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1/27 www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v ds interface ics 56bit l v ds t r ansmitter 56:8 serializer BU7988KVT desc ri ptio n lvds interface ic of rohm "serializer" "deserializer" oper ate from 8mhz to 150mhz wide clock range, and number of bits range is from 35 to 70. data is transmitted seven times (7 x) stream and reduce cable num ber by 3(1/3) or less. the rohm's lvds has low swing mode to be able to expect further low emi. f e atu r es 1) wide dot clock range : single(112mhz)/ dual(224mhz)(ntsc, vga, svga, wxga uxga) 2) support spread spectrum clock generator. 3) clock edge selectable. 4) support reduced swing lvds for low emi. 5) power down mode. 6) package tqfp100v a p p lic ati o n s flat plane display p r ec a u t i o n this chip is not designed to protect from radioactivity. no.12057eat05 downloaded from: http:///
technical note 2/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. b l oc k di ag ram z _ z _ z fig.1 block diagram downloaded from: http:///
technical note 3/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. tqf p 1 0 0 v p a ck ag e outl in e a n d s p ecifi c at io n fig.2 tqfp100v package outline and specification product no. downloaded from: http:///
technical note 4/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. p in c onf ig urat io n fig.3 pin diagram (top view) i vi v v v v v v v v v v v v _ v downloaded from: http:///
technical note 5/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. p i n desc ri ptio n table 1 : pin description pi n na me pi n no . ty p e descr ipt i ons ta1p, ta1n 48, 49 lvds out lvds data out tb1p, tb1n 46, 47 lvds out tc1p, tc1n 43, 44 lvds out td1p, td1n 39, 40 lvds out tclk1p, tclk1n 41, 42 lvds out lvds clock out ta2p, ta2n 36, 37 lvds out lvds data out tb2p, tb2n 34, 35 lvds out tc2p tc2n 31, 32 lvds out td2p, td2n 27, 28 lvds out tclk2p, tclk2n 29, 30 lvds out lvds clock out r17 r10 60, 59, 58, 57, 54, 53, 52, 51 in 1 pixel data input. g17 g10 68, 67, 66, 65, 64, 63, 62, 61 in b17 b10 78, 77, 76, 75, 74, 73, 70, 69 in r27 r20 86, 85, 84, 83, 82, 81, 80, 79 in 2 pixel data inputs. g27 g20 96, 95, 94, 93, 92, 91, 90, 89 in b27 b20 6, 5, 2, 1, 100, 99, 98, 97 in de 9 in data-enable input. vsync 8 in vsync input. hsync 7 in hsync input. clkin 10 in clock input. map 14 in lvds mapping table select. see table11-14 and figure11-14. xrst 19 in h : normal operation, l : power down (all outputs are hi-z) flip 21 in lvds output pin select. see table10. downloaded from: http:///
technical note 6/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. pin name pin no. type descriptions rs 12 in lvds swing mode, rs select. rs lvds swing vdd 350mv gnd 200mv mode1, mode0 15, 16 in pixel data mode mode1 mode0 mode l l dual-in/dual-out l h dual-in/single-out h l single-in/dual-out h h single-in/single-out sel_bit 18 in 6bit/8bit color select. h:6bit (tdxp/n *1 are hi-z), l 8bit. oe 17 in outputs enable. h:outputs enable, l:output disable (all outputs are hi-z) rf 11 in input clock triggering select h : rising edge, l : falling edge n/c 22 must be open reserved1 20 in must be tied to gnd reserved0 13 in must be open vdd 3, 55, 71, 87 power power supply pins for cmos inputs, output and digital circuitry. gnd 4, 56, 72, 88 ground ground pins for cmos inputs, outputs and digital circuitry. lvds vdd 33, 45 power power supply pins for lvds outputs. lvds gnd 26, 38, 50 ground ground pins for lvds outputs. pll vdd 24 power power supply for pll circuitry. pll gnd 23, 25 ground ground pin for pll circuitry. *1: x=1,2 downloaded from: http:///
