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1 sheet no.: dg-072009 date february 20, 2007 ?sharp corporation GM5GC96270A GM5GC96270A light emitting diode notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. features 1. high brightness (1300 mcd @ i f =20ma) 2. green (color derived from ingan led) agency approvals/compliance 1. rohs compliant applications 1. general indication 2. audio visual equipment 3. home appliances 4. telecommunications equipment 5. tooling machines/factory automation
sheet no.: dg-072009 2 GM5GC96270A external dimensions equivalent circuit 12 12 12 1 2 anode cathode no. name pin arran g ement 3.5 2.8 1.9 (2.2) 3.2 (2.4) a b c d (0.8) (0.15) cathode anode polarity mark tc (1.9) notes: 1. units: mm 2. unspecified tolerence: 0.3 mm 3. ( ): reference dimensions 4. case temperat u re (tc) meas u rement point
sheet no.: dg-072009 3 GM5GC96270A absolute maximum ratings * 1 duty ratio = 1/10, pulse width = 0.1 ms * 2 case temperature (see outline dimensions on page 2) * 3 each terminal must be soldered with a 30 w soldering iron within 3 seconds under 295c. for reflow soldering information, see fig. 13. * 4 operating current values here follow the derating curves shown in fig. 1 through fig. 3. * 5 this device uses the leads for heat sinking, therefore the operating temperature range is prescribed by tc. electro-optical characteristics * 1 measured by eg&g model 550 (radiometer/photometer) after 20 ms drive (tolerance: 15%) * 2 measured by ohtsuka electronics model mcpd-2000 after 20 ms drive (tolerance: x,y: 0.02) * 3 see luminous intensity rank table on page 8 . * 4 see dominant wavelength rank table on page 8 . parameter symbol rating unit power dissipation p 120 mw forward current i f 30 ma peak pulsed forward current *1 i fm 100 ma forward current derating factor dc 0.6 ma/c pulse 2.0 ma/c reverse current i r 70 ma operating temperature *2 tc -40 to +100 c storage temperature tstg -40 to +100 c soldering temperature *3 tsol 295 c parameter symbol conditions min. typ. max. unit forward voltage v f i f = 20 ma ?3.34.0v luminous intensity *1, 3 i v *2 1300 *2 mcd dominant wavelength *4 d ? 527 ? nm (tc = 25c) (tc = 25c)
sheet no.: dg-072009 4 GM5GC96270A derating curves characteristic diagrams (typ.*) *characteristics data are typical data and are not guaranteed data. fig. 1 forward cu rrent vs. case temperature fig. 2 peak forward current vs. duty ratio fig. 3 peak forward current vs. case temperature 0 -40 -20 0 20 40 60 80 100 10 20 30 40 50 60 70 case temperat u re tc (c) for w ard c u rrent i f (ma) 0 1/100 1/10 1 20 40 60 80 100 120 d u ty ratio peak for w ard c u rrent i fm (ma) (tc = 25c) 0 -40 -20 0 20 40 60 80 100 20 40 60 80 100 120 case temperat u re tc (c) peak for w ard c u rrent i fm (ma) fig. 4 relative lumi nous intensity vs. forward current fig. 5 forward current vs. forward voltage fig. 6 relative lumi nous intensity vs. case temperature 0.1 1 10 100 1000 (tc = 25c) 100 10 1 for w ard c u rrent i f (ma) relati v e l u mino u s intensity ( % ) 2.2 2.7 3.2 3.7 100 (tc = 25c) 10 1 0.1 for w ard v oltage v f ( v ) for w ard c u rrent i f (ma) -40 -20 0 20 40 60 80 100 (i f = 20 ma) 1000 100 10 case temperat u re tc (c) relati v e l u mino u s intensity ( % )
sheet no.: dg-072009 5 GM5GC96270A tape specif ications tape dimension specifications fig. 7 tape shape and dimensions parameter symbol dimension (mm) remarks concave square hole for parts insertion vertical a 3.0 dimension excluded corner r at the bottom inside horizontal b 3.7 pitch p 1 4.0 round sprocket hole diameter d 0 1.5 pitch p 0 4.0 accumulated error 0.5 mm/10 pitch position e 1.75 distance between the edge of the tape and center of the hole center to center distance vertical p 2 2.0 distance between center line of the concave square hole and round sprocket hole horizontal f 3.5 cover tape width w 1 5.4 thickness t 3 0.1 carrier tape width w 0 8 .0 thickness t 1 0.3 thickness of entire unit t 2 2.6 with cover tape and carrier tape combined d 0 w 0 w 1 b f e t 1 p 0 p 2 t 3 t 2 p 1 a anode cathode
