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datasheet product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/19 tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com ac/dc drivers pwm type dc/dc converter ic included 650v mosfet bm2pxx3f series general the pwm type dc/dc converter (bm2pxx3f) for ac/dc provide an optimum syst em for all products that include an electrical outlet. bm2pxx3f supports both isolated and non-isolated devices, enabling simpler design of various types of low-power electrical converters. bm2pxx3f built in a hv starter circuit that tolerates 650v, it contributes to low-power consumption. with current detection resist ors as external devices, a higher degree of design freedom is achieved. since current mode control is utilized, curren t is restricted in each cycle and excellent performance is demonstrated in bandwidth and transient response. the switching frequency is 65 khz. at light load, the switching frequency is reduced and high efficiency is achieved. a frequency hopping function is also on chip, which contributes to low emi. we can design easily, because bm2pxx3f includes the switching mosfet. basic specifications ? operating power supply voltage range: vcc 8.9v to 26.0v drain 650v ? operating current: normal mode BM2P053F: 0.60ma (typ.) bm2p093f: 0.50ma (typ.) burst mode: 0.40ma (typ.) ? oscillation frequency: 65khz (typ.) ? operating temperature: - 40 o c to +105 o c ? mosfet on resistance: BM2P053F:4.0 ? (typ.) bm2p093f:8.5 ? (typ.) features ? pwm frequency : 65khz ? pwm current mode method ? burst operation when load is light ? frequency reduction function ? built-in 650v start circuit ? built-in 650v switching mosfet ? vcc pin under voltage protection ? vcc pin overvoltage protection ? source pin open protection ? source pin short protection ? source pin leading-edge-blanking function ? per-cycle over current protection circuit ? soft start ? secondary over current protection circuit package w (typ.) x d (typ.) x h (max.) sop8 5.00mm x 6.20mm x 1.71mm applications ac adapters and household appliances (vacuum cleaners, humidifiers, air cleaners, air conditioners, ih cooking heaters, rice cookers, etc.) line up application circuit figure 1 application circuit product mosfet on resistor BM2P053F 4.0 ? bm2p093f 8.5 ? downloaded from: http:///
2/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings ta=25 ? c parameter symbol rating unit conditions maximum applied voltage 1 v max1 -0.3 30 v vcc maximum applied voltage 2 v max2 -0.3 6.5 v source, fb maximum applied voltage 3 v max3 650 v drain drain current pulse i dp 2.60 a p w =10us, duty cycle=1% (BM2P053F) drain current pulse i dp 1.30 a p w =10us, duty cycle=1% (bm2p093f) allowable dissipation p d 563 mw operating temperature range t opr -40 +105 o c max junction temperature t jmax 150 o c storage temperature range t str -55 +150 o c ( note1) sop8 : when mounted (on 70 mm 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate). reduce to 4.563 mw/ ? c when ta = 25 ? c or above. operating conditions ta=25 ? c parameter symbol rating unit conditions power supply voltage range 1 v cc 8.9 26.0 v vcc pin voltage power supply voltage range 2 v drain 650 v drain pin voltage electrical characteristics of mosfet part (unless otherwise noted, ta = 25 ? c, vcc = 15 v) parameter symbol specifications unit conditions minimum standard maximum [mosfet block] between drain and source voltage v (br)dds 650 - - v i d =1ma / v gs =0v drain leak current i dss - - 100 ua v ds =650v / v gs =0v on resistance r ds(on) - 4.0 5.5 ? i d =0.25a / v gs =10v (BM2P053F) on resistance r ds(on) - 8.5 12.0 ? i d =0.25a / v gs =10v (bm2p093f) downloaded from: http:///
3/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise noted, ta = 25 ? c, vcc = 15 v) parameter symbol specifications unit conditions minimum standard maximum [circuit current] circuit current (on) 1 i on1 410 600 790 a BM2P053F, fb=2.0v (at pulse operation) circuit current (on) 1 i on1 350 500 650 a bm2p093f, fb=2.0v (at pulse operation) circuit current (on) 2 i on2 - 400 500 a fb=0.0v(at burst operation) [vcc protection function] vcc uvlo voltage 1 v uvlo1 12.50 13.50 14.50 v vcc rise vcc uvlo voltage 2 v uvlo2 7.50 8.20 8.90 v vcc drop vcc uvlo hysteresis v uvlo3 - 5.30 - v v uvlo3= v uvlo1- v uvlo2 vcc ovp voltage 1 v ovp1 26.0 27.5 29.0 v vcc rises latch released vcc voltage v latch - v uvlo2 -0.5 - v vcc recharge start voltage v chg1 7.70 8.70 9.70 v