rating: ? human body model = 3b ? machine model = m4 ? nrvb prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? these devices are pb ? free and are rohs compliant* mechanical characteristics ? device marking: e4f ? polarity designator: cathode band ? weight: 11.7 mg (approximately) ? case: epoxy, molded ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information sod ? 123fl case 498 schottky barrier rectifier 1.0 amperes 40 volts http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. marking diagram e4f = specific device code m = date code = pb ? free package) e4fm mbr140esft3g sod ? 123fl (pb ? free) 10,000 / tape & reel *** MBR140ESFT1G sod ? 123fl (pb ? free) 3,000 / tape & reel ** (note: microdot may be in either location) ** 8 mm tape, 7? reel *** 8 mm tape, 13? reel nrvb140esft3g sod ? 123fl (pb ? free) 10,000 / tape & reel *** nrvb140esft1g sod ? 123fl (pb ? free) 3,000 / tape & reel **
mbr140esf, nrvb140esf http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 40 v average rectified forward current i o 1.0 a peak repetitive forward current i frm 2.0 a non ? repetitive peak surge current (non ? repetitive peak surge current, halfwave, single phase, 60 hz) i fsm 30 a storage temperature t stg ? 55 to 175 c operating junction temperature t j ? 55 to 175 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? lead (note 1) thermal resistance, junction ? to ? lead (note 2) thermal resistance, junction ? to ? ambient (note 1) thermal resistance, junction ? to ? ambient (note 2) r tjl r tjl r tja r tja 26 21 325 82 c/w 1. mounted with minimum recommended pad size, pc board fr4. 2. mounted with 1 in. copper pad (cu area 700 mm 2 ). electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 3) v f t j = 25 c v (i f = 1.0 a) 0.56 maximum instantaneous reverse current (note 3) i r t j = 25 c a (v r = 40 v) 30 3. pulse test: pulse width 250 s, duty cycle 2%.
mbr140esf, nrvb140esf http://onsemi.com 3 typical characteristics figure 1. typical instantaneous forward characteristics i f , instantaneous forward current (a) v f , instantaneous forward voltage (v) t a = 150 c t a = 25 c t a = 125 c 0.10 1.0 10.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t a = 85 c 0.10 1.0 10.0 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.0 figure 2. maximum instantaneous forward characteristics i f , instantaneous forward current (a) v f , instantaneous forward voltage (v) t a = 150 c t a = 25 c t a = 125 c t a = 85 c figure 3. typical reverse characteristics 1.e ? 03 v r , instantaneous reverse voltage (v) i r , instantaneous reverse current (ma) t a = 150 c t a = 25 c t a = 125 c 1.e ? 04 1.e ? 05 1.e ? 06 1.e ? 07 t a = 85 c figure 4. maximum reverse characteristics 1.e ? 03 0 5 10 15 20 25 30 35 40 v r , instantaneous reverse voltage (v) i r , instantaneous reverse current (ma) 1.e ? 04 1.e ? 05 1.e ? 06 1.e ? 02 t a = 150 c t a = 25 c t a = 125 c t a = 85 c 0 5 10 15 20 25 30 35 40 1.e ? 01 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 0 20 40 60 80 100 120 140 10 100 110 figure 5. typical junction capacitance v r , reverse voltage (v) c, junction capacitance (pf) t j = 25 c figure 6. current derating, case t c , case temperature ( c) square wave dc r ja = 82 c/w i f(av) , average forward current (a)
mbr140esf, nrvb140esf http://onsemi.com 4 typical characteristics 0 1 2 3 4 5 6 7 8 9 10 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 figure 7. forward power dissipation i f(av) , average forward current (a) p f(av) , average forward pow- er dissipation (w) square wave dc t a = 150 c i pk /i av = 5 i pk /i av = 10 i pk /i av = 20 r(t), transient thermal resistance figure 8. thermal response 1000 0.1 0.00001 t 1 , time (sec) 1000 1 0.0001 0.001 0.01 1 10 100 0.000001 0.1 10 100 p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 ja = 321.8 c/w test type > min pad < die size 38x38 @ 75% mils d = 0.5 single pulse 0.2 0.1 0.05 0.01
mbr140esf, nrvb140esf http://onsemi.com 5 package dimensions sod ? 123fl case 498 issue d notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold flash. 4. dimensions d and j are to be measured on flat section of the lead: between 0.10 and 0.25 mm from the lead tip. d e b a a1 l c polarity indicator optional as needed *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 0.90 0.95 0.98 0.035 inches a1 0.00 0.05 0.10 0.000 b 0.70 0.90 1.10 0.028 c 0.10 0.15 0.20 0.004 d 1.50 1.65 1.80 0.059 e 2.50 2.70 2.90 0.098 l 0.55 0.75 0.95 0.022 0.037 0.039 0.002 0.004 0.035 0.043 0.006 0.008 0.065 0.071 0.106 0.114 0.030 0.037 nom max 3.40 3.60 3.80 0.134 0.142 0.150 h e ? ? 0 8 0 8 top view bottom view side view h e 2x 2x end view recommended dimensions: millimeters 1.25 2x 4.20 1.22 2x 12 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbr140esf/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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