sheet no.: dg-072009 6 GM5GC96270A reel specifications reel dimension specifications *1 label on side of flange: part number, quantity, lot number, and rank. *2 material: described on flange. fig. 8 reel shape and dimensions parameter symbol dimension (mm) remarks flange diameter a 1 8 0 thickness t 1.3 inner space direction w 9.5 shaft core dimension hub external diameter b 60 spindle hole diameter c 13 key slit width e 2.0 key slit depth u 4 0.8 0.6 0.4 0.2 e u la b el t w b .160q???4#0-? ????'+#,%?/#&'+0?2*+.+22+0'5 sharp corporation part no. quantity a c
sheet no.: dg-072009 7 GM5GC96270A taping specifications 1. leader tape standard: jis c0 8 06 2. cover tape peel resistance: f = 0.1 to 1.0 n ( = 10 or less). see fig. 10. 3. tape bending resistance: cover tape will remain in place on radii of 30 mm or more. under 30 mm radii, the cover may separate. 4. joints are not allowed in the cover tape. 5. parts are packed with an average quantity of 2000 pieces per reel. 6. product mass: 30 mg (approximately) 7. sharp guarantees the following: a. no contiguous empty spaces in the tape b. missing parts will not make up more than 0.1% of the total quantity. c. parts will be easily removed from the packing. 8 . parts will not stick to the cover tape as it is peeled. fig. 9 leader tape fig. 10 tape separation empty end st u ffed 10 pitch or more leading 100 pitch or more p u ll o u t beginning co v er tape for w ard carrier tape f tape speed: 5 mm/s = 0 ~ 10
sheet no.: dg-072009 8 GM5GC96270A label and marking information luminous intensity rank table (tc = 25c) * 1 parts are marked to the highest rank of their tested luminosity level. * 2 quantity of each rank is decided by sharp. dominant wavelength ranking (tc = 25c) * 1 table rankings are based upon table conditions, and as such are not guaranteed data * 2 quantity of each rank is decided by sharp. fig. 11 label contents rank luminous intensity unit condition m795 ~ 154 8 mcd i f = 20 ma n 1144 ~ 2229 o164 8 ~ 3210 rank dominant wavelength unit condition a517.0 ~ 523.0 nm i f = 20 ma b522.0 ~ 52 8 .0 c527.0 ~ 533.0 d532.0 ~ 53 8 .0 sharp corporation part no. GM5GC96270A ? part n u m b er q u antity eiaj c-3 bar code eiaj c-3 bar code indication (example) of lot n u m b er and rank indication (example) of prod u ction co u ntry quantity 2000 ? ? ? lot no. mi07a01 rank ? ? ???? eiaj c-3 ? made in ? philippines prod u ction plant code (alpha b etically) prod u ction lot (single or do ub le digits) prod u ction year (the last t w o digits of the year) prod u ction date (01 ~ 31) rank : : l u mino u s intensity rank : dominant w a v elength rank prod u ction month (to b e indicated alpha b etically w ith jan u ary corresponding to a) 1 2 3 4 5 lot nu m b er m a 0 1 i 0 7 5 4 3 2 1
sheet no.: dg-072009 9 GM5GC96270A design notes 1. this product is not designed to resist electromagnetic and ionized-particle radiation. moreover, it is not designed to directly resist excessive moisture, such as dew or condensation; or corrosive (salt) air or corrosive gases, such as cl, h 2 s, nh 3 , so 2 , no x . 2. do not allow the circuit design to apply any reverse voltage to the leds. 3. this part can be easily damaged by external stress. make sure they are not mechanically stressed during or after assembly. 4. this part has a very high light output. looking directly at it during full power output can cause injury. 5. sharp recommends taking proper personal and environmental static control precauti ons when handling this part. 6. materials of high thermal conductivity are incorporated in this device to allow generated heat to be effectively transferred from it to the circuit board. for best reliability, sharp recommends against locating other sources of heat near the led, and to design the circuit board in such a way that heat can easily escape from the circuit board. sharp also recommends designing the circuit board so that the part?s case temperature is always kept under 100c (when the led is turned on) including self-heating. 7. sharp recommends handling these parts in a clean, non-dusty environment since surface dust may be difficult to remove and can affect the optical performance of the part. 8 . sharp recommends confirming the part?s performance, reliability, and resistance to any of these conditions, if it is to be used in any of these environments: ? direct sunlight, outdoor exposure, dusty conditions ? in water, oil, medical fluids, and organic solvents ? excessive moisture, such as dew or condensation ? corrosive (salt) air or corrosive gases, such as cl, h 2 s, nh 3 , so 2 , no x