technical note 7/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. e l ectr ic al c h a r act e rist ics rating table 2 : absolute maximum rating parameter symbol rating units min max supply voltage vdd -0.3 4.0 v input voltage vin -0.3 vdd+0.3 v output voltage vout -0.3 vdd+0.3 v storage temperature range tstg -55 125 table 3 : package power package power dissipation (mw) de-rating (mw/ ) *1 tqfp100v 900 9.0 1400 *2 14.0 *2 *1: at temperature ta >25 *2: package power when mounting on the pcb board. the size of pcb board :70 70 1.6(mm 3 ) the material of pcb board : the fr4 glass epoxy board.(3% or less copper foil area) (it is recommended to apply the above package power requirement to pcb board when the small swing input mode is used) table 4 : recommended operating conditions parameter symbol rating units conditions min typ max supply voltage v dd 3.0 3.3 3.6 v vdd,lvdsvdd,pllvdd operating temperature range topr -20 - 85 clock frequency from 8mhz up to 90mhz 0 - 70 clock frequency from 90mhz up to 112mhz downloaded from: http:///
technical note 8/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. dc characteristics table 5 : cmos dc specifications(vdd=3.0v 3.6v, ta=-20 +85 ) parameter symbol limits units conditions min typ max high level input voltage v ih vdd 0.8 - vdd v low level input voltage v il gnd - vdd 0.2 v input leak current i inc -10 - +10 a 0v v in vdd table 6 : lvds transmitter dc specifications(vdd=3.0v 3.6v, ta=-20 +85 ) parameter symbol limits units conditions min typ max differential output voltage vod 250 350 450 mv rl=100 normal swing rs=vdd 120 200 300 mv reduced swing rs=gnd change in vod between complementary output states vod - - 35 mv rl=100 common mode voltage voc 1.125 1.25 1.375 v change in voc between complementary output states voc - - 35 mv output short circuit current i os - - -24 ma v out =0v, rl=100 output tri-state current i oz -10 - +10 a xrst=0v, v out =0v to vdd downloaded from: http:///
technical note 9/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. supply current table 7 : supply current (vdd=3.3v, ta=25 ,rl=100 ,cl=15pf) parameter symbol rating units conditions min typ max transmitter supply current (gray scale pattern) i tccg - 98 - ma rs=h mode[1:0]=l l clkin = 112mhz - 70 - mode[1:0]=l h clkin = 56mhz - 87 - mode[1:0]=h l clkin = 150mhz - 62 - mode[1:0]=h h clkin = 112mhz - 76 - ma rs=l mode[1:0]=l l clkin = 112mhz - 57 - mode[1:0]=l h clkin = 56mhz - 67 - mode[1:0]=h l clkin = 150mhz - 49 - mode[1:0]=h h clkin = 112mhz transmitter supply current (worst case pattern) i tccw - 101 - ma rs=h mode[1:0]=l l clkin = 112mhz - 87 - mode[1:0]=l h clkin = 56mhz - 91 - mode[1:0]=h l clkin = 150mhz - 65 - mode[1:0]=h h clkin = 112mhz - 79 - ma rs=l mode[1:0]=l l clkin = 112mhz - 63 - mode[1:0]=l h clkin = 56mhz - 68 - mode[1:0]=h l clkin = 150mhz - 55 - mode[1:0]=h h clkin = 112mhz transmitter power down supply current i tccs - - 10 a xrst=l downloaded from: http:///
