microwave corporation 12 - 114 for price, delivery, and to place orders, please contact hittite microwave corporation: 12 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order online at www.hittite.com mixers - smt 12 HMC292LM3C v00.0302 general description features functional diagram input ip3: +19 dbm lo / rf isolation: 25 to 40 db passive: no dc bias required leadless smt package, 25mm 2 electrical speci cations, t a = +25?c typical applications the HMC292LM3C is ideal for: microwave point to point radios multi-point/lmds radios satcom the HMC292LM3C is a 17 - 31 ghz surface mount passive gaas mmic double-balanced mixer in a smt leadless chip carrier package. the mixer can be used as a downconverter or upconverter. excellent isolations are provided by on-chip baluns, which require no external com- ponents and no dc bias. all data is with the non- hermetic, epoxy sealed lm3c packaged device mounted in a 50 ohm test ? xture. utilizing the HMC292LM3C eliminates the need for wirebond- ing, thereby providing a consistent connection interface for the customer. gaas mmic double-balanced smt mixer, 17 - 31 ghz parameter lo= +13 dbm, if= 1 ghz lo= +13 dbm, if= 1 ghz units min. typ. max. min. typ. max. frequency range, rf & lo 18 - 28 17 - 31 ghz frequency range, if dc - 6 dc - 6 ghz conversion loss 7.5 9.5 8 11 db noise figure (ssb) 7.5 9.5 8 11 db lo to rf isolation 26 35 21 32 db lo to if isolation 20 25 20 25 db rf to if isolation 22 33 20 30 db ip3 (input) 17 19 15 19 dbm ip2 (input) 45 50 42 50 dbm 1 db gain compression (input) 8 12 8 12 dbm
microwave corporation 12 - 115 for price, delivery, and to place orders, please contact hittite microwave corporation: 12 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order online at www.hittite.com mixers - smt 12 v00.0302 -20 -15 -10 -5 0 15 20 25 30 35 +25 c -40 c +85 c conversion gain (db) frequency (ghz) -50 -40 -30 -20 -10 0 15 20 25 30 35 rf/if lo/rf lo/if isolation (db) frequency (ghz) conversion gain vs. temperature @ lo = +13 dbm HMC292LM3C -20 -15 -10 -5 0 15 20 25 30 35 lo = + 9 dbm lo = + 11 dbm lo = + 13 dbm lo = + 15 dbm conversion gain (db) frequency (ghz) -20 -15 -10 -5 0 0246810 return loss conversion gain response (db) if frequency (ghz) -20 -15 -10 -5 0 15 20 25 30 35 lo rf return loss (db) frequency (ghz) -20 -15 -10 -5 0 15 20 25 30 35 conversion gain (db) frequency (ghz) isolation @ lo = +13 dbm conversion gain vs. lo drive rf & lo return loss @ lo = +13 dbm if bandwidth @ lo = +13 dbm upconverter performance conversion gain @ lo = +13 dbm gaas mmic double-balanced smt mixer, 17 - 31 ghz
microwave corporation 12 - 116 for price, delivery, and to place orders, please contact hittite microwave corporation: 12 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order online at www.hittite.com mixers - smt 12 -5 0 5 10 15 20 25 15 20 25 30 35 lo= 8 dbm lo= 10 dbm lo= 13 dbm input ip3 (dbm) frequency (ghz) -5 0 5 10 15 20 25 15 20 25 30 35 -40 c +25 c +85 c input ip3 (dbm) frequency (ghz) input ip3 vs. lo drive input ip3 vs. temperature @ lo = +13 dbm input ip2 vs. lo drive 0 10 20 30 40 50 60 70 80 15 20 25 30 35 lo= 8 dbm lo= 10 dbm lo= 13 dbm input ip2 (dbm) frequency (ghz) input ip2 vs. temperature @ lo = +13 dbm mxn spurious outputs 0 10 20 30 40 50 60 70 80 15 20 25 30 35 -40 c +25 c +85 c input ip2 (dbm) frequency (ghz) input p1db vs. temperature @ lo = +13 dbm 5 7 9 11 13 15 15 20 25 30 35 -40 c +25 c +85 c input p1db (dbm) frequency (ghz) v00.0302 HMC292LM3C gaas mmic double-balanced smt mixer, 17 - 31 ghz nlo mrf01234 0xx11 117039 2707776 3936986 4 >110 >110 >110 rf= 21 ghz @ -10 dbm lo= 22 ghz @ +13 dbm all values in dbc below the if power level.
