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(R) ISL54063, ISL54064 Data Sheet February 25, 2009 FN6582.0 +1.8V to +6.5V, Sub-ohm, Dual SPST Analog Switch with Negative Signal Capability and Click and Pop Elimination The Intersil ISL54063 and ISL54064 devices are a low ON-resistance, low voltage, bi-directional, dual single-pole/single-throw (SPST) analog switch. It is designed to operate from a single +1.8V to +6.5V supply and pass signals that swing up to 6.5V below the positive supply rail. Targeted applications include battery powered equipment that benefit from low rON (0.56), low power consumption (20nA) and fast switching speeds (tON = 55ns, tOFF = 18ns). The digital inputs are1.8V logic-compatible up to a +3V supply. The ISL54063 and ISL54064 also features integrated circuitry to eliminate click and pop noise to an audio speaker. The ISL54063, ISL54064 are offered in a small form factor package, alleviating board space limitations. It is available in a tiny 10 Ld 1.8 x 1.4mm TQFN or 10 Ld 3mmx3mm TDFN package. The ISL54063 is a committed dual single-pole/single-throw (SPST) that consist of two normally open (NO) switches with independent logic control. The ISL54064 is a committed dual single-pole/single-throw (SPST) that consist of two normally closed (NC) switches with independent logic control. TABLE 1. FEATURES AT A GLANCE ISL54063 Number of Switches SW 4.3V rON 4.3V tON/tOFF 2.7V rON 2.7V tON/tOFF 1.8V rON 1.8V tON/tOFF Packages 2 SPST NO 0.65 43ns/23ns 0.9 55ns/18ns 1.8 145ns/28ns ISL54064 2 SPST NC 0.65 43ns/23ns 0.9 55ns/18ns 1.8 145ns/28ns Features * Pb-free (RoHS Compliant) * Negative Signal Capability * Audio Click and Pop Elimination Circuitry * ON-Resistance (rON) - V+ = +4.5V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.55 - V+ = +4.3V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.57 - V+ = +2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.82 - V+ = +1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8 * rON Matching Between Channels . . . . . . . . . . . . . . . . .10m * rON Flatness Across Signal Range . . . . . . . . . . . . . . . .0.35 * Low THD+N @ 32 Load . . . . . . . . . . . . . . . . . . . . . . 0.02% * Single Supply Operation. . . . . . . . . . . . . . . . . +1.8V to +6.5V * Low Power Consumption (PD) . . . . . . . . . . . . . . . . .20nA * Fast Switching Action (V+ = +4.3V) - tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43ns - tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23ns * ESD HBM Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >6kV * Guaranteed Break-before-Make * 1.8V Logic Compatible (+3V supply) * Low I+ Current when VINH is not at the V+ Rail * Available in 10 Ld TQFN 1.8x1.4mm and 10 Ld 3x3mm TDFN Applications * Audio and Video Switching * Battery powered, Handheld, and Portable Equipment - MP3 and Multimedia Players - Cellular/mobile Phones - Pagers - Laptops, Notebooks, Palmtops * Portable Test and Measurement * Medical Equipment 10 Ld TQFN, 10 Ld TDFN Related Literature * Technical Brief TB363 "Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)" * Application Note AN557 "Recommended Test Procedures for Analog Switches" 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL54063, ISL54064 Pinouts (Note 1) ISL54063 (10 LD TDFN) TOP VIEW IN1 1 NO1 2 COM1 3 N.C. 4 GND 5 CLICK AND POP CIRCUITRY 10 IN2 9 NO2 8 COM2 7 N.C. 6 V+ IN1 1 N.C. 2 COM1 3 NC1 4 GND 5 CLICK AND POP CIRCUITRY ISL54064 (10 LD TDFN) TOP VIEW 10 IN2 9 N.C. 8 COM2 7 NC2 6 V+ ISL54063 (10 LD TQFN) TOP VIEW IN1 7 NO1 8 IN2 6 5 NO2 N.C. 8 ISL54064 (10 LD TQFN) TOP VIEW IN1 7 IN2 6 5 N.C. CLICK AND POP CIRCUITRY COM1 9 CLICK AND POP CIRCUITRY 1 GND 2 V+ 4 COM2 COM1 9 4 COM2 N.C. 10 3 N.C. NC1 10 1 GND 2 V+ 3 NC2 NOTE: 1. Switches Shown for INx = Logic "0". Truth Table INx 0 1 NOTE: ISL54063 NOx to COMx OFF ON ISL54064 NCx to COMx ON OFF Pin Descriptions PIN V+ FUNCTION IC Power Supply (+1.8V to +6.5V). Decouple V+ to ground by placing a 0.1F capacitor at the V+ and GND supply lines as near as the IC as possible. Ground Connection Digital Control Input Analog Switch Common Pin Analog Switch Normally Open Pin Analog Switch Normally Closed Pin No Connect Logic "0" 0.5V. Logic "1" 1.4V with a 3V supply. GND INx COM NOx NCx N.C. 2 FN6582.0 February 25, 2009 ISL54063, ISL54064 Ordering Information PART NUMBER ISL54063IRTZ (Note 3) ISL54063IRTZ-T (Notes 2, 3) ISL54063IRUZ-T (Notes 2, 4) ISL54064IRTZ (Note 3) ISL54064IRTZ-T (Notes 2, 3) ISL54064IRUZ-T (Notes 2, 4) NOTES: 2. Please refer to TB347 for details on reel specifications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD020. 4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4063 4063 T6 4064 4064 T7 PART MARKING TEMP. RANGE (C) -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 10 Ld 3x3 TDFN 10 Ld 3x3 TDFN (Tape and Reel) 10 Ld Thin TQFN (Tape and Reel) 10 Ld 3x3 TDFN 10 Ld 3x3 TDFN (Tape and Reel) 10 Ld Thin TQFN (Tape and Reel) PACKAGE (Pb-Free) PKG. DWG. # L10.3x3A L10.3x3A L10.1.8x1.4A L10.3x3A L10.3x3A L10.1.8x1.4A 3 FN6582.0 February 25, 2009 ISL54063, ISL54064 Absolute Maximum Ratings V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 7.0V Input Voltages NOx, NCx (Note 5) . . . . . . . . . . . . . . . . (V+ - 7V) to ((V+) + 0.5V) INx (Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to ((V+) + 0.5V) Output Voltages COMx (Note 5) . . . . . . . . . . . . . . . . . . . (V+ - 7V) to ((V+) + 0.5V) Continuous Current NOx, NCx, or COMx . . . . . . . . . . . . . . 300mA Peak Current NOx, NCx, or COMx (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . 500mA ESD Rating: Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>6kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>400V Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . >1.5kV Thermal Information Thermal Resistance (Typical) JA (C/W) JC (C/W) 10 Ld 3x3 TDFN Package (Notes 6, 8) 55 18 10 Ld TQFN Package (Note 7) . . . . . 155 N/A Maximum Junction Temperature (Plastic Package). . . . . . . +150C Maximum Storage Temperature Range . . . . . . . . . . . -65C to +150C Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40C to +85C Power Supply Range . . . . . . . . . . . . . . . . . . . . . . . . +1.8V to +6.5V Analog Signal Range . . . . . . . . . . . . . . . . . . . . . . . (V+ - 6.5)V to V+ AUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. Signals on NC, NO, IN, or COM exceeding V+ or GND by the specified amount are clamped by internal diodes. Limit forward diode current to maximum current ratings. 6. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 7. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. For JC, the "case temp" location is the center of the exposed metal pad on the package underside. Electrical Specifications - 5V Supply Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 9), Unless Otherwise Specified. PARAMETER ANALOG SWITCH CHARACTERISTICS ON-Resistance, rON rON Matching Between Channels, rON rON Flatness, RFLAT(ON) COM ON Leakage Current, ICOM(ON) DYNAMIC CHARACTERISTICS Turn-ON Time, tON Turn-OFF Time, tOFF Charge Injection, Q OFF-Isolation Crosstalk (Channel-to-Channel) Total Harmonic Distortion -3dB Bandwidth NO x or NCx OFF Capacitance, COFF COMx ON Capacitance, CCOM(ON) V+ = 4.5V, VNO or VNC = 3.0V, RL = 50, CL = 35pF (see Figure 1) V+ = 4.5V, VNO or VNC = 3.0V, RL = 50, CL = 35pF (see Figure 1) VG = 0V, RG = 0, CL = 1.0nF (see Figure 2) RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS (see Figure 3) RL = 50, CL = 5pF, f = 1MHz, VCOM = 1VRMS (see Figure 5) f = 20Hz to 20kHz, VCOM = 0.5VP-P, RL = 32 VCOM = 1VRMS, RL = 50, CL = 5pF f = 1MHz f = 1MHz (See Figure 6) 25 Full 25 Full 25 25 25 25 25 25 25 35 30 10 15 170 60 -75 0.02 60 36 88 ns ns ns ns pC dB dB % MHz pF pF V+ = 4.5V, ICOM = 100mA, VNO or VNC = (V+ 6.5) to V+ (see Figure 4) V+ = 4.5V, ICOM = 100mA, VNO or VNC = Voltage at max rON, (Note 13) V+ = 4.5V, ICOM = 100mA, VNO or VNC = (V+ 6.5) to V+, (Note 12) V+ = 5V, VCOM = -1.5V, 5V, VNO or VNC = Float 25 Full 25 Full 25 Full 25 Full 0.55 0.68 15 30 0.11 0.14 49 0.7 m m nA A TEST CONDITIONS TEMP MIN (C) (Notes 10, 11) TYP MAX (Notes 10, 11) UNITS 4 FN6582.0 February 25, 2009 ISL54063, ISL54064 Electrical Specifications - 5V Supply Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 9), Unless Otherwise Specified. (Continued) PARAMETER POWER SUPPLY CHARACTERISTICS Positive Supply Current, I+ V+ = 5.5V, VIN = 0V or V+ 25 Full DIGITAL INPUT CHARACTERISTICS Input Voltage Low, VINL Input Voltage High, VINH Input Current, IINH, IINL V+ = 5.5V, VIN = 0V or V+ Full Full 25 Full 2.4 -0.1 0.89 0.8 0.1 V V A A 0.02 2.5 0.1 A A TEST CONDITIONS TEMP MIN (C) (Notes 10, 11) TYP MAX (Notes 10, 11) UNITS Electrical Specifications - 4.3V Supply Test Conditions: V+ = +3.9V to +4.5V, GND = 0V, VINH = 1.6V, VINL = 0.5V (Note 9), Unless Otherwise Specified. TEST CONDITIONS TEMP MIN (C) (Notes 10, 11) TYP MAX (Notes 10, 11) UNITS PARAMETER ANALOG SWITCH CHARACTERISTICS ON-Resistance, rON V+ = 4.3V, ICOM = 100mA, VNO or VNC = (V+ - 6.5V) to V+, (See Figure 4) V+ = 4.3V, ICOM = 100mA, VNO or VNC = Voltage at max rON, (Note 13) V+ = 4.3V, ICOM = 100mA, VNO or VNC = (V+ 6.5V) to V+, (Note 12) V+ = 4.3V, VCOM = -1.2V, 4.3V, VNO or VNC = Float 25 Full 25 Full 25 Full 25 Full -0.1 - 0.57 0.68 15 30 0.1 0.14 1.1 0.1 - m m A A rON Matching Between Channels, rON rON Flatness, RFLAT(ON) COM ON Leakage Current, ICOM(ON) DYNAMIC CHARACTERISTICS Turn-ON Time, tON V+ = 3.9V, VNO or VNC = 3.0V, RL = 50, CL = 35pF (see Figure 1) V+ = 3.9V, VNO or VNC = 3.0V, RL = 50, CL = 35pF (see Figure 1) CL = 1.0nF, VG = 0V, RG = 0 (see Figure 2) RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS (see Figure 3) RL = 50, CL = 5pF, f = 1MHz, VCOM = 1VRMS (see Figure 5) f = 20Hz to 20kHz, VCOM = 2VP-P, RL = 32 VCOM = 1VRMS, RL = 50, CL = 5pF f = 1MHz f = 1MHz (see Figure 6) 25 Full 25 Full 25 25 25 25 25 25 25 - 43 50 23.1 23.2 200 60 -75 0.04 60 36 88 - ns ns ns ns pC dB dB % MHz pF pF Turn-OFF Time, tOFF Charge Injection, Q OFF-Isolation Crosstalk (Channel-to-Channel) Total Harmonic Distortion -3dB Bandwidth NOx or NCx OFF Capacitance, COFF COMx ON Capacitance, CCOM(ON) POWER SUPPLY CHARACTERISTICS Positive Supply Current, I+ V+ = +4.5V, VIN = 0V or V+ 25 Full Positive Supply Current, I+ V+ = +4.2V, VIN = 2.85V 25 0.003 2.6 0.89 0.1 12 A A A 5 FN6582.0 February 25, 2009 ISL54063, ISL54064 Electrical Specifications - 4.3V Supply Test Conditions: V+ = +3.9V to +4.5V, GND = 0V, VINH = 1.6V, VINL = 0.5V (Note 9), Unless Otherwise