preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 1 general description the AP2160 is an ultra low output voltage n-fet linear regulator controller. the output voltage can be adjusted down to 0.5v. a power-on-reset (por) circuit monitors supply voltage to prevent wrong operations. a pok pin indicates the output status. it can control other converters for power sequence. the AP2160 can be enabled by other power systems. the AP2160 integrates a 0.5v reference voltage with 1% accuracy to provide tight regulation to the output voltage. the regulator also features enable control, open drain power good signal, under-voltage protection and soft start. the AP2160 is available in 6-pin sot-23-6 standard package. features ? 0.5v reference voltage with 1% accuracy ? adjustable output voltage down to 0.5v ? low esr output capacitor (mlcc and poscap) applicable ? enable control for the output voltage and low shutdown current ? under-voltage short circuit protection ? fast transient response ? power good monitoring and signaling for the output ? drive n-channel mosfets applications ? notebook pc computers ? desktop computers ? battery powered devices ? portable instruments figure 1. package type of AP2160 sot-23-6
preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 2 pin configuration k package (sot-23-6) vcc drv gnd fb pok en figure 2. pin configuration of AP2160 (top view) pin description pin number pin name function 1 vcc input voltage 2 gnd common ground pin 3 pok power ok output pin 4 en h: normal operation; l: shutdown 5 fb output voltage feedback pin 6 drv gate drive to n-fet 1 2 34 5 pin 1 mark 6
preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 3 functional block diagram figure 3. functional block diagram of AP2160 ordering information AP2160 - circuit type g1: green package tr: tape & reel k: sot-23-6 package temperature range part number marking id packing type sot-23-6 -40 to 85 c AP2160ktr-g1 gjc tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. power on reset vcc gnd pok en fb control logic unit enable control thermal protection drv band gap 1 5 2 3 4 6
preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 4 absolute maximum ratings (note 1) parameter symbol value unit vcc to gnd v cc -0.3 to 7 v drv to gnd v drv -0.3 to v cc +0.3 v pok to gnd v pok -0.3 to v cc +0.3 v fb to gnd v fb -0.3 to v cc +0.3 v en to gnd v en -0.3 to v cc +0.3 v operating junction temperature t j 150 oc power dissipation (25oc) p d 0.4 w operating temperature range t opr -40 to 85 oc storage temperature range t stg -65 to 150 oc lead temperature (soldering, 10 seconds) t lead 260 oc esd (machine model) 200 v esd (human body model) 2000 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. recommended operating conditions parameter symbol min max unit supply voltage (between vcc and gnd) v cc 4.5 5.5 v system input voltage (between vin and gnd) v in 0.5 5.5 v ambient operating temperature range t a -40 85 c
preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 5 electrical characteristics v in =1.5v, v out =1.05v, v en =v cc , t a =25c, c in =4.7 f, c out =22 f, unless otherwise specified. parameter symbol conditions min typ max units supply voltage range v cc 4.5 5.5 v input voltage uvlo threshold v uvlo v fb =0.48v, v cc rising 3.70 v input voltage uvlo hysteresis v hyst v fb =0.48v, v cc falling 0.25 v supply current i cc v en =v cc =5v 0.42 0.6 ma shutdown current i sd v en =0v -1 1 ? feedback voltage v fb v en =v cc =5v 0.495 0.5 0.505 v feedback pin input current i fb v fb =0.5v -100 100 na v en-h v cc =5v, v en rising 1.3 en pin logic high threshold voltage v en-l v cc =5v, v en falling 0.5 v en pin input current i en i out =0ma, v in =5v -1 1 ? output voltage uvlo threshold v th(uv) v fb falling 0.2 0.25 0.3 v i drv(ss) sourcing, v fb =0v 20 ? i drv(src) sourcing, v fb =0.48v 2.2 drv output current i drv(sink) sinking, v fb =0.52v 9.0 ma v fb =0.48v, v en =v cc =5v 4.9 5.0 drv pin output voltage v drv v fb =0.52v, v en =v cc =5v 0.8 1.15 1.5 v pok threshold voltage for power not ok v pnok v fb falling 84% 88% 91% v fb pok low voltage pok sinks 1ma 200 250 mv pok delay time t delay 0.8 2 10 ms thermal shutdown temperature t sd 150 c thermal shutdown hysteresis 40 c
preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 6 typical performance characteristics figure 4. feedback voltage vs. ambient temperature figure 5. supply current vs. ambient temperature figure 6. output voltage vs. load current figure 7. ripple rejection vs. frequency -40-20 0 20406080100120 0.496 0.498 0.500 0.502 0.504 feedback voltage (v) ambient temperature ( o c) -40 -20 0 20 40 60 80 100 120 380 400 420 440 460 480 500 supply current ( a) ambient temperature ( o c) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 1.0580 1.0585 1.0590 1.0595 1.0600 output voltage (v) load current (a) 100 1000 10000 100000 0 10 20 30 40 50 60 70 ripple rejection (db) frequence (hz) output voltage: 1.05v load current: 300ma
preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 7 function description 1. power-on-reset a power-on-reset (por) circuit monitors input voltages at vcc pin to prevent wrong logic controls. the por function initiates a soft-start process after the supply voltages exceed input voltage uvlo threshold during powering on. the por function also pulls low the pok pin regardless of the output voltage when the vcc voltage falls below the input voltage uvlo threshold minus input voltage uvlo hysteresis. 2. output voltage regulation an error amplifier working with a temperature compensated 0.5v reference and an output nmos regulates output to the preset voltage. the error amplifier designed with high bandwidth and dc gain provides very fast transient response and excellent load regulation. 3. under-voltage protection (uvp) AP2160 monitors the voltage on fb pin after soft-start process finishing. therefore the uvp is disabled during soft-start. when the voltage on fb pin falls below the output voltage uvlo threshold, the uvp circuit shuts down the output immediately. 4. thermal shutdown a thermal shutdown circuit limits the junction temperature of AP2160. when the junction temperature exceeds 150c, a thermal sensor turns off the output nmos, allowing the device to cool down. the regulator regulates the output again through initiation of a new soft-start cycle after the junction temperature drops by 40c.
preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 8 typical application figure 8. typical applic ation circuit of AP2160
preliminary datasheet ultra low output voltage linear n-fet controller AP2160 jan. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 9 mechanical dimensions sot-23-6 unit: mm(inch) 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)typ 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)ref 0.100(0.004) 0.200(0.008) 0 8 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) max 123 4 5 6 pin 1 mark
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited
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