technical note 10/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. gray scale pattern fig.4 gray scale pattern worst case pattern (maxi mum power condition) fig.5 worst case pattern _ = clk_in rx0/gx0/bx0 rx1/gx1/bx1 rx2/gx2/bx2 rx3/gx3/bx3 rx4/gx4/bx4 rx5/gx5/bx5 rx6/gx6/bx6 rx7/gx7/bx7 x=1.2 downloaded from: http:///
technical note 11/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. ac characteristics table 8 : switching characteristics (vdd=3.3v, ta=25 ) parameter symbol min typ max units clk in transition time t tcit - - 5.0 ns clk in period dual in /dual out t tcp 8.9 - 125.0 ns dual in / single out 17.8 - 62.5 single in / dual out 6.7 - 250.0 single in / single out 8.9 125.0 clk in high time t tch 0.35t tcp 0.5t tcp 0.65t tcp ns clk in low time t tcl 0.35t tcp 0.5t tcp 0.65t tcp ns clk in to tclk+/-delay dual in /dual out single in/single out t tcd - tbd - ns dual in / single out - tbd - single in / dual out - tbd - cmos data setup to clk in t ts 2.5 - - ns cmos data hold from clk in t th 0 - - ns clk out period dual in /dual out t tcop 8.9 - 125.0 dual in / single out 8.9 - 125.0 single in / dual out 13.3 - 125.0 single in / single out 8.9 125.0 lvds transition time t lvt - 0.6 1.5 ns output data position 0 t top1 -0.2 0.0 +0.2 ns output data position 1 t top0 -0.2 +0.2 ns output data position 2 t top6 2 -0.2 2 2 +0.2 ns output data position 3 t top5 3 -0.2 3 3 +0.2 ns output data position 4 t top4 4 -0.2 4 4 +0.2 ns output data position 5 t top3 5 -0.2 5 5 +0.2 ns output data position 6 t top2 6 -0.2 6 6 +0.2 ns skew time between tclkxp and tclkyp t ck12 - - 0.5 ns phase lock loop set time t tpll - - 10.0 ms downloaded from: http:///
technical note 12/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. a c t i mi ng ac timing diagrams fig.6 ac timing diagrams lvds output lvcmos input lvcmos input 90% 10% 90% 10% t tcit t tcit clk in tap tan 5pf 100o vdiff=(tap)-(tan) lvds output load 80% 20% 80% 20% t lvt t lvt v diff t tch t tcp vdd/2 vdd/2 vdd/2 rf=l rf=h t tch t tcp t th vdd/2 vdd/2 t tcd voc clkin rxn/gxn/ bxn hsync, vsync,de tclk1/2p tclk1/2n x=1, 2 y=0-7 downloaded from: http:///
technical note 13/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. ac timing diagrams fig.7 ac timing diagrams phase lock loop set time fig.8 phase lock loop set time tyx6 tyx5 tyx4 tyx3 tyx2 tyx1 tyx0 tyx6 tyx5 tyx4 tyx3 tyx2 tyx1 t top2 t top3 t top4 t top5 t top6 t top0 t top1 t ck12 vdiff = 0v t tcop vdiff = 0v vdiff = 0v vdiff = 0v t yx +/- tclk1+ tclk1p+ tclk2p+ note: vdiff = (t yx +) C (t yx -), (tclk1p) C (tclk1n) v dd /2 3.0v t tpll 3.6v xrst vdd clkin v diff =0v tclkp/n downloaded from: http:///