sheet no.: dg-072009 10 GM5GC96270A manufacturing guidelines storage and handling 1. moisture-proofing: these parts are shipped in vacuum-sealed packaging to keep them dry and ready for use. see fig. 12. 2. store these parts between 5c and 30c, at a relative humidity of less than 60%. 3. after breaking the package seal, maintain the environment within 5c to 30c, at a relative humidity of less than 60%. solder the parts within 3 days. 4. if the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant. 5. if the parts are exposed to air for more than 3 days, or if the silica gel telltale indicates moisture contamination, bake the parts: ? when in the tape carrier, bake them at a temperature of 95c to 100c, for 16 to 24 hours. ? when loose (in a metal tray) or on a pcb, bake them at a temperature of 110c to 120c, for 8 to 12 hours. ? note that the reels may become distorted if they are in a stack when baking. confirm that the parts have cooled to room temperature after baking. cleaning instructions 1. sharp does not recommend cleaning printed circuit boards containing this device. process chemicals will affect the structural and optical characteristics of this device. 2. use solder paste that does not require cleaning. avoid using ultrasonic cleaning if possible. 3. if ultrasonic cleaning cannot be avoided, verify the process before beginning production. compatible solvents are water and isopropyl alcohol. 4. this device can be affected by ultrasonic cleaning; factors to be considered are the size of the bath, ultrasonic output, duration, size of pcb, and the device?s mounting method. fig. 12 factory moistu re-proof packaging al u min u m package silica gel reel la b el la b el
sheet no.: dg-072009 11 GM5GC96270A soldering instructions 1. when soldering with reflow methods, sharp recommends following the soldering profile in fig. 13. 2. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the pack- age due to the pcb flexing during the soldering process. 3. when using a second reflow, the second process should be carried out as soon as possible after the first. 4. electrodes on this part are silver-plated. if the part is exposed to a corrosive environment, the plating may be damaged, thereby affecting solderability. 5. the reflow profile shown in fig. 13 should be considered as a set of maximum parameters. since this part uses the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period lengthened as much as possible. thermal conduction into the led will be affected by the performance of the reflow process, so verification of the reflow process is recommended. these parts may be used in a nitrogen reflow process. recommended solder pad design 1. solderability depends on reflow conditions, solder paste, and circuit board materials. check the entire process before production commences. 2. fig. 14 shows the recommended solder pattern for this part. 3. when using back side dip methods, sharp recommends checking the process carefully: board warping from heat can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the leads. performing reflow after dip is recommended, with the interval between the two as short as possible. fig. 13 temperature profile fig. 14 recommended solder pattern 25 150 1 ~ 4c/s 1 ~ 4c/s 1 ~ 2.5c/s 220 260 (max) time (s) temperat u re (c) 200 60 ~ 120s 5s (max) 60s (max) note: unit: mm prod u ct center 2.6 1.5 1.5 4.5
sheet no.: dg-072009 12 GM5GC96270A presence of odcs this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde).
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data materials, struc- ture, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: dg-072009 13 GM5GC96270A

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