surface mount rf pin diodes in sot-363 (sc-70, 6 lead) technical data features ? diodes optimized for: ultra-low distortion switching microwave frequency operation ? surface mount sot-363 (sc-70)package single, pair, and trio versions tape and reel options available ? low failure in time (fit) rate* * for more information see the surface mount pin reliability data sheet. package lead code identification (top view) description/applications the hsmp-389 l/t/u is optimized for switching applications where low resistance at low current, and low capacitance are required. hsmp-389 l/t/u absolute maximum ratings [1] , t c = + 25 c symbol parameter unit absolute maximum i f forward current (1 m s pulse) amp 1 p iv peak inverse voltage v same as v br t j junction temperature c 150 t stg storage temperature c -65 to 150 q jc thermal resistance [2] c/w 140 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. t c = 25 c, where t c is defined to be the temperature at the package pins where contact is made to the circuit board. gu 1 2 3 6 5 4 pin connections and package marking notes: 1. package marking provides orientation and identification. 2. see electrical specifications for appropriate package marking. series shunt pair low inductance single t unconnected trio l 123 654 123 654 123 654 u
2 electrical specifications, t c = +25 c, each diode pin switching diodes minimum maximum maximum part package breakdown total total number marking lead voltage resistance capacitance hsmp- code [1] code configuration v br (v) r t ( w )c t (pf) 389l gl l unconnected trio 100 2.5 0.30 389t gt t low inductance single 389u gu u series-shunt pair test conditions v r = v br i f = 5 ma v r = 5 v measure f = 100 mhz f = 1 mhz i r 10 m a typical parameters at t c = +25 c part number total resistance carrier lifetime reverse recovery time total capacitance hsmp- r t ( w ) t (ns) t rr (ns) (pf) 389a series 3.8 200 test conditions i f = 1 ma i f = 10 ma v r = 10 v 50 v f = 100 mhz i r = 6 ma i f = 20 ma 90% recovery note: 1. package marking code is laser marked.
3 hsmp-389a series typical performance, t c = 25 c, each diode 10000 1000 100 10 1 0.1 rf resistance (ohms) i f ?forward bias current (ma) 0.01 0.1 1 10 100 figure 1. total rf resistance at 25 c vs. forward bias current. 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 102030 40 50 v r ?reverse voltage (v) c t ?capacitance (pf) figure 2. capacitance vs. reverse voltage at 1 mhz. 120 115 110 105 100 95 90 85 11030 i f ?forward bias current (ma) figure 3. 2nd harmonic input intercept point vs. forward bias current. input intercept point (dbm) hsmp-3880 diode mounted as a series switch in a 50 microstrip and tested at 123 mhz 200 160 120 80 40 0 10 20 15 25 30 t rr ?reverse recovery time (ns) forward current (ma) figure 4. typical reverse recovery time vs. reverse voltage. v r = 2v v r = 5v v r = ?0v 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (v) figure 5. forward current vs. forward voltage. 125 c 25 c ?0 c
4 typical applications for multiple diode products figure 6. hsmp-389l used in a sp3t switch. 1 1 2 3 4 0 56 b1 b2 b3 2 3 1 11 rf in rf out 2 2 3 456 1 0 0 2 +v ? ?n ?ff rf in rf out 1 +v 0 2 0 +v ?n ?ff 4 5 6 1 11 2 2 3 figure 7. hsmp-389l unconnected trio used in a dual voltage, high isolation switch. figure 8. hsmp-389l unconnected trio used in a positive voltage, high isolation switch.
5 typical applications for multiple diode products (continued) figure 9. hsmp-389t used in a low inductance shunt mounted switch. rf in rf out 4 5 6 12 3 pa bias hsmp-389u lna figure 10. hsmp-389u series/shunt pair used in a transmit/ receive switch. figure 11. tx/rx switch configuration. l 4 rcvr 1 rcvr l 4 xmtr xmtr bias ant bias antenna 2 3 6 5 4
6 assembly information sot-363 pcb footprint a recommended pcb pad layout for the miniature sot-363 (sc-70, 6 lead) package is shown in figure 12 (dimensions are in inches). this layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair performance. 0.026 0.075 0.016 0.035 figure 12. pcb pad layout (dimensions in inches). smt assembly reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., ir or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. components with a low mass, such as the sot-363 package, will reach solder reflow temperatures faster than those with a greater mass. hps sot-363 diodes have been qualified to the time-temperature profile shown in figure 13. this profile is representative of an ir reflow type of surface mount assembly process. after ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. the preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. the reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. the rates of change of tempera- ture for the ramp-up and cool- down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. the maximum temperature in the reflow zone (t max ) should not exceed 235 c. these parameters are typical for a surface mount assembly process for hp sot-363 diodes. as a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. time (seconds) t max temperature ( c) 0 0 50 100 150 200 250 60 preheat zone cool down zone reflow zone 120 180 240 300 figure 13. surface mount assembly profile.
7 device orientation user feed direction cover tape carrier tape reel end view 8 mm 4 mm top view ## ## ## ## note: ?#?represents package marking code. package marking is right side up with carrier tape perforations at top. conforms to electronic industries rs-481, ?aping of surface mounted components for automated placement.?standard quantity is 3,000 devices per reel. tape dimensions for outline sot-363 (sc-70, 6 lead) p p 0 p 2 f w c d 1 d e a 0 8 max. t 1 (carrier tape thickness) t t (cover tape thickness) 5 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.24 0.10 2.34 0.10 1.22 0.10 4.00 0.10 1.00 + 0.25 0.088 0.004 0.092 0.004 0.048 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.255 0.013 0.315 0.012 0.010 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape
2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. xx 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters (inches) package marking code package dimensions outline sot-363 (sc-70, 6 lead) package characteristics lead material ........................................................................................ copper lead finish............................................................................. tin-lead 85/15% maximum soldering temperature ............................... 260 c for 5 seconds minimum lead strength ........................................................... 2 pounds pull typical package inductance ................................................................... 2 nh typical package capacitance .............................. 0.08 pf (opposite leads) for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1997 hewlett-packard co. printed in u.s.a. 5966-2028e (10/97) part number ordering information part number no. of devices container hsmp-389a-tr1* 3000 7" reel hsmp-389a-blk* 100 antistatic bag * where a = l, t or u
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