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Transistors
2SD0602A (2SD602A)
Silicon NPN epitaxial planar type
For general amplification Complementary to 2SB0710A (2SB710A) Features
* Low collector-emitter saturation voltage VCE(sat) * Mini type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing
1
Unit: mm
0.40+0.10 -0.05 3
1.50+0.25 -0.05 2.8+0.2 -0.3
0.16+0.10 -0.06
2
(0.65)
(0.95) (0.95) 1.90.1 2.90+0.20 -0.05 10
Absolute Maximum Ratings Ta = 25C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Peak collector current Collector power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC ICP PC Tj Tstg Rating 60 50 5 500 1 200 150 -55 to +150 Unit V V V mA A mW C C
1.1+0.2 -0.1
1.1+0.3 -0.1
1 : Base 2 : Emitter 3 : Collector EIAJ : SC-59 Mini3-G1 Package
Marking symbol X
Electrical Characteristics Ta = 25C 3C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector-base cutoff current (Emitter open) Forward current transfer ratio *1 Collector-emitter saturation voltage *1 Transition frequency Collector output capacitance (Common base, input open circuited) Symbol VCBO VCEO VEBO ICBO hFE1 *2 hFE2 VCE(sat) fT Cob Conditions IC = 10 A, IE = 0 IC = 10 mA, IB = 0 IE = 10 A, IC = 0 VCB = 20 V, IE = 0 VCE = 10 V, IC = 150 mA VCE = -10 V, IC = 500 mA IC = 300 mA, IB = 30 mA VCB = 10 V, IE = -50 mA, f = 200 MHz VCB = 10 V, IE = 0, f = 1 MHz 85 40 0.35 200 6 15 0.6 V MHz pF Min 60 50 5 0.1 340 Typ Max Unit V V V A
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *1: Pulse measurement *2: Rank classification Rank hFE1 Marking symbol Q 85 to 170 XQ R 120 to 240 XR S 170 to 340 XS No rank 85 to 340 X
Product of no-rank is not classified and have no indication for rank. Note) The part number in the parenthesis shows conventional part number.
Publication date: January 2003 SJC00191CED
0 to 0.1
0.40.2
5
1
2SD0602A
PC Ta
240
800 700
IC VCE
Ta = 25C IB = 10 mA 9 mA 8 mA 7 mA 6 mA 5 mA 4 mA 400 300 200 100 3 mA 2 mA 1 mA 800 700
IC I B
VCE = 10 V Ta = 25C
Collector power dissipation PC (mW)
200
Collector current IC (mA)
Collector current IC (mA)
600 500
600 500 400 300 200 100 0
160
120
80
40
0
0
40
80
120
160
0
0
4
8
12
16
20
0
2
4
6
8
10
Ambient temperature Ta (C)
Collector-emitter voltage VCE (V)
Base current IB (mA)
VCE(sat) IC
Collector-emitter saturation voltage VCE(sat) (V)
100
VBE(sat) IC
100
hFE IC
300 VCE = 10 V
Base-emitter saturation voltage VBE(sat) (V)
IC / IB = 10
IC / IB = 10
Forward current transfer ratio hFE
250
10
10
Ta = 75C 25C -25C
200
25C 1 Ta = -25C 75C
1 Ta = 75C 25C 0.1 -25C
150
100
0.1
50
0.01 0.01
0.1
1
10
0.01 0.01
0.1
1
10
0 0.01
0.1
1
10
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
fT I E
VCB = 10 V Ta = 25C
Cob VCB
Collector output capacitance (Common base, input open circuited) Cob (pF)
12
VCER RBE
Collector-emitter voltage (V) (Resistor between B and E) VCER
IE = 0 f = 1 MHz Ta = 25C
240
120 IC = 2 mA Ta = 25C 100
Transition frequency fT (MHz)
200
10
160
8
80
120
6
60
80
4
40
40
2
20
0 -1
-10
-100
0
1
10
100
0
1
10
100
1 000
Emitter current IE (mA)
Collector-base voltage VCB (V)
Base-emitter resistance RBE (k)
2
SJC00191CED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL

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