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MC331 1210C91N CY7C199 1SMA4734 MCIMX25 BPX90 E001400 045CT
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  KHP rhp m a t c h e d s i l i c o n r e c t i f i e r e l e m e n t s r a t e d c u r r e n t t o 3 . 0 a m p e r e s p r v 5 , 0 0 0 t o 5 0 , 0 0 0 v o l t s f a s t r e c o v e r y ( r h p s e r i e s ) a l l a p p l i c a b l e m i l - s t d - 7 5 0 t e s t s h i g h t h e r m a l c o n d u c t i v i t y e n c a p s u l a t i o n max. reverse recovery time , t rr (fig.4) 2 0 0 n a n o s e c m a x . d c r e v e r s e c u r r e n t @ p r v a n d 2 5 o c , i r 2 5 0 a m p s s t o r a g e t e m p e r a t u r e r a n g e , t s t g a 5 a m b i e n t o p e r a t i n g t e m p e r a t u r e r a n g e , t a m a x . d c r e v e r s e c u r r e n t @ p r v a n d 1 0 0 o c , i r 2 4 0 a m p s 25 a - 5 5 t o + 1 5 0 o c o c - 5 5 t o + 1 5 0 o c o c r h p s e r i e s f a s t r e c o v e r y e l e c t r i c a l c h a r a c t e r i s t i c s ( a t t a = 2 5 c u n l e s s o t h e r w i s e s p e c i f i e d ) f r m m a x . o n e - h a l f c y c l e s u r g e c u r r e n t , i f m ( s u r g e ) @ 6 0 h z 8 2 6 . 0 0 4 . 0 b f r m m a x . d c r e v e r s e c u r r e n t @ p r v a n d 2 5 o c , i r 1 0 0 m a x . o n e - h a l f c y c l e s u r g e c u r r e n t , i f m a m p s s t o r a g e t e m p e r a t u r e r a n g e , t s t g a 5 a m b i e n t o p e r a t i n g t e m p e r a t u r e r a n g e , t a e l e c t r i c a l c h a r a c t e r i s t i c s ( a t t a = 2 5 c u n l e s s o t h e r w i s e s p e c i f i e d ) m a x . d c r e v e r s e c u r r e n t @ p r v a n d 1 0 0 o c , i r 4 0 0 a m p s 4 0 a - 5 5 t o + 1 5 0 o c o c - 5 5 t o + 1 5 0 o c o c k h p s e r i e s s t a n d a r d r e c o v e r y ( s u r g e ) @ 6 0 h z e d i t y p e n o . p e a k r e v e r s e v o l t a g e p r v ( v o l t s ) a v g . f w d . c u r r e n t i o a t 2 5 o c (am ps) m a x . f w d v o l t a g e drop at 25 o v f ( v o l t s ) d i m e n s i o n l i n c h e s fig .3 dim ens ion w i n c h e s fig .3 c a s e s t y l e f i g . 3 s t a n d a r d r e c o v e r y k h p 5 5 , 0 0 0 3 . 0 0 8 4 . 0 0 1 . 0 a k h p 6 6 , 0 0 0 9 4 . 7 5 1 . 0 a k h p 7 7 , 0 0 0 1 0 5 . 5 0 1 . 0 a k h p 8 8 , 0 0 0 1 1 6 . 0 0 1 . 0 a k h p 9 9 , 0 0 0 1 4 6 . 5 0 1 . 0 a k h p 1 0 1 0 , 0 0 0 1 5 7 . 0 0 1 . 0 a k h p 1 5 1 5 , 0 0 0 2 1 4 . 0 0 2 . 0 b k h p 2 0 2 0 , 0 0 0 2 8 6 . 0 0 2 . 0 b k h p 2 5 2 5 , 0 0 0 3 6 8 . 0 0 2 . 0 b k h p 3 0 3 0 , 0 0 0 4 2 4 . 0 0 3 . 0 b k h p 3 5 3 5 , 0 0 0 4 9 6 . 0 0 3 . 0 b k h p 4 0 4 0 , 0 0 0 6 3 8 . 0 0 3 . 0 b k h p 5 0 5 0 , 0 0 0 7 0 6 . 0 0 4 . 0 b 2 0 0 n a n o s e c o n d r e c o v e r y ( f i g . 4 ) r h p 5 5 , 0 0 0 2 . 5 0 1 0 4 . 0 0 1 . 