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1. general description the isp1102 universal serial bus (usb) transceiver is fully compliant with universal serial bus speci?cation rev. 2.0 . the isp1102 can transmit and receive usb data at full-speed (12 mbit/s). the transceiver allows usb application-speci?c integrated circuits (asics) and programmable logic devices (plds) with power supply voltages from 1.65 v to 3.6 v to interface with the physical layer of the usb. the transceiver has an integrated 5 v-to-3.3 v voltage regulator for direct powering through usb supply line v bus . the transceiver has an integrated voltage detector to detect the presence of the v bus voltage (v cc(5v0) ). when v cc(5v0) or vreg3v3 is lost, the dp and dm pins can be shared with other serial protocols. the transceiver is a bidirectional differential interface and is available in hbcc16 and hvqfn14 packages. the transceiver is ideal for use in portable electronic devices, such as mobile phones, digital still cameras, personal digital assistants (pdas) and information appliances (ias). 2. features n complies with universal serial bus speci?cation rev. 2.0 n supports data transfer at full-speed (12 mbit/s) n integrated 5 v-to-3.3 v voltage regulator to power through usb line v bus n v bus voltage presence indication on pin vbusdet n vp and vm pins function in bidirectional mode, allowing pin count saving for the asic interface n used as usb device transceiver or usb host transceiver n stable rcv output during single-ended zero (se0) condition n two single-ended receivers with hysteresis n low-power operation n supports i/o voltage range from 1.65 v to 3.6 v n 12 kv electrostatic discharge (esd) protection (for the isp1102w) at the dp, dm, v cc(5v0) and gnd pins n full industrial operating temperature range from - 40 cto+85 c n available in hbcc16 and hvqfn14 lead-free and halogen-free packages isp1102 advanced universal serial bus transceiver rev. 05 11 december 2007 product data sheet
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 2 of 25 nxp semiconductors isp1102 advanced usb transceiver 3. applications n portable electronic devices, such as: u mobile phone u digital still camera u personal digital assistant (pda) u information appliance (ia) 4. ordering information 5. block diagram table 1. ordering information type number package name description version isp1102w hbcc16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 3 0.65 mm sot639-2 isp1102bs hvqfn14 plastic thermal enhanced very thin quad ?at package; no leads; 14 terminals; body 2.5 2.5 0.85 mm sot773-1 fig 1. block diagram 004aaa207 v cc(i/o) v cc(5v0) voltage regulator 3.3 v 1.5 k w 33 w (1 %) 33 w (1 %) level shifter isp1102 softcon vreg3v3 gnd vpu3v3 dp dm oe rcv vp/vpo vm/vmo vbusdet suspend
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 3 of 25 nxp semiconductors isp1102 advanced usb transceiver 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin con?guration hbcc16 (top view) fig 3. pin con?guration hvqfn14 (top view) isp1102w transparent top view oe softcon vpu3v3 v cc(5v0) n.c. v cc(i/o) vbusdet rcv vp/vpo vm/vmo suspend vreg3v3 n.c. n.c. dp dm 004aaa755 1 2 3 4 5 13 12 11 10 9 16 15 14 6 7 8 004aaa756 isp1102bs vp/vpo dm rcv dp oe n.c. vm/vmo suspend v cc(i/o) vbusdet softcon vpu3v3 v cc(5v0) vreg3v3 transparent top view 3 8 2 9 1 10 4 5 6 7 14 13 12 11 terminal 1 index area table 2. pin description symbol [1] pin type description hbcc16 hvqfn14 oe 1 1 i input for output enable (cmos level with respect to v cc(i/o) , active low); enables the transceiver to transmit data on the usb bus input pad; push pull; cmos rcv 2 2 o differential data receiver output (cmos level with respect to v cc(i/o) ); driven low when input suspend is high; the output state of rcv is preserved and stable during an se0 condition output pad; push pull; 4 ma output drive; cmos vp/vpo 3 3 i/o single-ended dp receiver output vp (cmos level with respect to v cc(i/o) ); for external detection of se0, error conditions and speed of connected device; this pin also acts as drive data input vpo; see t ab le 3 and t ab le 4 bidirectional pad; push-pull input; 3-state output; 4 ma output drive; cmos vm/vmo 4 4 i/o single-ended dm receiver output vm (cmos level with respect to v cc(i/o) ); for external detection of se0, error conditions and speed of connected device; this pin also acts as drive data input vmo; see t ab le 3 and t ab le 4 bidirectional pad; push-pull input; 3-state output; 4 ma output drive; cmos
