this is information on a product in full production. june 2014 docid023716 rev 3 1/11 HSP061-4M10 4-line esd protection for high speed lines datasheet - production data features ? flow-through routing to keep signal integrity ? ultralarge bandwidth: 8.7 ghz ? ultralow capacitance: 0.3 pf ? low leakage current: 70 na at 25 c ? extended operating junction temperature range: -40 c to 150 c ? thin package: 0.5 mm max. ? rohs compliant benefits ? high esd robustness of the equipment ? suitable for high density boards complies with following standards ? mil-std 883g method 3015-7 class 3b: ?8 kv ? iec 61000-4-2 level 4: ? 8 kv (contact discharge) ? 15 kv (air discharge) applications the HSP061-4M10 is designed to protect against electrostatic discharge on sub micron technology circuits driving: ? hdmi 1.3 and 1.4 ? digital video interface ? display port ? usb 3.0 ? serial ata ? thunderbolt figure 1. functional schematic (top view) description the HSP061-4M10 is a 4-channel esd array with a rail to rail architecture designed specifically for the protection of high speed differential lines. the ultralow variation of the capacitance ensures very low influence on signal-skew. the large bandwidth makes the device compatible with 3.4 gbps. the device is packaged in qfn-10l 2.5 x 1 mm with a 500 m pitch, which minimizes the pcb area. qfn-10l package i/o 1 i/o 2 gnd i/o 3 i/o 4 internally not connected gnd internally not connected 1 2 4 5 6 8 9 10 3 7 www.st.com
characteristics HSP061-4M10 2/11 docid023716 rev 3 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 20 kv t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 70 na v cl clamping voltage ipp = 1 a, 8/20 s 15 v c i/o - i/o capacitance (i/o to i/o) v i/o = 0 v, f = 1 mhz, v osc = 30 mv 0.3 0.4 pf c i/o - gnd capacitance (i/o to gnd) v i/o = 0 v f = 1 mhz, v osc = 30 mv 0.6 0.8 pf f c cut-off frequency -3db 8.7 ghz z diff differential impedance t r = 200 ps (10 - 90%) (1) , z 0 diff = 100 1. hdmi specification conditions. this information can be provided for other applications. please contact your local st office. 85 100 115
docid023716 rev 3 3/11 HSP061-4M10 characteristics 11 figure 2. leakage current versus junction temperature (typical values) figure 3. s21 attenuation measurement i r (na) 0,01 0,1 1 10 25 50 75 100 125 150 t j (c) v r =v rm =3v 100k 1m 10m 100m 1g 10g -5 -4 -3 -2 -1 0 s21 (db) f (hz) figure 4. differential impedance (z diff ) (1) figure 5. eye diagram - hdmi mask at 3.4 gbps per channel (1) 1. hdmi specification conditions. this information can be provided for other applications. please contact your local st office. tr = 200 ps (10% - 90%) 12.5 /div 250 mv/div 50 ps/div figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 20 v/div 112 v 27 v 20 v 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl 1 1 2 2 3 3 20 v/div -119 v -16 v -11 v 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl 1 1 2 2 3 3
ordering information scheme HSP061-4M10 4/11 docid023716 rev 3 2 ordering information scheme figure 8. ordering information scheme hsp 06 1 - 4 m10 high speed line protection breakdown voltage version number of lines package qfn-10l
docid023716 rev 3 5/11 HSP061-4M10 package information 11 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. qfn-10l dimension definitions table 3. qfn-10l dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.40 0.48 0.50 0.018 0.019 0.020 a1 0.00 0.03 0.05 0.00 0.001 0.002 a2 0.13 0.005 b 0.15 0.20 0.30 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.041 d 2.40 2.50 2.60 0.094 0.098 0.102 e 0.9 1.00 1.10 0.035 0.039 0.043 e 0.50 0.206 l 0.30 0.38 0.425 0.012 0.015 0.017 a a1 a2 pin 1 id l r 0.125 d b1 e b e 1 10 6 5 seating plane
package information HSP061-4M10 6/11 docid023716 rev 3 figure 12. qfn-10l tape and reel specification figure 10. footprint recommendations (dimensions in mm) figure 11. marking 0.58 0.50 0.40 0.20 2.20 1.40 h 4 m dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 5.5 ? 1.55 0.55 1.35 0.25 2.75 h4m h4m h4m
docid023716 rev 3 7/11 HSP061-4M10 recommendation on pcb assembly 11 4 recommendation on pcb assembly figure 13. recommended stencil window position 4.1 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. stencil window footprint copper thickness: 100 m 200 m 190 m 15 m 15 m 5 m 5 m 15 m 15 m 400 m 380 m 10 m 10 m 550 m 550 m 580 m 580 m
recommendation on pcb assembly HSP061-4M10 8/11 docid023716 rev 3 4.2 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead rec ognition capabilities of th e placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.3 pcb design 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks a nd open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. figure 14. printed circuit board layout recommendations via to gnd via to gnd 500 m footprint pad pcb tracks 1 5 6 10
docid023716 rev 3 9/11 HSP061-4M10 recommendation on pcb assembly 11 4.4 reflow profile figure 15. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. maximum soldering profile corresponds to the latest ipc/jedec j-std-020. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information HSP061-4M10 10/11 docid023716 rev 3 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode HSP061-4M10 h4m qfn-10l 3.27 mg 3000 tape and reel table 5. document revision history date revision changes 05-sep-2012 1 initial release. 18-oct-2012 2 updated v pp in table 1 . 17-jun-2014 3 updated figure 12 and reformatted to current standard.
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