0 a r h p 6 6 , 0 0 0 2 . 5 0 1 1 4 . 7 5 1 . 0 a r h p 7 7 , 0 0 0 2 . 5 0 1 2 5 . 5 0 1 . 0 a r h p 8 8 , 0 0 0 2 . 5 0 1 3 6 . 0 0 1 . 0 a r h p 9 9 , 0 0 0 2 . 5 0 1 6 6 . 5 0 1 . 0 a r h p 1 0 1 0 , 0 0 0 2 . 5 0 1 7 7 . 0 0 1 . 0 a r h p 1 5 1 5 , 0 0 0 2 . 2 5 2 5 4 . 0 0 2 . 0 b r h p 2 0 2 0 , 0 0 0 2 . 2 5 3 3 6 . 0 0 2 . 0 b r h p 2 5 2 5 , 0 0 0 2 . 2 5 4 2 8 . 0 0 2 . 0 b r h p 3 0 3 0 , 0 0 0 2 . 2 5 5 0 4 . 0 0 3 . 0 b r h p 3 5 3 5 , 0 0 0 2 . 2 5 5 8 6 . 0 0 3 . 0 b r h p 4 0 4 0 , 0 0 0 2 . 2 5 6 5 8 . 0 0 3 . 0 b r h p 5 0 5 0 , 0 0 0 2 . 2 5 k i l o v o l t h i g h c u r r e n t r e c t i f i e r a s s e m b l i e s f o r w a r d c u r r e n t r e p e t i t i v e p e a k , i f o r w a r d c u r r e n t r e p e t i t i v e p e a k , i e d i r e s e r v e s t h e r i g h t t o c h a n g e t h e s e s p e c i f i c a t i o n s a t a n y t i m e w i t h o u t n o t i c e . 2 . 7 5 2 . 7 5 2 . 7 5 2 . 5 0 2 . 5 0 2 . 5 0 2 . 2 5 2 . 2 5 2 . 2 5 2 . 2 5 2 . 2 5 2 . 2 5 3 a m p s c a n d
100 75 50 25 0 0 25 50 75 100 125 150 fig.1 output current vs ambient temperature fig.2 non-repetitive surge current fig.3package style 21 gray oaks a venue * yonkers. new york 10710 914-965-4400 * fax 914-965-5531 * 1-800-678-0828 electronic devices, inc. designers and manufacturers of solid sta te devices since 1951. ambient temperature ( o c) prior to the manufacture of these assemblies, the individual silicon junction is measured formaximum recovery time in the test circuit shown. % r a t e d f w d c u r r e n t it is recommended that a proper heat sink be used on the terminals of this device between the body and the soldering point to prevent damage form excess heat. e e - m a i l : s a l e s @ e d i d i o d e s . c o m w w e b s i t e : h t t p : / / w w w . e d i d i o d e s . c o m * l r r 1 , 2 n o n - i n d u c t i v e r e s i s t o r s p u l s e g e n e r a t o r - h e w l e t t p a c k a r d 2 1 4 a o r e q u i v . i k c r e p . r a t e , 1 0 s e c . p u l s e w i d t h a d j u s t p u l s e a m p l i t u d e f o r p e a k i r test circuit fig.4 typical reverse recovery wa veform p u l s e g e n e r a t o r d . u . t . s c o p e r 2 1 o h m r 1 5 0 o h m + - KHP rhp 1 0 0 5 0 1 2 3 4 6 1 0 2 0 3 0 4 0 6 0 8 n u m b e r o f c y c l e s ( 6 0 h z ) 2 0 3 0 7 0 1 5 0 2 0 0 3 0 0 8 0 1 0 0 i f s m . p e a k s u r g e c u r r e n t ( a m p ) 1.0a 0.5a t rr zero refe renc e 0.25a r h p k h p 1 8 - 3 2 t h r e a d x / d e e p 4 ( 4 ) m t g . i n s e r t s 1 4 1 w c a s e s t y l e b o u t l i n e 3 8 max. l 1 6 - 3 2 t h r e a d x / d e e p 4 ( 2 ) m t g . i n s e r t s 1 4 1 4 1 w c a s e s t y l e a o u t l i n e 1 8-32 thread x / deep 4 (2) mtg. inserts 1 4 1 4 4 0 0 2 4 0


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