mixers - sub-harmonic - smt 8 8 - 30 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com hmc265lm3 gaas mmic sub-harmonic smt mixer, 20 - 31 ghz v01.1201 general description features functional diagram the hmc265lm3 is a 20 - 31 ghz surface mount sub-harmonically pumped (x2) mmic mixer down- converter with integrated lo and if amplifi ers in a smt leadless chip carrier package. the 2lo to rf and if isolations are an excellent 28 to 47 db, eliminating the need for additional fi ltering. the lo amplifi er is a single bias (+3v to +4v) two stage design with only -4 dbm drive requirement. all data is with the non-hermetic, epoxy sealed lm3 packaged device mounted in a 50 ohm test fi xture. utilizing the hmc265lm3 eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer. integrated lo amplifi er: -4 dbm input sub-harmonically pumped (x2) lo high 2lo/rf isolation: > 28 db lm3 smt package electrical specifi cations, t a = +25 c, as a function of vdd typical applications the hmc265lm3 is ideal for: ? 20 and 31 ghz microwave radios ? downconverter for point to point radios ? lmds and satcom parameter if = 2 ghz lo = -4 dbm & vdd = +4v if = 2 ghz lo = -4 dbm & vdd = +4v if = 2 ghz lo = -4 dbm & vdd = +3v units min. typ. max. min. typ. max. min. typ. max. frequency range, rf 20 - 31 27 - 30 21 - 30 ghz frequency range, lo 10 - 15.5 13.5 - 15 10.5 - 15 ghz frequency range, if 0.7 - 3 0.7 - 3 0.8 - 2.8 ghz conversion gain (rf to if) -2 3 0 4 -1 3 db noise figure (ssb) 13 13 13 db 2lo to rf isolation 21 28 28 35 20 28 db 2lo to if isolation 39 47 40 48 38 47 db ip3 (input) 2 8 6 10 2 8 dbm 1 db compression (input) -1 +2 0 +3 0 dbm supply current (idd) 50 50 40 ma *unless otherwise noted, all measurements performed as downconverter, if= 2 ghz.
mixers - sub-harmonic - smt 8 8 - 31 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com conversion gain vs. temperature @ lo = -4 dbm, vdd= +4v conversion gain vs. temperature @ lo = -4 dbm, vdd= +3v conversion gain vs. lo drive @ vdd = +4v conversion gain vs. lo drive @ vdd = +3v isolation @ lo = -4 dbm, vdd = +4v isolation @ lo = -4 dbm, vdd = +3v hmc265lm3 gaas mmic sub-harmonic smt mixer, 20 - 31 ghz v01.1201 -20 -15 -10 -5 0 5 10 18 20 22 24 26 28 30 32 34 +25c -40c +85c conversion gain (db) rf frequency (ghz) -70 -60 -50 -40 -30 -20 -10 0 10 18 20 22 24 26 28 30 32 34 isolation (db) rf frequency (ghz) 2lo/rf lo/rf rf/if 2lo/if lo/if -70 -60 -50 -40 -30 -20 -10 0 10 18 20 22 24 26 28 30 32 34 isolation (db) rf frequency (ghz) 2lo/rf lo/rf rf/if 2lo/if lo/if -20 -15 -10 -5 0 5 10 18 20 22 24 26 28 30 32 34 -8 dbm -6 dbm -4 dbm -2 dbm 0 dbm conversion gain (db) rf frequency (ghz) -20 -15 -10 -5 0 5 10 18 20 22 24 26 28 30 32 34 -8 dbm -6 dbm -4 dbm -2 dbm 0 dbm conversion gain (db) rf frequency (ghz) -20 -15 -10 -5 0 5 10 18 20 22 24 26 28 30 32 34 +25c -40c +85c conversion gain (db) rf frequency (ghz)
mixers - sub-harmonic - smt 8 8 - 32 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com input ip3 vs. lo drive @ vdd = +4v * rf & lo return loss @ lo = -4 dbm, vdd = +4v if return loss @ lo = -4 dbm, vdd = +4v input p1db @ lo = -4 dbm, vdd = +4v if bandwidth @ lo = -4 dbm * two-tone input power = -10 dbm each tone, 1 mhz spacing. hmc265lm3 gaas mmic sub-harmonic smt mixer, 20 - 31 ghz v01.1201 0 4 8 12 16 20 18 20 22 24 26 28 30 32 34 -6 dbm -4 dbm -2 dbm input ip3 (dbm) rf frequency (ghz) -20 -15 -10 -5 0 5 10 0123456 vdd = +3v vdd = +4v if conversion gain (db) if frequency (ghz) -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 0123456 return loss (db) if frequency (ghz) -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 0 5 10 15 20 25 30 35 rf lo return loss (db) frequency (ghz) -5 -4 -3 -2 -1 0 1 2 3 4 5 18 20 22 24 26 28 30 32 34 input p1db (dbm) rf frequency (ghz)
mixers - sub-harmonic - smt 8 8 - 33 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com outline drawing absolute maximum ratings rf / if input (vdd = +5v) +13 dbm lo drive (vdd = +5v) +13 dbm vdd 5.5v continuous pdiss (ta = 85 c) (derate 2.52 mw/c above 85 c) 227 mw storage temperature -65 to +150 c operating temperature -40 to +85 c notes: 1. material: plastic 2. plating: gold over nickel 3. dimensions are in inches [millimeters]. 4. all tolerances are 0.005 [ 0.13]. 5. all grounds must be soldered to pcb rf ground. 6. ? indicates pin 1 electrostatic sensitive device observe handling precautions hmc265lm3 gaas mmic sub-harmonic smt mixer, 20 - 31 ghz v01.1201