vcc recharge stop voltage v chg2 12.00 13.00 14.00 v latch mask time t latch 50 100 150 us thermal shut down temperature t sd 118 145 - ? c [pwm type dcdc driver block] oscillation frequency 1 f sw1 60 65 70 khz fb=2.00v oscillation frequency 2 f sw2 20 25 30 khz fb=0.40v frequency hopping width 1 f del1 - 4.0 - khz fb=2.0v hopping fluctuation frequency f ch 75 125 175 hz soft start time 1 t ss1 0.30 0.50 0.70 ms soft start time 2 t ss2 0.60 1.00 1.40 ms soft start time 3 t ss3 1.20 2.00 2.80 ms soft start time 4 t ss4 4.80 8.00 11.20 ms maximum duty d ma x 68.0 75.0 82.0 % fb pin pull-up resistance r fb 23 30 37 k ? fb / cs gain gain - 4.00 - v/v fb burst voltage v bst 0.300 0.400 0.500 v fb falls fb voltage of starting frequency reduction mode v dlt 1.100 1.250 1.400 v fb olp voltage 1a v folp1a 2.60 2.80 3.00 v overload is detected (fb rise) fb olp voltage 1b v folp1b - 2.60 - v overload is detected (fb drop) fb olp on timer t f olp1 40 64 88 ms fb olp start up timer t folp1b 26 32 38 ms fb olp off timer t folp2 358 512 666 ms [ove r current detection block] overcurrent detection voltage v cs 0.380 0.400 0.420 v ton=0us overcurrent detection voltage ss1 v cs_ss1 - 0.100 - v 0[ms] ~ tss1[ms] overcurrent detection voltage ss2 v cs_ss2 - 0.150 - v tss1 [ms] ~ tss2 [ms] overcurrent detection voltage ss3 v cs_ss3 - 0.200 - v tss2 [ms] ~ tss3[ms] overcurrent detection voltage ss4 v cs_ss4 - 0.300 - v tss3 [ms] ~ tss4 [ms] leading edge blanking time t leb - 250 - ns over current detection ac voltage compensation factor k cs 12 20 28 mv/us source pin short protection voltage v cssht 0.020 0.050 0.080 v [start circuit block] start current 1 i start1 0.100 0.500 1.000 ma vcc= 0v start current 2 i start2 1.000 3.000 6.000 ma vcc=10v off current i start3 - 10 20 ua inflow current from drain pin after uvlo released uvlo. when mosfet is off start current switching voltage v sc 0.800 1.500 2.100 v downloaded from: http:///
4/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 pin descriptions table 1 pin description no. pin name i/o function esd diode vcc 1 vcc i power supply input pin - 2 n.c. - - - - 3 n.c. - - - - 4 drain i/o mosfet drain pin - - 5 source i/o mosfet source pin 6 n.c. - - - - 7 gnd i/o gnd pin - 8 fb i feedback signal input pin - i/o equivalent circuit diagram figure 2. i/o equivale nt circuit diagram downloaded from: http:///
5/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 block diagram a a + a a + aa + + + aa a + + a + a a a a figure 3. block diagram downloaded from: http:///
6/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 description of blocks (1) start circuit (drian: 4pin) this ic built in start circuit (tolerates 650v). it enables to be low standby mode electricity and high speed starting. after starting, consumption power is idling current i start3 typ=10ua only. reference values of starting time are shown in figure-7. when c vcc =10uf it can start less than 0.1 sec. figure4. block diagram of start circuit figure 5. start current vs vcc voltage figure 6. start time (reference value) * start current flows from the drain pin ex) consumption power of start circuit only when the vac=100v pvh 100v* 2*10ua=1.41mw ex) consumption power of start circuit only when the vac=240v pvh 240v* 2*10ua=3.38mw 0.0 ? 0.1 ? 0.2 ? 0.3 ? 0.4 ? 0.5 ? 0.6 ? 0.7 ? 0.8 ? 0.9 ? 1.0 ? 0 5 10 15 20 25 30 35 40 45 50 r g [sec] cvcc ? [uf] + + a downloaded from: http:///
7/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (2) start sequences (soft start operation, light load operation, and auto recovery operation during overload protection) start sequences are shown in figure 7. see the sections below for detailed descriptions. vout switing vh vcc(1pin) fb(8pin) soft start 64ms iout normal load light load within 32ms vcc=8.2v over load internal ref pull up burst mode ab c d ef gh i switching stop vcc=13.5v fb olp on figure 7. start sequences timing chart a: input voltage vh is applied b: this ic starts operation when vcc pin vo ltage rises and vcc > vuvlo1 (13.5 v typ). switching function starts when other protection functions are judged as normal. un til the secondary output voltage becomes constant level, vcc voltage drops bec ause of the vcc consumption current. vcc recharge function start if vcc voltage < vchg1 8.7v typ c : with the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current. d: when the switching operation starts, vout rises. the output voltage become to stable state, vcc