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 4 of 25 nxp semiconductors isp1102 advanced usb transceiver [1] symbol names with an overscore (for example, oe) indicate active low signals. suspend 5 5 i suspend input (cmos level with respect to v cc(i/o) ); a high level enables low-power state while the usb bus is inactive and drives output rcv to a low level input pad; push pull; cmos n.c. 6 - - not connected v cc(i/o) 7 6 - supply voltage for digital i/o pins (1.65 v to 3.6 v). when v cc(i/o) is not connected, the dp and dm pins are in 3-state. this supply pin is totally independent of v cc(5v0) and vreg3v3 and must never exceed the vreg3v3 voltage. vbusdet 8 7 o v bus indicator output (cmos level with respect to v cc(i/o) ); when v bus > 4.1 v, vbusdet = high and when v bus < 3.6 v, vbusdet = low; when suspend = high, the vbusdet function is invalid output pad; push pull; 4 ma output drive; cmos dm 9 8 ai/o negative usb data bus connection (analog, differential) dp 10 9 ai/o positive usb data bus connection (analog, differential) n.c. 11 - - not connected n.c. 12 - - not connected n.c. - 10 - not connected vreg3v3 13 11 - internal regulator option : regulated supply voltage output (3.0 v to 3.6 v) during 5 v operation; a decoupling capacitor of at least 0.1 m f is required regulator bypass option : used as a supply voltage input (3.3 v 10 %) for 3.3 v operation v cc(5v0) 14 12 - internal regulator option : supply voltage input (4.0 v to 5.5 v); can be directly connected to usb line v bus regulator bypass option : connect to vreg3v3 vpu3v3 15 13 - pull-up supply voltage (3.3 v 10 %); connect an external 1.5 k w resistor on dp (full-speed) this pin function is controlled by the softcon input: softcon = low vpu3v3 ?oating (high-z); ensures zero pull-up current softcon = high vpu3v3 = 3.3 v; internally connected to vreg3v3 softcon 16 14 i software controlled usb connection input; a high level applies 3.3 v to pin vpu3v3, which is connected to an external 1.5 k w pull-up resistor; this allows usb connect or disconnect signaling to be controlled by software input pad; push pull; cmos gnd exposed die pad exposed die pad - ground supply; down bonded to the exposed die pad (heat sink); to be connected to the pcb ground table 2. pin description continued symbol [1] pin type description hbcc16 hvqfn14
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 5 of 25 nxp semiconductors isp1102 advanced usb transceiver 7. functional description 7.1 function selection [1] signal levels on the dp and dm pins are determined by other usb devices and external pull-up or pull-down resistors. [2] in suspend mode (suspend = high), the differential receiver is inactive and output rcv is always low. the resume signaling is detected through single-ended receivers vp/vpo and vm/vmo. 7.2 operating functions [1] rcv* denotes the signal level on output rcv just before the se0 state occurs. this level is stable during the se0 period. 7.3 power supply con?gurations the isp1102 can be used with various power supply con?gurations, which can be changed dynamically. t ab le 7 provides an overview of power supply con?gurations. normal mode v cc(i/o) is connected. v cc(5v0) is connected only, or v cc(5v0) and vreg3v3 are connected. for the 5 v operation, v cc(5v0) is connected to a 5 v source (4.0 v to 5.5 v). the internal voltage regulator then produces 3.3 v for usb connections. for the 3.3 v operation, both v cc(5v0) and vreg3v3 are connected to a 3.3 v source (3.0 v to 3.6 v). v cc(i/o) is independently connected to a voltage source (1.65 v to 3.6 v), depending on the supply voltage