mixers - sub-harmonic - smt 8 8 - 34 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com pin number function description interface schematic 1, 2 n/c this pin may be connected to the housing ground or left unconnected. 3vdd power supply for the lo amplifi er. an external rf bypass capacitor of 100 - 330 pf is required as close to the package as possible. 4rf this pin is ac coupled and matched to 50 ohm from 20 - 30 ghz. 5if this pin is ac coupled and matched to 50 ohm from 0.7 - 3 ghz. 6lo this pin is ac coupled and matched to 50 ohm from 10 - 15 ghz. 7 gnd must be soldered to pcb rf ground. pin description hmc265lm3 gaas mmic sub-harmonic smt mixer, 20 - 31 ghz v01.1201
mixers - sub-harmonic - smt 8 8 - 35 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com the grounded co-planar wave guide (cpwg) pcb input/output transitions allow use of ground-signal-ground (gsg) probes for testing. suggested probe pitch is 400mm (16 mils). alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors. evaluation pcb evaluation circuit board layout design details lm3 package mounted to evaluation pcb layout technique micro strip to cpwg material rogers 4003 with 1/2 oz. cu dielectric thickness 0.008 (0.20 mm) microstrip line width 0.018 (0.46 mm) cpwg line width 0.016 (0.41 mm) cpwg line to gnd gap 0.005 (0.13 mm) ground via hole diameter 0.008 (0.20 mm) c1 100 pf capacitor, 0402 pkg. hmc265lm3 gaas mmic sub-harmonic smt mixer, 20 - 31 ghz v01.1201
mixers - sub-harmonic - smt 8 8 - 36 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com suggested lm3-01 pcb land pattern tolerance: 0.003 ( 0.08 mm) hmc265lm3 gaas mmic sub-harmonic smt mixer, 20 - 31 ghz v01.1201
mixers - sub-harmonic - smt 8 8 - 37 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com hmc265lm3 recommended smt attachment technique preparation & handling of the lm3 millimeterwave package for surface mounting the hmc lm3 package was designed to be compatible with high volume surface mount pcb assembly processes. the lm3 package requires a specifi c mounting pattern to allow proper mechanical attachment and to optimize electrical per- formance at millimeterwave frequencies. this pcb layout pat- tern can be found on each lm3 product data sheet. it can also be provided as an electronic drawing upon request from hittite sales & application engineering. follow these precautions to avoid permanent damage: cleanliness: observe proper ha ndling procedures to ensure clean devices and pcbs. lm3 devices should remain in their original packaging until component placement to ensure no contamination or damage to rf, dc & ground contact areas. static sensitivity: follow esd precautions to protect against esd strikes. general handling: handle the lm3 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. avoiding damaging the rf, dc, & ground contacts on the package bottom. do not apply excess pres- sure to the top of the lid. solder materials & temperature profi le: follow the information contained in the application note. hand soldering is not recommended. conductive epoxy attachment is not recommended. solder paste solder paste should be selected based on the users experience and be compatible with the metallization systems used. see the lm3 data sheet outline drawing for pin & ground contact metallization schemes. solder paste application solder paste is generally applied to the pcb using either a stencil printer or dot placement. the volume of solder paste will be dependent on pcb and component layout and should be controlled to ensure consistent mechanical & electrical performance. excess solder may create unwanted electrical parasitics at high frequencies. solder refl ow the soldering process is usually accomplished in a refl ow oven but may also use a vapor phase process. a solder refl ow profi le is suggested above. prior to refl owing product, temperature profi les should be measured using the same mass as the actual assemblies. the thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. the fi nal profi le should be determined by mounting the thermocouple to the pcb at the location of the device. follow solder paste and oven vendors recommendations when developing a solder refl ow profi le. a standard profi le will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. allow enough time between reaching pre-heat temperature and refl ow for the solvent in the paste to evaporate and the fl ux to completely activate. refl ow must then occur prior to the fl ux being completely driven off. the duration of peak refl ow temperature should not exceed 15 seconds. packages have been qualifi ed to withstand a peak temperature of 235c for 15 seconds. verify that the profi le will not expose device to temperatures in excess of 235c. cleaning a water-based fl ux wash may be used. hmc265lm3 gaas mmic sub-harmonic smt mixer, 20 - 31 ghz v01.1201 25 50 75 100 125 150 175 200 225 012345678 temperature ( 0 c) time (min)
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