voltage also become to stable state through auxiliary winding. please set the rated voltage within the tfolp1b period (32ms typ) from vcc voltage > vuvlo1. e: during a light load, if it reaches fb voltage < vbst (= 0.4v typ), the ic starts burst operation to keep power consumption lo w. during burst operation, it becomes low-power consumption mode. f : when the fb voltage vfolp1a =2.8v typ , it becomes a overload operation. g: when fb pin voltage keeps vfolp1a (= 2.8v typ) at or a bove t folp (64ms typ), the overload protection function is triggered and switching stops 64ms later. if the fb pin voltage becomes fb 8/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (3) vcc pin protection function bm2pxx3f built in vcc low voltage protection function vccuvlo (under voltage lock out), over voltage protection function vcc ovp (over voltage protection) and vcc charge function that operates in case of dropping the vcc voltage.vcc uvlo and vcc ovp monitor vcc pin and prev ent vcc pin from destroying switching mosfet at abnormal voltage. vcc charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at dropping the vcc voltage. (3-1) vcc uvlo vcc ovp function vccuvlo is auto recovery protection. vccovp is latch protection. refer to the operation figure-8. vccovp built in mask time tlatch typ=100us .by this function, this ic masks pin generated surge etc. this function operates detection in case of continuing vcc pin voltage > vovp typ=27.5v figure 8. vcc uvlo / ovp timing chart a: drain voltage input, vcc pin voltage starts rising. b: vcc>vuvlo1, dc/dc operation starts c: vcc< v chg1 , vcc charge function operates and the vcc voltage rises. d: vcc > v chg2, vcc charge function is stopped. e: vcc > v ovp1, function is detected f: vcc > v ovp1, continues t latch (typ =100us), switching is stopped by the vccovp function. g: vh is open.vcc voltage is fall. h: same as c. i: same as d. j: vcc 9/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3-2 vcc charge function after vcc charge function operates once the vcc pin >vuvlo1 and the dc/ dc operation starts then the vcc pin voltage drops to vchg2, charge is stopped. the operations are shown in figure 9. a a a a a a figure 9. charge operatio n vcc pin charge operation a: drain pin voltage rises, charge starts to vcc pin by the vcc charge function. b: vcc > v uvlo1, vcc uvlo function releases, vcc charge func tion stops, dc/dc operation starts. c: when dc/dc operation starts, the vcc voltage drops. d: vcc < v chg1 , vcc recharge function operates and vcc pin voltage rises... e: vcc > v chg2 , vcc recharge function stops. f: vcc < v chg1, vcc recharge function operates and vcc pin voltage rises... g: vcc > v chg1 , vcc recharge function stops. h: after start of output voltage finished, vcc is charged by the auxiliary winding vcc pin stabilizes. downloaded from: http:///
10/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (4) dcdc driver (pwm comparator, frequency hopping, slope compensat ion, osc, burst) bm2pxx3f is current mode pwm control. an internal oscillator sets a fixed switching frequency (65khz typ). bm2pxx3f is integrated switching frequency hopping function which changes the switching frequency to fluctuate as shown in figure 10 below. the fluctuation cycle is 125 hz typ. [] figure 10. frequency hopping function max duty cycle is fixed as 75% (typ) and min pulse width is fixed as 400 ns (typ). with current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur. as a countermeasure to this, bm2pxx3f is built in slope compensation circuits. bm2pxx3f is built in burst mode circuit and frequency reducti on circuit to achieve lower power consumption, when the load is light. fb pin is pull up by r fb (30 k ? typ). fb pin voltage is changed by secondary output voltage (secondary load power). fb pin is monitored, burst mode op eration and frequency detection start. figure 12 shows the fb voltage, and switching frequency, dcdc operation ? mode1 : burst operation ? mode2: frequency reduction operation. ? mode3 : fixed frequency operation. (operate at the max frequency) ? mode4 : over load operation.(detect the over load state and stop the pulse operation) figure 11. switching operation state changes by fb pin voltage downloaded from: http:///