of the external circuit. table 3. function selection suspend oe dp, dm rcv vp/vpo vm/vmo function low low driving or receiving active vpo input vmo input normal driving (differential receiver active) low high receiving [1] active vp output vm output receiving high low driving inactive [2] vpo input vmo input driving during suspend (differential receiver inactive) high high high-z [1] inactive [2] vp output vm output low-power state table 4. driving function using differential input data interface (pin oe=low) vm/vmo vp/vpo data low low se0 low high differential logic 1 high low differential logic 0 high high illegal state table 5. receiving function (pin oe = high) dp, dm rcv vp/vpo vm/vmo differential logic 0 low low high differential logic 1 high high low se0 rcv* [1] low low
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 6 of 25 nxp semiconductors isp1102 advanced usb transceiver sharing mode v cc(i/o) is connected only, v cc(5v0) is < 3.6 v and vreg3v3 is < 2.4 v. in this mode, the dp and dm pins are 3-stated and the isp1102 allows external signals of up to 3.6 v to share the dp and dm lines. the internal circuits of the isp1102 ensure that virtually no current (maximum 10 m a) is drawn through the dp and dm lines. the power consumption through pin v cc(i/o) drops to the low-power (suspended) state level. pins vbusdet and rcv are driven to low to indicate this mode. the vbusdet function is ignored during suspend mode of the isp1102. some hysteresis is built into the detection of vreg3v3 lost. [1] vp/vpo and vm/vmo are bidirectional pins. table 6. pin states in sharing mode pin sharing mode v cc(5v0) < 3.6 v vreg3v3 < 2.4 v v cc(i/o) 1.65 v to 3.6 v input vpu3v3 high-z (off) dp, dm high-z vp/vpo, vm/vmo [1] high-z rcv low vbusdet low oe, suspend, softcon high-z table 7. power supply con?guration overview v cc(5v0) con?guration special characteristics connected normal mode - < 3.6 v sharing mode dp, dm and vpu3v3 high-z; vbusdet is driven low
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 7 of 25 nxp semiconductors isp1102 advanced usb transceiver 7.4 power supply input options the isp1102 has two power supply input options. internal regulator pin v cc(5v0) is connected to 4.0 v to 5.5 v. the internal regulator is used to supply the internal circuitry with 3.3 v (nominal). the vreg3v3 pin becomes a 3.3 v output reference. regulator bypass pins v cc(5v0) and vreg3v3 are connected to the same supply. the internal regulator is bypassed and the internal circuitry is supplied directly from pin vreg3v3. the voltage range is 3.0 v to 3.6 v to comply with universal serial bus speci?cation rev. 2.0 . the supply voltage range for each input option is speci?ed in t ab le 8 . table 8. power supply input options input option v cc(5v0) vreg3v3 v cc(i/o) internal regulator supply input for internal regulator (4.0 v to 5.5 v) voltage reference output (3.3 v, 300 m a) supply input for digital i/o pins (1.65 v to 3.6 v) regulator bypass connected to vreg3v3 with maximum voltage drop of 0.3 v (2.7 v to 3.6 v) supply input (3.0 v to 3.6 v) supply input for digital i/o pins (1.65 v to 3.6 v)
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 8 of 25 nxp semiconductors isp1102 advanced usb transceiver 8. electrostatic discharge (esd) 8.1 esd protection for the hbcc package, the pins that are connected to the usb connector (dp, dm, v cc(5v0) and gnd) have a minimum of 12 kv esd protection. the 12 kv measurement is limited by the test equipment. capacitors of 4.7 m f connected from vreg3v3 to gnd and v cc(5v0) to gnd are required to achieve this 12 kv esd protection (see figure 4 ). remark: for the hvqfn package, the pins that are connected to the usb connector (dp, dm, v cc(5v0) and gnd) have a minimum of 7 kv esd protection. 8.2 esd test conditions a detailed report on test set up and results is available on request. fig 4. human body esd test model r d 1500 w r c 1 m w high voltage dc source 4.7 m f 4.7 m f v cc(5v0) vreg3v3 device under test c s 100 pf storage capacitor charge current limit resistor discharge resistance gnd a b 004aaa145
