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| datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/14 tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 14 ? 001 www.rohm.com for 2cell solar, synchronous switch-mode charger ic bu1840amuv general description the bu1840amuv device provides the best system to the product charged with 1cell li-ion battery and 3cell nickel-metal-hydride batteries using the 2cell, 3cell, and 4cell solar panel. it is possible to boost it according to the voltage of 2 cell solar panel with built-in the function to boost the low voltage input. moreover, the solar battery maximum dissipation can be drawn out with built-in the peak power track function. it is possible to select the the switching frequency according to the terminal sel. it is also possible to monitor the charging current by the i2c interface. built in heat reckless driving protection (thermal shutdown), decrease voltage protection, and input current protection for protection function features ? synchronous switch-mode charger for 2cell solar 400ma@battery=3.7v,vin=1v ? mppt control voltage range 0.7v 1.5v ? charging current completion voltage 5.0v (hysteresis: 0.075v) ? built in mppt ? switching frequency (160khz,320khz) ? charging current monitor by i2c ? uvlo-detect voltage:0.625v ? uvlo-release voltage:0.700v ? thermal shutdown ? 24 pin vqfn024v4040 (4.1mm 4.1mm datasheet d a t a s h e e t . 2/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com absolute maximum ratings (ta=25 ) parameter symbol ratings unit conditions maximum applied voltage 1 vmax1 7.0 v vio,sda,scl,sw1,2,3, enb corevdd,outp1,2,outpm,outs maximum applied voltage 2 vmax2 2.5 v vin,vinmon,v18,imon,pcomp, sel,osc power dissipation1 pd1 560 w 1layer(74.2x74.2mm)boad (surface heat radiation copper foil 6.28mm ) power dissipation2 pd2 1766 w 4layer(74.2x74.2mm)boad (1,4layer heat radiation copper foil 6.28mm ) (2,3layer heat radiation copper foil 5500mm ) operating temperatur e range topr -30 +85 storage temperature range tstr -55 +150 *1 when it is used by more than ta=25 , it is reduced by 5.6mw/ . *1 *2 when it is used by more than ta=25 , it is reduced by 17.66mw/ . operating conditions (ta=25 ) parameter symbol ratings unit conditions power supply voltage range 1 vcc1 0.625 1.98 v vin terminal voltage power supply voltage range 2 vcc2 1.7 5.5 v vio terminal electrical characteristics (unless otherwise specified: ta=25 , vin=1.0v) parameter symbol rating unit conditions min. typ. max. mppt control minimum voltage mpptl - - 0.7 v vinmon-monitor mppt control maximum voltage mppth 1.5 - - v vinmon-monitor mppt-vin control voltage resolution pptvt 12.5 25.0 37.5 mv uvlo release threshold vuvlor 0.6 0.7 0.8 v vin-rising uvlo detect threshold vuvlod 0.575 0.625 0.675 v vin-falling uvlo hysteresis vuvlohys 30 80 130 mv mppt start up voltage vst1 2.45 2.6 2.75 v corevdd-monitor (hys=0.3v) charging current completion voltage vch2 4.93 5.0 5.07 v outs-monitor rising. (hysteresis=0.075v) circuit current 1 (vin-current) i cc1 - - 1.0 ma enb=1v, sw=vin circuit current 2 (outs-current) icc2 - - 2 ua enb=1v, outs,p=5.2v, corevdd=3.7v circuit current 3 (outs-current) not-switching icc3 - - 4 ua enb=0v, outs,p=5.2v corevdd=3.7v nch-sw on registor rnsw - 60 - m pch-sw on registor rpsw - 100 - m input over current limiter vilim 3.0 4.0. 5.0 a dcdc switching frequency 1 (sel=vin) fosc1 260 320 380 khz osc2out dcdc switching frequency 2 (sel=gnd) fosc2 130 160 190 khz osc2out charging current voltage range vimon 0 40 mv v(outpm)-v(outs) charging current monitor accuracy 1 imon1 0d 2b 49 hex v(outpm)-v(outs)=0mv charging current monitor accuracy 2 imon2 88 a6 bf hex v(outpm)-v(outs)=40mv logic operating clock logosc - 30 - khz c4=100pf enb ?h? level voltage venh 1.1 - - v power-off enb ?l? level voltage venl 0 - 0.2 v power-on 2 2 2 datasheet d a t a s h e e t . 3/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com electrical characteristics (unless otherwise specified: ta=25 , vio=1.8v) item symbol min. typ. max. unit conditions i 2 c input (sda, scl) l level input voltage vil1 -0.3 - 0.25 vio v h level input voltage vih1 0.75 vio - vio +0.3 v hysteresis width vhys1 0.05 vio - - v l level output voltage (sink current = 3ma) vol1 0 - 0.3 v sda pin input current iin1 -3 - 3 a pin voltage=0 vio i 2 c bus format the writing/reading operation is based on the i 2 c slave standard. ? slave address a7 a6 a5 a4 a3 a2 a1 r/w 1 1 1 0 0 0 1 1/0 ? bit transfer scl transfers 1-bit data during h. scl cannot change signal of sda during h at the time of bit transfer. if sda changes while scl is h, start conditions or stop conditions will occur and it will be interpreted as a control signal. ? start and stop condition when sda and scl are h, data is not transferred on the i 2 c- bus. this condition indicates, if sda changes from h to l while scl has been h, it will become start (s) conditions, and an access