technical note 14/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. pix e l map t able fo r du al li n k table 9 : pixel map table for dual link 1st pixel dat a 2 n d pi xel dat a tft panel data BU7988KVT input tft panel data BU7988KVT input 24bit 18bit 24bit 18bit lsb r10 - r10 lsb r20 - r20 r11 - r11 r21 - r21 r12 r10 r12 r22 r20 r22 r13 r11 r13 r23 r21 r23 r14 r12 r14 r24 r22 r24 r15 r13 r15 r25 r23 r25 r16 r14 r16 r26 r24 r26 msb r17 r15 r17 msb r27 r25 r27 lsb g10 - g10 lsb g20 - g20 g11 - g11 g21 - g21 g12 g10 g12 g22 g20 g22 g13 g11 g13 g23 g21 g23 g14 g12 g14 g24 g22 g24 g15 g13 g15 g25 g23 g25 g16 g14 g16 g26 g24 g26 msb g17 g15 g17 msb g27 g25 g27 lsb b10 - b10 lsb b20 - b20 b11 - b11 b21 - b21 b12 b10 b12 b22 b20 b22 b13 b11 b13 b23 b21 b23 b14 b12 b14 b24 b22 b24 b15 b13 b15 b25 b23 b25 b16 b14 b16 b26 b24 b26 msb b17 b15 b17 msb b27 b25 b27 downloaded from: http:///
technical note 15/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v ds data out put t a b l e for f u ncti on of fli p p i n table 10 : lvds data output pin name pin no output pin names flip=l flip=h 49 ta1n td2p 48 ta1p td2n 47 tb1n tclk2p 46 tb1p tclk2n 44 tc1n tc2p 43 tc1p tc2n 42 tclk1n tb2p 41 tclk1p tb2n 40 td1n ta2p 39 td1p ta2n 37 ta2n td1p 36 ta2p td1n 35 tb2n tclk1p 34 tb2p tclk1n 32 tc2n tc1p 31 tc2p tc1n 30 tclk2n tb1p 29 tclk2p tb1n 28 td2n ta1p 27 td2p ta1n downloaded from: http:///
technical note 16/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n put t i ming for dual link example : sxga+(1400 1050) fig.9 lvcmos data input timing for dual link l v cmos dat a i n put t i mi ng fo r si ng le li n k example : sxga+(1400 1050) fig.10 lvcmos data input timing for single link _ = # # # # # # # # # # # # # # # # al _ = # # # # # # # # # # al downloaded from: http:///
technical note 17/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v d s ou tpu t da t a mapp in g (du al li n k / si ngl e li nk) l v ds dat a o u tp ut l vcmos dat a input fig.11 lvds output data mapping data1n -1 data1n data1n +1 v dd gnd r1n,~ b1 nn=0~ 7 data2n -1 data2n data2n +1 v dd gnd r2n,~ b2n n=0~ 7 + + + + + + + v + l i l + + + + + + v + downloaded from: http:///
technical note 18/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n p u t s t i m i ng in du al li nk dual-in / dual-out mode (mode<1:0>=ll , flip=l) table 11 : lvcmos data inputs timing diagrams in dual link 1st pixel data 2nd pixel data lvds output data (1st pixel data) map=h input pin name map=l input pin name lvds output data (2nd pixel data) map=h input pin name map=l input pin name ta10 r12 r10 ta20 r22 r20 ta11 r13 r11 ta21 r23 r21 ta12 r14 r12 ta22 r24 r22 ta13 r15 r13 ta23 r25 r23 ta14 r16 r14 ta24 r26 r24 ta15 r17 r15 ta25 r27 r25 ta16 g12 g10 ta26 g22 g20 tb10 g13 g11 tb20 g23 g21 tb11 g14 g12 tb21 g24 g22 tb12 g15 g13 tb22 g25 g23 tb13 g16 g14 tb23 g26 g24 tb14 g17 g15 tb24 g27 g25 tb15 b12 b10 tb25 b22 b20 tb16 b13 b11 tb26 b23 b21 tc10 b14 b12 tc20 b24 b22 tc11 b15 b13 tc21 b25 b23 tc12 b16 b14 tc22 b26 b24 tc13 b17 b15 tc23 b27 b25 tc14 hsync hsync tc24 hsync hsync tc15 vsync vsync tc25 vsync vsync tc16 de de tc26 de de td10 r10 r16 td20 r20 r26 td11 r11 r17 td21 r21 r27 td12 g10 g16 td22 g20 g26 td13 g11 g17 td23 g21 g27 td14 b10 b16 td24 b20 b26 td15 b11 b17 td25 b21 b27 td16 l l td26 l l downloaded from: http:///