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 9 of 25 nxp semiconductors isp1102 advanced usb transceiver 9. limiting values [1] testing equipment limits measurement to only 12 kv. capacitors needed on v cc(5v0) and vreg3v3 (see section 8 ). [2] equivalent to discharging a 100 pf capacitor through a 1.5 k w resistor (human body model). 10. recommended operating conditions 11. static characteristics table 9. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc(5v0) supply voltage (5.0 v) - 0.5 +6.0 v v cc(i/o) input/output supply voltage - 0.5 +4.6 v v i input voltage - 0.5 v cc(i/o) + 0.5 v i lu latch-up current v i = - 1.8 v to +5.4 v - 100 ma v esd electrostatic discharge voltage pins dp, dm, v cc(5v0) and gnd; i li <3 m a for hbcc package [1] [2] - 12000 +12000 v pins dp, dm, v cc(5v0) and gnd; i li <3 m a for hvqfn package [2] - 7000 +7000 v all other pins; i li <1 m a [2] - 2000 +2000 v t stg storage temperature - 40 +125 c table 10. recommended operating conditions symbol parameter conditions min typ max unit v cc(5v0) supply voltage (5.0 v) 4.0 5.0 5.5 v v cc(i/o) input/output supply voltage 1.65 - 3.6 v v i input voltage 0 - v cc(i/o) v v ia(i/o) input voltage on analog i/o pins on pins dp and dm 0 - 3.6 v t j junction temperature - 40 - +125 c t amb ambient temperature - 40 - +85 c table 11. static characteristics: supply pins v cc(5v0) = 4.0 v to 5.5 v or v (vreg3v3) = 3.0 v to 3.6 v; v cc(i/o) = 1.65 v to 3.6 v; v gnd = 0 v; see t ab le 8 for valid voltage level combinations; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit v (vreg3v3) voltage on pin vreg3v3 internal regulator option; i load 300 m a [1] [2] 3.0 3.3 3.6 v i cc supply current transmitting and receiving at 12 mbit/s; c l = 50 pf on pins dp and dm [3] - 48ma i cc(i/o) supply current on pin v cc(i/o) transmitting and receiving at 12 mbit/s [3] - 12ma i cc(idle) idle and se0 supply current idle: v dp > 2.7 v, v dm < 0.3 v; se0: v dp < 0.3 v, v dm < 0.3 v [4] - - 300 m a i cc(i/o)(stat) static supply current on pin v cc(i/o) idle, se0 or suspend - - 20 m a
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 10 of 25 nxp semiconductors isp1102 advanced usb transceiver [1] i load includes the pull-up resistor current through pin vpu3v3. [2] the minimum voltage is 2.7 v in suspend mode. [3] maximum value characterized only, not tested in production. [4] excluding any load current and vpu3v3 or v sw source current to the 1.5 k w and 15 k w pull-up and pull-down resistors (200 m a typ.). [5] when v cc(i/o) < 2.7 v, the minimum value for v reg(3v3)th = 2.0 v for supply present condition. i cc(susp) suspend supply current suspend = high [4] --20 m a i cc(i/o)(sharing) sharing mode supply current on pin v cc(i/o) v cc(5v0) < 3.6 v - - 20 m a i load(sharing)dm sharing mode load current on pin dm v cc(5v0) < 3.6 v; softcon = low; v dm = 3.6 v --10 m a i load(sharing)dp sharing mode load current on pin dp v cc(5v0) < 3.6 v; softcon = low; v dp = 3.6 v --10 m a v cc(5v0)th supply voltage detection threshold (5.0 v) 1.65 v v cc(i/o) 3.6 v supply lost - - 3.6 v supply present 4.1 - - v v cc(5v0)hys supply voltage detection hysteresis (5.0 v) v cc(i/o) = 1.8 v - 70 - mv v cc(i/o)th supply voltage detection threshold (i/o) v (vreg3v3) = 2.7 v to 3.6 v supply lost - - 0.5 v supply present 1.4 - - v v cc(i/o)(hys) supply voltage detection hysteresis (i/o) v (vreg3v3) = 3.3 v - 0.45 - v v reg(3v3)th regulated supply voltage detection threshold (3.3 v) 1.65 v v cc(i/o) v (vreg3v3) ; 2.7 v v (vreg3v3) 3.6 v supply lost - - 0.8 v supply present [5] 2.4 - - v v reg(3v3)hys regulated supply voltage detection hysteresis (3.3 v) v cc(i/o) = 1.8 v - 0.45 - v table 11. static characteristics: supply pins continued v cc(5v0) = 4.0 v to 5.5 v or v (vreg3v3) = 3.0 v to 3.6 v; v cc(i/o) = 1.65 v to 3.6 v; v gnd = 0 v; see t ab le 8 for valid voltage level combinations; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit table 12. static characteristics: digital pins v cc(i/o) = 1.65 v to 3.6 v; v gnd =0v; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit v cc(i/o) = 1.65 v to 3.6 v input levels v il low-level input voltage - - 0.3v cc(i/o) v v ih high-level input voltage 0.6v cc(i/o) -- v output levels v ol low-level output voltage i ol = 100 m a - - 0.15 v i ol = 2 ma - - 0.4 v v oh high-level output voltage i oh = 100 m av cc(i/o) - 0.15 - - v i oh = 2 ma v cc(i/o) - 0.4 - - v