Specified. (Continued) TEST CONDITIONS TEMP MIN (C) (Notes 10, 11) TYP MAX (Notes 10, 11) UNITS PARAMETER DIGITAL INPUT CHARACTERISTICS Input Voltage Low, VINL Input Voltage High, VINH Input Current, IINH, IINL Full Full V+ = 4.5V, VIN = 0V or V+ 25 Full 1.6 -0.5 - 0.5 0.5 0.5 - V V A A Electrical Specifications - 3V Supply Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Note 9), Unless Otherwise Specified. TEST CONDITIONS TEMP MIN MAX (C) (Notes 10, 11) TYP (Notes 10, 11) UNITS PARAMETER ANALOG SWITCH CHARACTERISTICS ON-Resistance, rON V+ = 2.7V, ICOM = 100mA, VNO or VNC = (V+ -6.5V) to V+ (see Figure 4 ) V+ = 2.7V, ICOM = 100mA, VNO or VNC = Voltage at max rON, (Note 13) V+ = 2.7V, ICOM = 100mA, VNO or VNC = (V+ 6.5V) to V+, (Notes 12, 14) 25 Full 25 Full 25 Full - 0.82 0.94 10 30 0.35 0.4 0.5 0.55 m m rON Matching Between Channels, rON rON Flatness, RFLAT(ON) DYNAMIC CHARACTERISTICS Turn-ON Time, tON V+ = 2.7V, VNO or VNC = 1.5V, RL = 50, CL = 35pF (see Figure 1) V+ = 2.7V, VNO or VNC = 1.5V, RL = 50, CL = 35pF (see Figure 1) CL = 1.0nF, VG = 0V, RG = 0 (see Figure 2) RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS (see Figure 3) RL = 50, CL = 5pF, f = 1MHz, VCOM = 1VRMS (see Figure 5) f = 20Hz to 20kHz, VCOM = 0.5VP-P, RL = 32 VCOM = 1VRMS, RL = 50, CL = 5pF f = 1MHz f = 1MHz (see Figure 6) 25 Full 25 Full 25 25 25 25 25 25 25 50 60 27 35 94 60 -75 0.04 60 36 88 ns ns ns ns pC dB dB % MHz pF pF Turn-OFF Time, tOFF Charge Injection, Q OFF-Isolation Crosstalk (Channel-to-Channel) Total Harmonic Distortion -3dB Bandwidth NOx or NCx OFF Capacitance, COFF COMx ON Capacitance, CCOM(ON) DIGITAL INPUT CHARACTERISTICS Input Voltage Low, VINL Input Voltage High, VINH Input Current, IINH, IINL V+ = 3.3V, VIN = 0V or V+ 25 25 25 Full 1.4 -0.5 0.4 0.5 0.5 V V A A 6 FN6582.0 February 25, 2009 ISL54063, ISL54064 Electrical Specifications - 1.8V Supply PARAMETER ANALOG SWITCH CHARACTERISTICS ON-Resistance, rON V+ = 1.8V, ICOM = 100mA, VNO or VNC = (V+ -6.5V) to V+ (see Figure 4) V+ = 1.8V, ICOM = 100mA, VNO or VNC = Voltage at max rON, (Note 13) V+ = 1.8V, ICOM = 100mA, VNO or VNC = (V+ -6.5V) to V+, (Note 12) 25 Full 25 Full 25 Full 1.87 1.97 16 30 1.34 1.43 m m Test Conditions: V+ = +1.8V, GND = 0V, VINH = 1.0V, VINL = 0.4V (Note 9), Unless Otherwise Specified. TEST CONDITIONS TEMP MIN MAX (C) (Notes 10, 11) TYP (Notes 10, 11) UNITS rON Matching Between Channels, rON rON Flatness, RFLAT(ON) DYNAMIC CHARACTERISTICS Turn-ON Time, tON V+ = 1.8V, VNO or VNC = 1.8V, RL = 50, CL = 35pF (see Figure 1) V+ = 1.8V, VNO or VNC = 1.8V, RL = 50, CL = 35pF (see Figure 1) CL = 1.0nF, VG = 0V, RG = 0 (see Figure 2) VCOM = 1VRMS, RL = 50, CL = 5pF f = 1MHz (see Figure 6) f = 1MHz (see Figure 6) 25 Full 25 Full 25 25 25 25 145 150 20 22 40 60 36 88 ns ns ns ns pC MHz pF pF Turn-OFF Time, tOFF Charge Injection, Q -3dB Bandwidth NOx or NCx OFF Capacitance, COFF COMx ON Capacitance, CCOM(ON) DIGITAL INPUT CHARACTERISTICS Input Voltage Low, VINL Input Voltage High, VINH Input Current, IINH, IINL Input Current, IINH, IINL NOTES: 9. VIN = input voltage to perform proper function. 10. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 11. Parameters with MIN and/or MAX limits are 100% tested at +25C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 12. Flatness is defined as the difference between maximum and minimum value of ON-resistance over the specified analog signal range. 13. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON value, between NC1 and NC2 or between NO1 and NO2. 