technical note 19/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n p u t s t i m i ng di agr ams in d u al l i n k dual-in / dual-out mode (mode<1:0>=ll, flip=l, map=h) l v ds dat a o u tp ut l vcmos dat a input fig.12 lvcmos data inputs timing diagrams in dual link data1n -1 data1n data1n +1 v dd gnd r1n,~ b1 nn=0~ 7 data2n -1 data2n data2n +1 v dd gnd r2n,~ b2n n=0~ 7 + + v + l i l + + v + + + + + + + + + + downloaded from: http:///
technical note 20/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n p u t s t i m i ng in s i n g l e l i nk dual-in / single-out mode (mode<1:0>=lh, flip=l) table 12 : lvcmos data inputs timing diagrams in dual link lvds output data (1st pixel data) mapping mode1 (input pin name) mapping mode2 (input pin name) ta10 r12/r22 r10/r20 ta11 r13/r23 r11/r21 ta12 r14/r24 r12/r22 ta13 r15/r25 r13/r23 ta14 r16/r26 r14/r24 ta15 r17/r27 r15/r25 ta16 g12/g22 g10/g20 tb10 g13/g23 g11/g21 tb11 g14/g24 g12/g22 tb12 g15/g25 g13/g23 tb13 g16/g26 g14/g24 tb14 g17/g27 g15/g25 tb15 b12/b22 b10/b20 tb16 b13/b23 b11/b21 tc10 b14/b24 b12/b22 tc11 b15/b25 b13/b23 tc12 b16/b26 b14/b24 tc13 b17/b27 b15/b25 tc14 hsync hsync tc15 vsync vsync tc16 de de td10 r10/r20 r16/r26 td11 r11/r21 r17/r27 td12 g10/g20 g16/g26 td13 g11/g21 g17/g27 td14 b10/b20 b16/b26 td15 b11/b21 b17/b27 td16 l l downloaded from: http:///
technical note 21/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n p u t s t i m i ng di agr ams in s i n g l e l i nk dual-in / single-out mode (mode<1:0>=lh, flip=l, map=h) l v ds dat a o u tp ut l vcmos dat a input fig.13 lvcmos data inputs timing diagrams in single link data1n -1 data1n data1n +1 v dd gnd r1n,~ b1 nn=0~ 7 data2n -1 data2n data2n +1 v dd gnd r2n,~ b2n n=0~ 7 l il aa i l il aa v + + + + downloaded from: http:///
technical note 22/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n p u t s t i m i ng in s i n g l e l i nk single-in / dual-out mode (mode<1:0>=hh, flip=l) table 13 : lvcmos data inputs timing diagrams in single link 1st pixel data 2nd pixel data lvds output data (1st pixel data) map=h input pin name map=l input pin name lvds output data (1st pixel data) map=h input pin name map=l input pin name ta10 r12 r10 ta20 r12 +1 r10 +1 ta11 r13 r11 ta21 r13 +1 r11 +1 ta12 r14 r12 ta22 r14 +1 r12 +1 ta13 r15 r13 ta23 r15 +1 r13 +1 ta14 r16 r14 ta24 r16 +1 r14 +1 ta15 r17 r15 ta25 r17 +1 r15 +1 ta16 g12 g10 ta26 g12 +1 g10 +1 tb10 g13 g11 tb20 g13 +1 g11 +1 tb11 g14 g12 tb21 g14 +1 g12 +1 tb12 g15 g13 tb22 g15 +1 g13 +1 tb13 g16 g14 tb23 g16 +1 g14 +1 tb14 g17 g15 tb24 g17 +1 g15 +1 tb15 b12 b10 tb25 b12 +1 b10 +1 tb16 b13 b11 tb26 b13 +1 b11 +1 tc10 b14 b12 tc20 b14 +1 b12 +1 tc11 b15 b13 tc21 b15 +1 b13 +1 tc12 b16 b14 tc22 b16 +1 b14 +1 tc13 b17 b15 tc23 b17 +1 b15 +1 tc14 hsync hsync tc24 hsync +1 hsync +1 tc15 vsync vsync tc25 vsync +1 vsync +1 tc16 de de tc26 de +1 de +1 td10 r10 r16 td20 r10 +1 r16 +1 td11 r11 r17 td21 r11 +1 r17 +1 td12 g10 g16 td22 g10 +1 g16 +1 td13 g11 g17 td23 g11 +1 g17 +1 td14 b10 b16 td24 b10 +1 b16 +1 td15 b11 b17 td25 b11 +1 b17 +1 td16 l l td26 l l downloaded from: http:///