11/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (5) over current limiter bm2pxx3f is built in over current limiter per cycle. if the source pin exceeds a certain voltage, switching is stopped. it is also built in ac voltage compensation functi on. this is the function which compensates the maximum power as the ac voltage s change by increasing over current limiter with time. shown in figure-12, 13, and 14. figure 12. no ac voltage compensation function figure13. built-in ac compensation voltage primary peak current is decided as the formula below. primary peak current: i peak = v cs /rs + v dc / lp *t delay v cs over current limiter voltage internal ic, rs current detection resistance, v dc input dc voltage, l p primary inductance, t delay delay time after detection of over current limiter figure 14. over current limiter voltage 6 l.e.b period when the driver mosfet is turned on, surge current occurs at each capacitor component and drive current. therefore, because source pin voltage ri ses temporarily, the detection errors ma y occur in the over current limiter circuit. to prevent detection errors, drain is switched from high to low and the source signal is masked for 250 ns by the on-chip leb (leading edge blanking) function. downloaded from: http:///
12/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (7) source pin (5pin) s hort protection function when the source pin (5pin) is shorted, bm2pxx3f is over heat. bm2pxx3f built in short protection function to prevent destroying. (8) source pin (5pin) open protection if the source pin becomes open, bm2pxx3f may be damaged. to prevent to be damaged, bm2pxx3f built in open protection circuit auto recovery protection . (9) output over load protection function fb olp comparator the output overload protection function monitors the secondary output load status at the fb pin, and stops switching when an overload occurs. in case of an overload, the output voltage is reduced and current no longer flows to the photo coupler, so the fb pin voltage rises. when the fb pin voltage > v folp1a (2.8 v typ) continuously for the period t folp1 (64ms typ), it is judged as an overload and stops switching. when the fb pin > v folp1a (2.8 v typ), if the voltage goes lower than v folp1b (2.6v typ) during the period t folp1 (64ms typ), the overload protection timer is reset. the swit ching operation is performed during this period t folp1 (64ms typ). at startup, the fb voltage is pulled up to the ics internal voltage, so operation starts at a voltage of v folp1a (2.8 v typ) or above. therefore, at startup the fb voltage must be set to go to v folp1b (2.6 v typ) or below during the period t folp1 (64ms typ), and the secondary output voltages start time must be set within the period t folp1 (64ms typ) following startup of the ic. recovery from the once detection of fbolp, after the period t folp2 (512 ms typ) a a a figure 15. over load protection (auto recovery) a: the fbolp comparator detects over load for fb>v folp1a b: if the state of a cont inues for the period tfolp1 (64ms typ), it is judged as an ov erload and stops switching after 64ms. c: while switching stops for the over load protection function, the vcc pin vo ltage drops and vcc pin voltage reaches < v chg1 , the vcc charge function operates so the vcc pin voltage rises. d: vcc charge function stops when vcc pin voltage > v chg2 e: if t folp2 typ =512ms go on from b point, switching function starts on soft start. f: if t folp1 (64ms typ) go on from e point to continues an overload condition (fb>v folp1a ), switching function stops at f point. g: while switching stops vcc pin voltage drops to < v chg1 , vcc charge function operates and vcc pin voltage rises. h: if vcc pin (1pin) voltage becomes over v chg2 by the vcc charge function, vcc c harge function operation stops. downloaded from: http:///
13/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operation mode of protection circuit operation mode of protection f unctions are shown in table2. table2 operation mode of protection circuit function operation mode vcc under voltage locked out auto recovery vcc over voltage protection latch with 100us timer tsd latch with 100us timer fb over limited protection auto recovery with 64ms timer source open protection auto recovery sequence the sequence diagram is show in fig-18. all condition transits off mode vcc<8.2v figure 16. the sequence diagram a a a a a downloaded from: http:///
