1. 2. 3. material content data sheet sales product name ipg20n06s4l-14a issued 29. august 2013 ma# MA001096388 package pg-tdson-8-10 weight* 99.49 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.690 2.70 2.70 27039 27039 leadframe non noble metal iron 7439-89-6 0.046 0.05 467 inorganic material phosphorus 7723-14-0 0.014 0.01 140 non noble metal copper 7440-50-8 46.380 46.61 46.67 466176 466783 wire non noble metal aluminium 7429-90-5 0.723 0.73 0.73 7267 7267 encapsulation organic material carbon black 1333-86-4 0.089 0.09 891 plastics epoxy resin - 6.293 6.33 63251 inorganic material silicondioxide 60676-86-0 37.935 38.13 44.55 381290 445432 leadfinish non noble metal tin 7440-31-5 1.396 1.40 1.40 14036 14036 plating inorganic material phosphorus 7723-14-0 0.001 0.00 14 non noble metal nickel 7440-02-0 0.603 0.61 0.61 6062 6076 solder non noble metal tin 7440-31-5 0.066 0.07 667 noble metal silver 7440-22-4 0.083 0.08 834 non noble metal lead 7439-92-1 3.170 3.19 3.34 31866 33367 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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