start, if sda changes from l to h while scl has been h, it will become stop (p) conditions and an access end. ? acknowledge it transfers data 8 bits each after the occurrence of start condition. a transmitter opens sda after transfer 8bits data, and a receiver returns the acknowledge signal by setting sda to l. ? protocol sda scl sda a state of stability data are effective sda it can change sda scl sp start condition stop condition 12 89 data output by transmitter data output by receiver acknowledge not acknowledge s start condition clock pulse for acknowledgement scl a a s p the mastering side is a transmitter. the slave side is a receiver. the slave side is a transmitter. the mastering side is a receiver. unacknowledged a cknowledge stop condition start condition sr repetition start condition legend datasheet d a t a s h e e t . 4/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com 1. writing protocol a register address is transferred by the next 1 byte that transferred the slave address and the write-in command. the 3rd byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register address is carried out automatically. however, when a register address turns into the last address, it is set to 00h by the next transmission. after the transmission end, the increment of the address is carried out. s a a a p register address slave address from master to slave from slave to master r/w=0(write) data a d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 a 7 a 6 a 5 a 4 a 3 a 2 a 1 a 0 0 x x x x x x x *1 *1 data a =acknowledge(sd a low) a =not acknowledge(sda high) s=start condition p=stop condition *1: write timing register address increment register address increment 2. reading protocol it reads from the next byte after writing a slave address a nd r/w bit. the register to read considers as the following address accessed at the end, and the data of the address t hat carried out the increment is read after it. if an address turns into the last address, the next byte will read out 00h. after the transmission end, the increment of the address is carried out. 1 s a p from master to slave from slave to master r/w=1(read) data a data slave address d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 register address increment x x x x x x x a =acknowledge(sd a low) a =not acknowledge(sda high) s=start condition p=stop condition register address increment a 3. multiple reading protocols after specifying an internal address, it reads by repeat ed start condition and changing the data transfer direction. the data of the address that carried out the increment is r ead after it. if an address turns into the last address, the next byte will read out 00h. after the transmission end, the increment of the address is carried out. r/w=0(write) r/w=1(read) slave address register address slave address data data s a a a sr 1 0 a 7 a 6 a 5 a 4 a 3 a 2 a 1 a 0 x x x x x x x x x x x x x x a =acknowledge(sda low) a =not acknowledge(sda high) s=start condition p=stop condition from master to slave from slave to master register address increment register address increment p a d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 a sr=repeated start condition as for reading protocol and multiple reading protocols, please do a(not acknowledge) after doing the final reading operation. it stops with read when ending by a (acknowledge), and sda stops in the state of low when the reading data of that time is 0. however, this state returns usually when scl is moved, data is read, and a (not acknowledge) is done. datasheet d a t a s h e e t . 5/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com electrical characteristics(unless otherwise specified, ta=25 , vio=1.8v) item symbol standard-mode fast-mode typ. min. typ. max. min. typ. max. i 2 c bus format scl clock frequency fscl 0 - 100 0 - 400 khz low period of the scl clock tlow 4.7 - - 1.3 - - s high period of the scl clock thigh 4.0 - - 0.6 - - s hold time for a repeated start condition thd;sta 4.0 - - 0.6 - - s set-up time for a repeated start condition tsu;sta 4.7 - - 0.6 - - s data hold time thd;dat 0 - 3.45 0 - 0.9 s data set-up time tsu;dat 250 - - 100 - - ns set-up time for stop condition tsu;sto 4.0 - - 0.6 - - s bus free time between a stop and start condition tbuf 4.7 - - 1.3 - - s timing diagram sda s cl t su;dat t low s sr p s t buf t hd;sta t su;sta t high t hd;sta t hd;dat t su;sto register map address symbol name r/w d7 d6 d5 d4 d3 d2 d1 d0 initial function 00h sftrst w - - - - - - - sft rst 00h 01h adcdata r adc data7 adc data6 adc data5 adc data4 adc data3 adc data2 adc data1 adc data0 00h please input "0" to "-". in an empty address, there is a possibility of doing assign to the register for the test. the access to a register for the test and an undefined register is prohibited. the i 2 c control timing and the internal operation of ic timing become asynchronous relations when reading out data from the outside. i hope measures so as not to become a problem on the applic ation as the agreement sequence is compare three times. datasheet d a t a s h e e t . 