14/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 thermal loss the thermal design should set operation for the following conditions. (since the temperature shown below is the guaranteed tem perature, be sure to take a margin into account.) 1. the ambient temperature ta must be 105 or less. 2. the ics loss must be within the allowable dissipation pd. the thermal abatement characteristics are as follows. (pcb: 70 mm 70mm 1.6 mm, mounted on glass epoxy substrate) figure 17. sop8 thermal abatement characteristics pd[mw] ta[ ] downloaded from: http:///
15/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ordering information b m 2 p x x 3 f -g e 2 product name package f : sop8 packaging and forming specification e2: embossed tape and reel marking diagram series part number BM2P053F 2p053 bm2p093f 2p093 sop8 (top view) part number marking lot number 1pin mark downloaded from: http:///
16/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit: mm) pkg: sop8 drawing no. : ex112-5001-1 (max 5.35 (include. burr)) downloaded from: http:///
17/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore , connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, t he two ground traces should be routed separately but connected to a single ground at the reference point of the application board to av oid fluctuations in the sm all-signal ground caused by l arge currents. also ensure that the ground traces of external components do not cause vari ations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the ri se in temperature of the chip may result in deterioration o f the properties of the chip. the absolute ma ximum rating of the pd stated in this s pecification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceedi ng this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected ch aracteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequenc e and delays, especially if the ic has more than one power supply. therefore, give special consideration to pow er coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacito r directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each proce ss or step. the ics power supply should always be turned off completely before connecting or removing it from the test set up during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
18/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are oft en connected to the gate of a mo s transistor. the gate has extrem ely high impedance and extremely low capacitance. if left unconnected, the el ectric field from the outside can easily charge it. the small charge acquired in th is way is enough to produce a significant effect on the conduction through the transistor and caus e unexpected operation of the ic . so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elem ents in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. t he operation of parasitic diodes ca n result in mutual interferen ce among circuits, operational faults, or physic al damage. therefore, cond itions that cause these di odes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 18. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of ca pacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exc eeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. the ic should be powered down and turned on again to re sume normal operation becaus e the tsd circuit keeps the outputs at the off state even if t he tj falls below the tsd threshold. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated wh en the load is shorted. this protection c ircuit is effective in preventing damage due to su dden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or tran sitioning of the protection circuit. downloaded from: http:///
19/19 datasheet d a t a s h e e t bm2pxx3f tsz02201-0f2f0a200060-1-2 24. sep.2015.rev.008 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 date rev. no. revision point 2012.07.19 001 new release 2013.11.18 005 p7 an explanation for figure7 p8 an explanation for vcc_uvlo/vcc_ovp function an explanation for figure8 p11 an explanation for over current limiter p12 an explanation for output over load protection function an explanation for figure15 p13 table2 2015.02.23 006 p1 package size p16 physical dimension 2015.05.15 007 p13 operation mode of protection circuit p13 sequence 2015.09.24 008 p7 an explanation of start sequence p8 an explanation of vcc pin protection function p8 an explanation of vcc uvlo / vcc ovp function p9 an explanation of vcc charge function p11 an explanation of over current limiter p12 an explanation of output over load protection function downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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