technical note 23/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n p u t s t i m i ng in du al li nk single-in / dual-out mode (mode<1:0>=hl, flip=l, map=h) lvds data output lvcmos data input fig.14 lvcmos data inputs timing in dual link data1n -2 data1n -1 data1n v dd g nd r1n, g 1n,b1n (n=0~ 7) data1n +1 data1n +2 data1n +3 + + v + l i l + + + + + + + + + + + + + + + + + v + + + + + + + + + + + + + + + + + + + + + + downloaded from: http:///
technical note 24/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n p u t s t i m i ng in s i n g l e l i nk single-in / single-out mode (mode<1:0>=hh, flip=l) table 14 : lvcmos data inputs timing diagrams in single link lvds output data (1st pixel data) map=h input pin name map=l input pin name ta10 r12 r10 ta11 r13 r11 ta12 r14 r12 ta13 r15 r13 ta14 r16 r14 ta15 r17 r15 ta16 g12 g10 tb10 g13 g11 tb11 g14 g12 tb12 g15 g13 tb13 g16 g14 tb14 g17 g15 tb15 b12 b10 tb16 b13 b11 tc10 b14 b12 tc11 b15 b13 tc12 b16 b14 tc13 b17 b15 tc14 hsync hsync tc15 vsync vsync tc16 de de td10 r10 r16 td11 r11 r17 td12 g10 g16 td13 g11 g17 td14 b10 b16 td15 b11 b17 td16 l l downloaded from: http:///
technical note 25/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. l v cmos dat a i n p u t s t i m i ng di agr ams in s i n g l e l i nk single-in / single-out mode (mode<1:0>=hh, flip=l, map=h) lvds data output lvcmos data input fig.15 lvcmos data inputs timing diagrams in single link data1n -1 data1n data1n +1 v dd gnd r1n,g1n,b1n (n=0~ 7) + + v + l i l + + + + downloaded from: http:///
technical note 26/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. about the pow e r on reset p o w e r on r e set is n o t ma ndat or y fo r this de vic e . ( t h e pd pi n sho u l d b e s e t to h i gh l e v e l w h e n po w e r on re set p r oc ed ur e is not use d .) fig.16 terminal connection when power on reset is not used however, power on reset procedure is strongly recommend for internal logic initialization by following two methods. the method of using cr circuit. the method of using external specific ic. it is recommend to do enough examination for target application. fig.17 power on reset by external a cr circuit fig.18 power on reset by specific xrst vdd BU7988KVT xrst 2.2f 220o 10ko v dd v dd td v t + v dd xrst internal reset schottky barrier diode be careful of temperature of the capacitor especially over and again. b characteristic ceramics and polymer aluminum are recommended. td is approximately equal to 20ms when the left rc coleus are applied. xrst 0.1f 220ko v dd v dd v dd power on ic (open drain output) vout gnd b characteristic ceramics td v t + v dd xrst internal reset detection voltage downloaded from: http:///
technical note 27/27 BU7988KVT www.rohm.com 201 1.12 - rev . a ? 2011 rohm co., ltd. all rights reserved. or der in g part n u mb er b u 7 9 8 8 k v t part no. part no. package kvt: tqfp100v packaging and forming specification none:tray (unit : mm) tqfp100v 0.1 75 51 50 26 25 1 76 100 14.0 0.2 16.0 0.3 14.0 0.2 16.0 0.3 0.5 0.5 0.1 0.1 1.0 0.1 1.2max. 0.125 0.1 0.2 0.1 ? order quantity needs to be multiple of the minimum quantity. tray (with dry pack) containerquantity direction of feed 500pcs direction of product is fixed in a tray 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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