microwave corporation 12 - 117 for price, delivery, and to place orders, please contact hittite microwave corporation: 12 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order online at www.hittite.com mixers - smt 12 outline drawing absolute maximum ratings v00.0302 HMC292LM3C gaas mmic double-balanced smt mixer, 17 - 31 ghz rf / if input +13 dbm lo drive +27 dbm storage temperature -65 to +150 deg c operating temperature -40 to +85 deg c notes: 1. material: plastic 2. plating: gold over nickel 3. dimensions are in inches [millimeters]. 4. all tolerances are 0.005 [ 0.13]. 5. all grounds must be soldered to pcb rf ground. 6. indicates pin 1
microwave corporation 12 - 118 for price, delivery, and to place orders, please contact hittite microwave corporation: 12 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order online at www.hittite.com mixers - smt 12 pin number function description interface schematic 1, 2, 3 n/c this pin may be connected to the housing ground or left unconnected. 4 rf rf port. this pin is dc coupled and matched to 50 ohm from 18 - 31 ghz 5if if port. this pin is dc coupled. for applications not requiring operation to dc, this port should be dc blocked externally using a series capacitor whose value has been chosen to pass the necessary if frequency range. for operation to dc, this pin must not source/sink more than 2 ma of current or die non-function and possible die failure will result. 6lo lo port. this pin is dc coupled and matched to 50 ohm from 18 - 31 ghz. gnd package base must be soldered to pcb rf ground. v00.0302 HMC292LM3C gaas mmic double-balanced smt mixer, 17 - 31 ghz pin descriptions
microwave corporation 12 - 119 for price, delivery, and to place orders, please contact hittite microwave corporation: 12 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order online at www.hittite.com mixers - smt 12 v00.0302 HMC292LM3C gaas mmic double-balanced mixer, 18 - 31 ghz the grounded co-planar wave guide (cpwg) pcb input/output transitions allow use of ground-signal- ground (gsg) probes for testing. suggested probe pitch is 400mm (16 mils). alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors. evaluation pcb evaluation circuit board layout design details lm3 package mounted to evaluation pcb layout technique micro strip to cpwg material rogers 4003 with 1/2 oz. cu dielectric thickness 0.008? (0.20 mm) microstrip line width 0.018? (0.46 mm) cpwg line width 0.016? (0.41 mm) cpwg line to gnd gap 0.005? (0.13 mm) ground via hole diameter 0.008? (0.20 mm)
microwave corporation 12 - 120 for price, delivery, and to place orders, please contact hittite microwave corporation: 12 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order online at www.hittite.com mixers - smt 12 v00.0302 HMC292LM3C gaas mmic double-balanced smt mixer, 17 - 31 ghz suggested lm3-c pcb land pattern tolerance: 0.003? ( 0.08 mm)
microwave corporation 12 - 121 for price, delivery, and to place orders, please contact hittite microwave corporation: 12 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order online at www.hittite.com mixers - smt 12 v00.0302 HMC292LM3C gaas mmic double-balanced smt mixer, 17 - 31 ghz HMC292LM3C recommended smt attachment technique preparation & handling of the lm3-c millimeterwave package for surface mounting the hmc lm3-c package was designed to be compatible with high volume surface mount pcb assembly processes. the lm3-c package requires a speci? c mounting pattern to allow proper mechanical attachment and to optimize electrical perfor- mance at millimeterwave frequencies. this pcb layout pattern can be found on each lm3-c product data sheet. it can also be provided as an electronic drawing upon request from hittite sales & application engineering. follow these precautions to avoid permanent damage: cleanliness: observe proper handling procedures to ensure clean devices and pcbs. lm3-c devices should remain in their original packaging until component placement to ensure no contamination or damage to rf, dc & ground contact areas. static sensitivity: follow esd precautions to protect against esd strikes. general handling: handle the lm3-c package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. avoiding damaging the rf, dc, & ground contacts on the package bottom. do not apply excess pressure to the top of the lid. solder materials & temperature pro? le: follow the information contained in the application note. hand soldering is not recommended. conductive epoxy attachment is not recommended. solder paste solder paste should be selected based on the user?s experience and be compatible with the metallization systems used. see the lm3-c data sheet outline drawing for pin & ground contact metallization schemes. solder paste application solder paste is generally applied to the pcb using either a stencil printer or dot placement. the volume of solder paste will be dependent on pcb and component layout and should be controlled to ensure consistent mechanical & electrical performance. excess solder may create unwanted electrical parasitics at high frequencies. solder re ow the soldering process is usually accomplished in a re? ow oven but may also use a vapor phase process. a solder re? ow pro? le is suggested above. prior to re? owing product, temperature pro? les should be measured using the same mass as the actual assemblies. the thermocouple should be moved to various positions on the board to account for edge and corner effects and vary- ing component masses. the ? nal pro? le should be determined by mounting the thermocouple to the pcb at the location of the device. follow solder paste and oven vendor?s recommendations when developing a solder re? ow pro? le. a standard pro? le will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. allow enough time between reaching pre-heat temperature and re? ow for the solvent in the paste to evaporate and the ? ux to completely activate. re? ow must then occur prior to the ? ux being completely driven off. the duration of peak re? ow temperature should not exceed 15 seconds. packages have been quali? ed to withstand a peak temperature of 235c for 15 seconds. verify that the pro? le will not expose device to temperatures in excess of 235c. cleaning a water-based ? ux wash may be used. 25 50 75 100 125 150 175 200 225 012345678 temperature ( 0 c) time (min)
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