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 11 of 25 nxp semiconductors isp1102 advanced usb transceiver [1] if v cc(i/o) 3 v (vreg3v3) , then the leakage current will be higher than the speci?ed value. leakage current i li input leakage current [1] - 1-+1 m a capacitance c in input capacitance pin to gnd - - 10 pf example 1: v cc(i/o) = 1.8 v 0.15 v input levels v il low-level input voltage - - 0.5 v v ih high-level input voltage 1.2 - - v output levels v ol low-level output voltage i ol = 100 m a - - 0.15 v i ol = 2 ma - - 0.4 v v oh high-level output voltage i oh = 100 m a 1.5 - - v i oh = 2 ma 1.25 - - v example 2: v cc(i/o) = 2.5 v 0.2 v input levels v il low-level input voltage - - 0.7 v v ih high-level input voltage 1.7 - - v output levels v ol low-level output voltage i ol = 100 m a - - 0.15 v i ol = 2 ma - - 0.4 v v oh high-level output voltage i oh = 100 m a 2.15 - - v i oh = 2 ma 1.9 - - v example 3: v cc(i/o) = 3.3 v 0.3 v input levels v il low-level input voltage - - 0.9 v v ih high-level input voltage 2.15 - - v output levels v ol low-level output voltage i ol = 100 m a - - 0.15 v i ol = 2 ma - - 0.4 v v oh high-level output voltage i oh = 100 m a 2.85 - - v i oh = 2 ma 2.6 - - v table 12. static characteristics: digital pins continued v cc(i/o) = 1.65 v to 3.6 v; v gnd =0v; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit table 13. static characteristics: analog i/o pins dp and dm v cc(5v0) = 4.0 v to 5.5 v or v (vreg3v3) = 3.0 v to 3.6 v; v gnd =0v; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit input levels differential receiver v di differential input sensitivity | v i(dp) - v i(dm) | 0.2 - - v
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 12 of 25 nxp semiconductors isp1102 advanced usb transceiver [1] v oh(min) =v (vreg3v3) - 0.2 v. [2] includes external resistors of 33 w 1 % on both pins dp and dm. [3] this voltage is available at pins vreg3v3 and vpu3v3. [4] the minimum voltage is 2.7 v in suspend mode. 12. dynamic characteristics v cm differential common mode voltage includes v di range 0.8 - 2.5 v single-ended receiver v il low-level input voltage - - 0.8 v v ih high-level input voltage 2.0 - - v v hys hysteresis voltage 0.4 - 0.7 v output levels v ol low-level output voltage r l = 1.5 k w to 3.6 v - - 0.3 v v oh high-level output voltage r l =15k w to gnd [1] 2.8 - 3.6 v leakage current i lz off-state leakage current - 1- +1 m a capacitance c in input capacitance pin to gnd - - 20 pf resistance z drv driver output impedance steady-state drive [2] 34 39 44 w z inp input impedance 10 - - m w r swon(vpu3v3) switch-on resistance on pin vpu3v3 --10 w termination v term termination voltage for upstream port pull-up (r pu ) [3] [4] 3.0 - 3.6 v table 13. static characteristics: analog i/o pins dp and dm continued v cc(5v0) = 4.0 v to 5.5 v or v (vreg3v3) = 3.0 v to 3.6 v; v gnd =0v; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit table 14. dynamic characteristics: analog i/o pins dp and dm v cc(5v0) = 4.0 v to 5.5 v or v (vreg3v3) = 3.0 v to 3.6 v; v cc(i/o) = 1.65 v to 3.6 v; v gnd = 0 v; see t ab le 8 for valid voltage level combinations; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit driver characteristics t fr rise time c l = 50 pf to 125 pf; 10%to90%of | v oh - v ol | ; see figure 5 4 - 20 ns t ff fall time c l = 50 pf to 125 pf; 90%to10%of | v oh - v ol | ; see figure 5 4 - 20 ns frfm differential rise time/fall time matching excluding the ?rst transition from idle state 90 - 111.1 % v crs output signal crossover voltage excluding the ?rst transition from idle state; see figure 6 [1] 1.3 - 2.0 v
