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prepared by: date: spec.no. dg99f5040 xm /i6 /sq w issue j&16/99 7-a usda page 10 pages approved by: date: electro~c coh4ponents group representative division: ji?! 1 /t/ ps . sharp corporation fkl.,+ / specification opto-electronic devices division device specification for light emitting diode model no. GL5ZV44 1. these specification sheets include materials protected under the copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharp?s consent. 2. when using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the following application areas; l * oa equipment * audio visual equipment * home appliance * telecommunication equipment (terminal) * measuring equipment * tooling machines * computers i if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; l * transportation control and safety equipment (aircraft, train, automobile etc.) * traffic signals * gas leakage sensor breakers * rescue and security equipment * other safety equipment 1 (3) please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; c * space equipment * telecommunication equipment (for trunk lines) * nuclear power control equipment * amedical equipment 1 (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. customer?s approval ?date: by: date: c2-l.i //8/ 099 presented by: m.katoh, c%..mj department general manager of engineering deptjii opto-electronic devices division electronic components group sharp corporation
dg996040 jun/16/99 model no. page GL5ZV44 l/10 GL5ZV44 snecification 1. application ?l?h.k spxi.fication applies to the light emitting dicde &vice model no. GL5ZV44. [algahp (dicing or scribe/brake type) amber led device] 2. outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 3-4. 3-l. absolute maximum ratings 3-2. electra-optical characteristics 3-3. derating curve 3-4. characteristics diagram 4. reliability .,..................................................... refer to the attached sheet page 5. 4-l. test items and test conditions 4-2. measurement items and failure judgement criteria 5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 6. 5- 1. applied standard 5-2. sampling method and level 5-3. test items, judgement criteria and classifica of defect 5-4. test items the surface is be applied for flat type, judgement criteria and classifxa of defect 6. supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* refer to the attached sheet page 7-8. 6-l. packing 6-2. luminous intensity rank 6-3. dominant wavelength rank 6-4. environment 7 ~ecau~onsforuse.............?...............?.............?... refer to the attached sheet page 9- 10. 7-1. lead forming method 7-2. notice of installation 7-3. soldering conditions .7-4. for cleaning
dg996040 model no. jun/l6/w page i glszv44 310 ?d $1 ln 0? i 9. pin connectioils q. anode 0. cathode ka.bte) unspecified tol. to be *o&ku (note) cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. unit mal matelial lead : (fe) cold rolled steel package : epoxy resin finish lead : sn plated or wave soldering drawing no. 51106021
j?g996040 i jun/16/99 1 page GL5ZV44 i 3/10 3. ratings and characteristics (note 1) duty ratio=1/1o,pulse width=&lms (note 2) at the position of 1.6mm from the bottom resin package (note 3) refer to the suplement item 6. regarding the standard of rank classification. 3-3. derating curve peak forward current derating curve forward current derating curve 120 3 h 100 g 80 z 2 60 2 g 40 b : 20 ?y lz 01 ? ? i i -25 0 25 50 75 85100 125 ambient temperature ta(?ci ambient temperature tarc)
dg996040 model no. juna6/99 page i GL5ZV44 1 4110 peak forward current vs. duty ratio (ta=25?c) l/l00 l/10 1 10 duty raito dr 3-4. characteristics diagram(m) (note 1) forward current vs.forward voltage (ta=25"c) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 forward voltage vfw relative luminous intensity vs. froward voltage cta=25?c) 1000 .$ .- i 100 2 10 ii oh .e b 9 1 .j e .- 0. 1 z .- b 0.01 0. 1 1 10 loo forward current ifha) relative luminous intensity vs. ambient temperature ( i f=2orn4) -60 -40 -20 0 20 40 60 80 100 120 ambient temprature ta("c)_ (note 1) above characteristic data are typical data and not a guarantteed data.
dg996040 junj16/!w model no. page i GL5ZV44 5110 4. reliability the reliability of products shall be satisfied with items listed below. 4-1. test items and test conditions confidence level: 90% test items test conditions samples (n) ltpd defective (c) (%i solderability 230f5?c, 5s prior disposition : dip in rosin flux n=ll, c=o 20 soldering 26o+sc, 5s 20 temperature n=ll, c=o mechanical shock 15 ooom/s*, 0.5ms, 3times 1 kx+y sz direction n=ll, c=o 20 variable frequency 2oom/s*, 100 to 2 000 to loohz./sweep for 4min. vibration ,&imesk.x,~y,fz direction n=li, c=o 20 terminal strength weight:lon, ss/each terminal n=ll, c=o 20 (tension) terminal strength weight:sn,o? + 90? + 0% -90? + 0? (bend&9 /each terminal n=ll, c=o 20 temperature cycling -40@c(3omin)~+100?c(3omin),30 cycles i n=22, c=o i 10 ii&h temp? and high humidity storage ta=+60?c, 9o%rh, t=loooh n=22, c=o 10 i iigh temperature storage ta=loo?c, t=loooh n=22, c==o 10 l aw temperature storage ta=-40?c, t=loooh i i n=22, c=o i 10 operation life i ta=25?c, if max, t=loooh *3 i n=22, c==o i 10 4 1-2. ! measurement items and failure judgement criteria * 1 measurement symbol failure judgement criteria *2 forward voltage vf v, > u.s.l. x 1.2 reverse current ir ia > u.s.l. x 2.0 luminous intensity iv iv > the first stage value x 2.0 or the first stage value x 0.5 > iv % solderability : solder shall be adhere at the area of 95% or more of dipped portion. z terminal strength : package is not destroyed, and terminal is not slack * 1: measuring condition is in accordance with specification. *2: u.s.l. is shown by upper specification limit. *3: if max.is shown by forward current of absolute maximum ratings.