6/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com register explanation address symbol name r/w d7 d6 d5 d4 d3 d2 d1 d0 initial ?` 00h sftrst w - - - - - - - sft rst 00h ?? ?? after initializing this all registers when sf trst: d0=1 is done in write, the value of this register returns to an initial valu e, too. address symbol name r/w d7 d6 d5 d4 d3 d2 d1 d0 initial ?` 01h adcdata r adc data7 adc data6 adc data5 adc data4 adc data3 adc data2 adc data 1 adc data0 00h d7-d0: adcdata7-0 8bitadc data initial 00h note when not charging it (v18<1.6v & det4out=hi datasheet d a t a s h e e t . 7/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com block diagram block operation characteristics det1 the voltage of vinmon is detected. (it has hysteresis characteristics.) 0.700v-detect 0.625v-release det2 the voltage of corevdd (2.6v) is detected. (it has hysteresis characteristics.) 2.6v-detect 2.3v-release det3 the voltage of v18 is detected. (it has hysteresis characteristics.) 1.6v-detect 1.5v-release det4 the voltage of outs is detected. (it has hysteresis characteristics.) 5.0v-detect 4.925v-release osc1 it is an oscillator. it operates at the self-excitation boost. osc2 it is an oscillator. it operates at mppt. sel= gnd frequency=160khz sel= vin frequency=320khz osc3 it is an oscillator. it uses it for the clock in the mppt-control block and the a/d block. dac it is d/a converter. a standard voltage of mppt is output. adc it is a/d converter. the analogue signal amplified in the current-sense block is converted into the digital signal. current-sense the outpm-outs voltage is amplified. v18reg internal power supply v18 is generated from corevdd. current-limiter the current that flows from sw to pgnd is detected. i2c it is i2c interface block. vio is made a power supply. mppt-control to charge it by the solar battery maximum dissipation, it controls. dcdc control enb + - vinmon pcomp swn pgnd1,2,3 sw1,2,3 swp outp1,2 det4 (5v) vin outs 500k + - corevdd current limiter agnd1,2 current sense imon sel i2c vio sda scl outpm dac osc3 osc v18 vin 500k adc det1 0.7v osc2 v18reg det2 (2.6v) det3 (1.6v) adcout osc3out mmpt control dacout osc1out det3out osc2out (160khz, 320khz) det4out det2out vin osc1 datasheet d a t a s h e e t . 8/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com charging current sense register (r1) it is necessary to decide the constant of r1 in proportion to the maximum charge current. maximum charging current ?maximum input power? ?efficiency? ?voltage of battery? maximum charging current [ma] r1 [m ] maximum charging current [ma] r1 [m ? ] 60 560 350 100 80 470 400 100 100 390 480 82 120 330 580 68 150 220 700 56 200 180 820 47 250 150 1000 39 300 120 1200 33 charging current data the current for each 1bit of the charge current data is decided by the following calculating formula charging current (charging current data[hex] 2b[hex]) ?charging current / 1bit? r1 [m ? ] charging current/1bit [ma] r1 [m ? ] charging current/1bit [ma] 33 9.685 150 2.131 39 8.195 180 1.776 47 6.800 220 1.453 56 5.707 270 1.184 68 4.700 330 0.9685 82 3.898 390 0.8195 100 3.196 470 0.6800 120 2.663 560 0.5707 datasheet d a t a s h e e t . 9/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com operating sequence mppt voltage boost stop self boost mppt operation changing current monitor boost stop mppt operation boost stop det1out (inter-node) osc1out (inter-node) det2out (inter-node) v18 det3out (inter-node) osc2out (inter-node) dacout (inter-node) adcdata (i2c-inter face) det4out (inter-node) outs corevdd operation 1.6v 5.0v 4.925v 2.6v 0.7v vin 0.7v 0.7v vin mon 0.7v mppt voltage mppt calculation voltage charging current monitor mppt voltage mppt calculation voltage mppt calculation voltage mppt voltage mppt calculation voltage note) when mppt operating, it is calculated of mpp each 158ms. (logosc=30khz) the amount of the mpp voltage change is 25mv step. datasheet d a t a s h e e t . 10/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com pin layout package diagram no. pin name function esd diode high side gnd side 1 scl i2c interface clock input pin vio agnd 2 sda i2c interface data input and output pin vio agnd 3 vinmon vin monitor pin - agnd 4 imon - corevdd agnd 5 outs charging current sense pin 1 - agnd 6 agnd1 gnd pin corevdd agnd 7 outp1 output voltage pin - agnd 8 outp2 output voltage pin - agnd 9 sw1 inductor connect pin - - 10 sw2 inductor connect pin - - 11 sw3 inductor connect pin - - 12 outpm charging current sense pin 2 - agnd 13 pgnd1 gnd pin corevdd agnd 14 pgnd2 gnd pin corevdd agnd 15 pgnd3 gnd pin corevdd agnd 16 corevdd internal power supply 1 corevdd agnd 17 v18 internal power supply 2 v18 agnd 18 sel dcdc switching frequency changing pin sel = gnd 160khz sel = vin 320khz vin agnd 19 vin solar battery input pin vin agnd 20 osc logic frequency adjustment pin v18 agnd 21 pcomp phase compensation pin v18 agnd 22 agnd2 gnd pin v18 agnd 23 enb chip enable pin (on:l off:h) - agnd 24 vio power supply pin for interface when i2c interface is not used, please connect vio pin to corevdd pin. vio agnd vqfn024v4040vq datasheet d a t a s h e e t . 