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 13 of 25 nxp semiconductors isp1102 advanced usb transceiver [1] characterized only, not tested. limits guaranteed by design. driver timing t plh(drv) driver propagation delay (low to high) vpo, vmo to dp, dm; see figure 6 and figure 9 --18ns t phl(drv) driver propagation delay (high to low) vpo, vmo to dp, dm; see figure 6 and figure 9 --18ns t phz high to off-state propagation delay oe to dp, dm; see figure 7 and figure 10 --15ns t plz low to off-state propagation delay oe to dp, dm; see figure 7 and figure 10 --15ns t pzh off-state to high propagation delay oe to dp, dm; see figure 7 and figure 10 --15ns t pzl off-state to low propagation delay oe to dp, dm; see figure 7 and figure 10 --15ns receiver timings differential receiver t plh(rcv) receiver propagation delay (low to high) dp, dm to rcv; see figure 8 and figure 11 --15ns t phl(rcv) receiver propagation delay (high to low) dp, dm to rcv; see figure 8 and figure 11 --15ns single-ended receiver t plh(se) single-ended propagation delay (low to high) dp, dm to vp/vpo, vm/vmo; see figure 8 and figure 11 --18ns t phl(se) single-ended propagation delay (high to low) dp, dm to vp/vpo, vm/vmo; see figure 8 and figure 11 --18ns table 14. dynamic characteristics: analog i/o pins dp and dm continued v cc(5v0) = 4.0 v to 5.5 v or v (vreg3v3) = 3.0 v to 3.6 v; v cc(i/o) = 1.65 v to 3.6 v; v gnd = 0 v; see t ab le 8 for valid voltage level combinations; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 14 of 25 nxp semiconductors isp1102 advanced usb transceiver fig 5. rise time and fall time fig 6. timing of vpo and vmo to dp and dm fig 7. timing of oe to dp and dm fig 8. timing of dp and dm to rcv, vp/vpo and vm/vmo 004aab048 v ol t fr t ff v oh 90 % 10 % 10 % 90 % 004aaa573 v ol v oh t phl(drv) t plh(drv) v crs v crs 0.9 v 0.9 v 1.8 v 0 v logic input differential data lines 004aaa574 v ol v oh t pzh t pzl t phz t plz v oh - 0.3 v v ol + 0.3 v v crs 0.9 v 0.9 v 1.8 v 0 v logic input differential data lines t plh(se) t phl(se) 004aaa575 v ol v oh t phl(rcv) t plh(rcv) v crs v crs 0.9 v 0.9 v 2.0 v 0.8 v logic output differential data lines
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 15 of 25 nxp semiconductors isp1102 advanced usb transceiver 13. test information load capacitance c l = 50 pf (minimum or maximum timing) fig 9. load on pins dp and dm v = 0 v for t pzh and t phz v=v (vreg3v3) for t pzl and t plz fig 10. load on pins dp and dm for enable time and disable time fig 11. load on pins vm/vmo, vp/vpo and rcv 004aaa037 c l test point 15 k w dp/dm vpu3v3 1.5 k w 33 w dut v 33 w dut 500 w 50 pf 004aaa517 dp or dm test point 004aaa709 25 pf test point dut
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 16 of 25 nxp semiconductors isp1102 advanced usb transceiver 14. package outline fig 12. package outline sot639-2 (hbcc16) 2.5 a 1 b a 2 unit d e h e 1 references outline version european projection issue date 01-11-13 03-03-12 iec jedec jeita mm 0.8 0.10 0.05 0.7 0.6 3.1 2.9 1.45 1.35 3.1 2.9 1.45 1.35 0.33 0.27 dimensions (mm are the original dimensions) sot639-2 mo-217 d h 0.33 0.27 b 1 0.38 0.32 b 3 0.38 0.32 b 2 2.45 e 3 e 0.23 0.17 f 0.5 w e yy 1 0.1 0.05 0.2 2.5 e 2 2.45 e 4 0.08 v 0 2.5 5 mm scale sot639-2 hbcc16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm a max. detail x y y 1 c e e e 1 e 3 d h e 4 d e x c b a 16 113 59 e 2 1/2 e 3 1/2 e 4 e h a 1 a 2 a b 2 b 1 b 3 b f terminal 1 index area a c c b v m w m a c c b v m w m a c c b v m w m a c c b v m w m
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 17 of 25 nxp semiconductors isp1102 advanced usb transceiver fig 13. package outline sot773-1 (hvqfn14) 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 2.6 2.4 d h 1.45 1.15 y 1 2.6 2.4 1.45 1.15 e 1 1.5 e 2 1 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot773-1 - - - - - - - - - 0.35 0.25 l 0.1 v 0.05 w 0 2.5 5 mm scale sot773-1 hvqfn14: plastic thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 2.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c x d e c b a 02-07-05 terminal 1 index area e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) terminal 1 index area e l e h d h e e 1 b 4 7 14 11 10 8 3 1 a c c b v m w m e 2 1/2 e