dgw6040 junl16l99 modelno. page GL5ZV44 6/10 5. incoming inspection 5-l. applied standard : is0 2859-l 5-2. sampling method and level : a single sampling plan,normal inspection level ii : aql major defect : 0.065% minor defect : 0.4% 1 q 5-3. test items, judgement criteria and classifica of defect no. test items judgement criteria 1 discomection not emit light 2 position of cutting off rim different from dimension 3 reverse terminal different from dimension 4 outline dimensions not satisfy outline specification characteristics cut off the rim foreign substance scratch void over the limit value of specification at vr, i,, and iv exceed -0.2mm white point : exceed d 0.3mm (on top view) black point : exceed $0.3mm (on top view) string form : exceed 3.omm (on top view) exceed d 0.3mm or o.lmm x l.omm (on top view) exceed 4 0.3mm (on top view) uneven density of mated for scattering extremely uneven density 11 unbalanced center 12 burr exceed fo.25mm from package center exceed +0.2mm againstprovided dimension 13 insertion position of terminal insertion position of terminal :lassifica of defec major defect minor defect 5-4. test items the surface is be applied for flat type, judgement criteria and classifica of defect no. test items judgement criteria classifica of defect 14 chapped the surface the surface chapped is striking for see the lamp top minor defect 15 hollow the surface the surface hollow is striking for see the lamp top l
model no. GL5ZV44 page 7110 6. supplement 6-1. packing 6-l-l. inner package put 25opcs the same luminous intensity rank products into pack and put following label by pack. product weight : 0.28g (one producftyp.) (indication label sample) shiphent table part no. GL5ZV44 - model number quantity 250 - quantity of products *cl cl q ocln[7 - --- lot no. ka99b19 +lotnumber* a 0 o@ 0 o-o c-- luminous intensity rank sharp? dominant wavelength rank made in japan + production country 0 production plant code(to be indicated alphabetically) @ support code @ year of production(the last two figures of the year) @ month of production (to be indicated alphabetically with january corresponding to a) 0 date of production(01 n 3 1) 6-l-2. outer package put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. outer package out line dimension width: 14omm, depth: 225n~n, l-light: 9omm 6-2.luminous intensity rank (note 1) (t.a=25?c) i rank i (note 1) tolerance:fls% in regard to iurninous intensity , the following ranking shall be carried out. however the quantity of each rank shall not be pre scribed. en case of the distribution of the iuminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. 6-3.dominant wavelength rank (note 2) (ta=25@c ) i rank i dominant wavelength 1 unit 1 condition h 581.0 - 584.5 ; i 583.5 - 587.0 i- -- . 1 j 586.0 - 589.5 ml 1~2urila k 588.5 - 592.0 l 591.0 - 594.5 \ (note 2) the condition of measurement : the measurement of the light emission from the front side of lamp. this rank value is the setting value of when that classifies it the rank and be not a guarantee value. also i shall not ask the delivery ratio of each rank.
do996040 junl16l99 model. no. page glszv44 8110 6-4. environment 64 1. ozonosphere destructive chemicals. (1) the device doesn?t contain following substance. (2) the device doesn?t have a production line whose process requires following substance. restricted part: c2fcsjlalones,cct,trichloroethane(methyc~~fo~) 642. bromic non-burning materials the &vice doesn?t contain bromic non-burning materials(pbbos,.pbbs)
glszv44 g/10 7 - 1. lead forming method avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. lead pins should be formed before soldering. 7 - 2. notice of installation 7-2-l installation on a p w b when mounting an led lamp on a pwb,do not apply physical stress to the lead pins. *the lead pin pitch should match the pwei pin-hole pitch:absolutely avoid widening or narrowing the lead pins. l lhen positioning an led lamp,basically employ an led with tie-bar cut or use a spacer. 7-2-2 when an led 1 is mounted directly on a p wb if the bottom face of an led lamp is mounted directly on single-sided pwb,the base of the lead pins may be subjected to physical stress due to pwb warp,cutting or clinching of lead pins. prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc,,is found-when an led lamp is mounted on a double-sided pwb,the heat during soldering affects the resin;therefore,keep the led lamp more that 1.6mm afloat above the pwb. 7-2-3 installation using a holder during an led lamp positioning,when a holder is used.a holder should be designed not to subject lead pins to any undue stress. (note)pay attention to the thermal expansion coefficient of the material used for the holder.since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 installation to the case do not fix part c with adhesives when fixed to the case as shown in figure.d hole of the case should be designed not to subject the inside of resin to any undue stress. db96040 model no. jun/16/99 page ng good i 1 0 n ~ l 611
jx996040 model no. juld16/9!i page i GL5ZV44 i lo/lo 7 - 3. s oldering conditions solder thi _~ --.e lead pins under the following conditions 1 type of soldering ! conditions _ _--- -a- . . . - l.manual soldering 1 295t*5c, wlthin 3 seconds 2. wave soldering 1 260c +yc. within 5 seconds . mm?- ) 8o?c, within 30 seconds 3. auto soldering preheating ?fu?c tc soldering 245?ct5?c, within 5 seconds i (note> avoid dipping resin into soldering bath avoid applying stress to lead pins while they are heated-for example , when the led lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur. ins iron 7 - 4. for cleaning (1) solvent cleaning : solvent temperature 45c or less immersion for 3 min or less ( 2 > ultrasonic cleaning ( 3 > applicable solvent the effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time,plrb size or device mounting condition etc. please test it in actual using condition and confirm that doesn?t occur any defect before starting the ultrasonic cleaning. ethyl alcohol, yethyl alcohol, isopropyl alcohol in case when the other solvent is used,there are cases that the packaging resin is eroded. please use the other solvent after thorough confirmation is performed in actual using condition.

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