11/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com how to select parts of application datasheet d a t a s h e e t . 12/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com notes of board layout bu1840amuv is switching dcdc converter, so characteristics of noise and etc changing by board layout. please note the following respect besides a general board layout matter when you make pcb. sel v18 corevdd pgnd3 pgnd2 pgnd1 scl sda vinmon imon outs agnd1 low or high about heat loss in the heat design, please operate it in the following condition. (please consider the margin etc. because the fo llowing temperature is a guarantee temperature.) 1. surrounding temperature ta must be 85 or less. 2. loss of ic must be permissible loss pd or less. the allowable dissipation (pd) characteristics are described below. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 25 50 75 100 125 temperature ( ) power dissipation : pd (w) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 25 50 75 100 125 temperature ( ) power dissipation : pd (w) 4layer(74.2 74.2mm)boad (1,4layer heat radiation copper foil 6.28mm 2 ) (2,3layer heat radiation copper foil 5500mm 2 ) 1layer(74.2 74.2mm)boad (surface heat radiation copper foil 6.28mm 2 datasheet d a t a s h e e t . 13/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com caution on use 1 absolute maximum ratings an excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. 2 the power supply and the gnd lines design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. please take care about interference by common impedance of the wiring pattern when there are two or more power supply and gnd line. for the gnd line, please note the separation of the large current route and the small signal route including the external circuit.furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. 3 gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. 4 short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. 5 operation in strong electromagnetic field be noted that using ics in the strong electromagnetic field can malfunction them. 6 input terminals in terms of the construction of ic, parasitic elements are inevit ably formed in relation to potential. the operation of the par asitic element can cause interference with circuit operation, thus resu lting in a malfunction and then breakdown of the input terminal . therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower th an the gnd respectively, so that any parasitic element will operat e. furthermore, do not apply a voltage to the input terminals wh en no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input term inals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. 7 external capacitor in order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. 8 thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. moreover, please use it within the range where output tr doesn't exceed the rated voltage and aso. 9 rush current in cmos ic, when the power supply is turned on rush current might flow momentarily in logical internal irregular state. therefore, note drawing the capacity of the power supply coupling, the power supply, and width and drawing the gnd pattern wiring, please. 10 test terminal and unused terminal processing please process a test terminal and unused terminal according to explanations of the function manual and the application note, etc. to be unquestionable while real used. moreover, please inquire of the person in charge of our company about the terminal without the explanation especially. (11)content of material the application notes etc. are the design material to design the application, and no one of the content securing it. please dec ide the application after it examines enough and it evaluates it including external parts. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority datasheet d a t a s h e e t . 14/14 bu1840amuv tsz02201-0q1q0aj00130-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.aug.2012 rev.001 tsz22111 ? 15 ? 001 www.rohm.com ordering part number b u 1 8 4 0 a m u v - e 2 part no. package wrapping forming specification muv : vqfn024v4040 e2: reel emboss taping physical dimension tape and reel information marking diagram(s) (unit : mm) vqfn024v4040 0.08 s s 16 7 12 19 24 13 18 0.4 0.1 0.02 +0.03 - 0.02 1pin mark 2.4 0.1 c0.2 0.5 4.0 0.1 0.75 2.4 0.1 4.0 0.1 1.0max (0.22) 0.25 +0.05 - 0.04 ? order quantity needs to be multiple of the minimum quantity. datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. |
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