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 18 of 25 nxp semiconductors isp1102 advanced usb transceiver 15. packing information the isp1102w (hbcc16 package) is delivered on a type a carrier tape, see figure 14 . the tape dimensions are given in t ab le 15 . the reel diameter is 330 mm. the reel is made of polystyrene (ps) and is not designed for use in baking process. the cumulative tolerance of 10 successive sprocket holes is 0.02 mm. the camber must not exceed 1 mm in 100 mm. 16. soldering this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . fig 14. carrier tape dimensions table 15. type a carrier tape dimensions for the isp1102w dimension value unit a0 3.3 mm b0 3.3 mm k0 1.1 mm p1 8.0 mm w 12.0 0.3 mm 004aaa728 type b type a b0 4 w k0 a0 4 k0 a0 p1 b0 p1 elongated sprocket hole direction of feed w direction of feed
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 19 of 25 nxp semiconductors isp1102 advanced usb transceiver 16.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus pbsn soldering 16.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities 16.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 15 ) than a pbsn process, thus reducing the process window
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 20 of 25 nxp semiconductors isp1102 advanced usb transceiver ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 16 and 17 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 15 . table 16. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 17. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 msl: moisture sensitivity level fig 15. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 21 of 25 nxp semiconductors isp1102 advanced usb transceiver for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 17. abbreviations 18. revision history table 18. abbreviations acronym description asic application-speci?c integrated circuit cmos complementary metal-oxide semiconductor esd electrostatic discharge hbm human body model se0 single-ended zero usb universal serial bus table 19. revision history document id release date data sheet status change notice supersedes isp1102_5 20071211 product data sheet - isp1102_4 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? section 7.3 p o w er supply con? gur ations and t ab le 11 static char acter istics: supply pins : changed v cc(5v0) to < 3.6 v. ? section 7.3 p o w er supply con? gur ations : changed vreg3v3 to < 2.4 v. ? t ab le 10 recommended oper ating conditions : added t j . isp1102_4 20060703 product data sheet - isp1102-03 isp1102-03 (9397 750 11228) 20030902 product data - isp1102-02 isp1102-02 (9397 750 10397) 20030106 product data - isp1102-01 isp1102-01 20000524 objective data - -
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 22 of 25 nxp semiconductors isp1102 advanced usb transceiver 19. legal information 19.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 19.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 19.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 19.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 20. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 23 of 25 continued >> nxp semiconductors isp1102 advanced usb transceiver 21. tables table 1. ordering information . . . . . . . . . . . . . . . . . . . . .2 table 2. pin description . . . . . . . . . . . . . . . . . . . . . . . . . .3 table 3. function selection . . . . . . . . . . . . . . . . . . . . . . .5 table 4. driving function using differential input data interface (pin oe = low) . . . . . . . . . . . . .5 table 5. receiving function (pin oe = high) . . . . . . . . .5 table 6. pin states in sharing mode . . . . . . . . . . . . . . . .6 table 7. power supply con?guration overview . . . . . . . . .6 table 8. power supply input options . . . . . . . . . . . . . . . .7 table 9. limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9 table 10. recommended operating conditions . . . . . . . . .9 table 11. static characteristics: supply pins . . . . . . . . . . .9 table 12. static characteristics: digital pins . . . . . . . . . . .10 table 13. static characteristics: analog i/o pins dp and dm . . . . . . . . . . . . . . . . . . . . . . . .11 table 14. dynamic characteristics: analog i/o pins dp and dm . . . . . . . . . . . . . . . . . . . . . . . .12 table 15. type a carrier tape dimensions for the isp1102w . . . . . . . . . . . . . . . . . . . . . . . . .18 table 16. snpb eutectic process (from j-std-020c) . . .20 table 17. lead-free process (from j-std-020c) . . . . . .20 table 18. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .21 table 19. revision history . . . . . . . . . . . . . . . . . . . . . . . .21
isp1102_5 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 05 11 december 2007 24 of 25 continued >> nxp semiconductors isp1102 advanced usb transceiver 22. figures fig 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 fig 2. pin con?guration hbcc16 (top view) . . . . . . . . . .3 fig 3. pin con?guration hvqfn14 (top view) . . . . . . . . .3 fig 4. human body esd test model. . . . . . . . . . . . . . . . .8 fig 5. rise time and fall time . . . . . . . . . . . . . . . . . . . . .14 fig 6. timing of vpo and vmo to dp and dm . . . . . . .14 fig 7. timing of oe to dp and dm . . . . . . . . . . . . . . . .14 fig 8. timing of dp and dm to rcv, vp/vpo and vm/vmo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 fig 9. load on pins dp and dm. . . . . . . . . . . . . . . . . . .15 fig 10. load on pins dp and dm for enable time and disable time . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 fig 11. load on pins vm/vmo, vp/vpo and rcv . . . . .15 fig 12. package outline sot639-2 (hbcc16). . . . . . . . .16 fig 13. package outline sot773-1 (hvqfn14) . . . . . . .17 fig 14. carrier tape dimensions. . . . . . . . . . . . . . . . . . . .18 fig 15. temperature pro?les for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
nxp semiconductors isp1102 advanced usb transceiver ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 11 december 2007 document identifier: isp1102_5 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 23. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 function selection. . . . . . . . . . . . . . . . . . . . . . . 5 7.2 operating functions. . . . . . . . . . . . . . . . . . . . . . 5 7.3 power supply con?gurations . . . . . . . . . . . . . . . 5 7.4 power supply input options . . . . . . . . . . . . . . . . 7 8 electrostatic discharge (esd) . . . . . . . . . . . . . 8 8.1 esd protection . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.2 esd test conditions . . . . . . . . . . . . . . . . . . . . . 8 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 recommended operating conditions. . . . . . . . 9 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 9 12 dynamic characteristics . . . . . . . . . . . . . . . . . 12 13 test information . . . . . . . . . . . . . . . . . . . . . . . . 15 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 15 packing information. . . . . . . . . . . . . . . . . . . . . 18 16 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16.1 introduction to soldering . . . . . . . . . . . . . . . . . 19 16.2 wave and re?ow soldering . . . . . . . . . . . . . . . 19 16.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19 16.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 19 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 19 legal information. . . . . . . . . . . . . . . . . . . . . . . 22 19.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 19.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 19.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 19.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 20 contact information. . . . . . . . . . . . . . . . . . . . . 22 21 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 22 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 23 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

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