14. Limits established by characterization and are not production tested. V+ = 2.0V, VIN = 0V or V+ V+ = 2.0V, VIN = 0V or V+ 25 25 25 Full 1.0 -0.5 0.38 0.4 0.5 V V A A 7 FN6582.0 February 25, 2009 ISL54063, ISL54064 Test Circuits and Waveforms V+ V+ LOGIC INPUT 0V tOFF SWITCH INPUT VNO 90% SWITCH OUTPUT 0V tON VOUT 90% LOGIC INPUT SWITCH INPUT NO OR NC COM IN GND RL 50 CL 35pF VOUT 50% tr < 5ns tf < 5ns C Logic input waveform is inverted for switches that have the opposite logic sense. Repeat test for all switches. CL includes fixture and stray capacitance. RL V OUT = V (NO or NC) ----------------------R L + r ON FIGURE 1B. TEST CIRCUIT FIGURE 1A. MEASUREMENT POINTS FIGURE 1. SWITCHING TIMES V+ C RG SWITCH OUTPUT VOUT VOUT VG V+ LOGIC INPUT ON OFF 0V Q = VOUT x CL ON NO OR NC COM VOUT GND IN CL LOGIC INPUT Repeat test for all switches. FIGURE 2A. MEASUREMENT POINTS FIGURE 2. CHARGE INJECTION V+ C *50 SOURCE SIGNAL GENERATOR V+ C NO OR NC rON = V1/100mA NO OR NC IN 0V OR V+ VNX 100mA ANALYZER RL COM GND COM GND V1 IN 0V OR V+ FIGURE 2B. TEST CIRCUIT Signal direction through switch is reversed, worst case values are recorded. Repeat test for all switches. FIGURE 3. OFF-ISOLATION TEST CIRCUIT Repeat test for all switches. FIGURE 4. rON TEST CIRCUIT 8 FN6582.0 February 25, 2009 ISL54063, ISL54064 Test Circuits and Waveforms (Continued) V+ C *50 SOURCE SIGNAL GENERATOR COM NO1 OR NC1 COM1 50 0V OR V+ V+ C IN INX 0V OR V+ IMPEDANCE ANALYZER ANALYZER RL COM2 NC2 OR NO2 NC GND NO OR NC GND Signal direction through switch is reversed, worst case values are recorded. Repeat test for all switches. FIGURE 5. CROSSTALK TEST CIRCUIT FIGURE 6. CAPACITANCE TEST CIRCUIT INx VDC 0V VINx* 0V tD tD VDC CLICK AND POP CIRCUITRY 220F NOx VDC tD = 200ms measured at 50% points. COMx 220F NCx *VINx waveform for Click and Pop Elimination on NOx terminal. For Click and Pop Elimination on NCx terminal invert VINx. RL FIGURE 7A. CLICK AND POP WAVEFORM FIGURE 7B. CLICK AND POP TEST CIRCUIT FIGURE 7. CLICK AND POP ELIMINATION Detailed Description The ISL54063 and ISL54064 are bidirectional, dual single pole-single throw (SPST) analog switches that offers precise switching from a single 1.8V to 6.5V supply with low ON-resistance (0.83), high speed operation (tON = 55ns, tOFF = 18ns) and negative signal swing capability. The device is especially well suited for portable battery powered equipment due to its low operating supply voltage (1.8V), low power consumption (20nA), and a tiny 1.8mmx1.4mm TQFN package or a 3mmx3mm TDFN package. The low ON-resistance and rON flatness provide very low insertion loss and signal distortion for applications that require signal switching with minimal interference by the switch. The ISL54063 is a normally open (NO) SPST analog switch. The ISL54064 is a normally closed (NC) SPST analog switch. which might permanently damage the IC. The ISL54063 and ISL54064 contains ESD protection diodes on each pin of the IC (see Figure 8). These diodes connect to either a +Ring or -Ring for ESD protection. To prevent forward biasing the ESD diodes to the +Ring, V+ must be applied before any input signals, and the input signal voltages must remain between recommended operating range. If these conditions cannot be guaranteed, then precautions must be implemented to prohibit the current and voltage at the logic pin and signal pins from exceeding the maximum ratings of the switch. The following two methods can be used to provided additional protection to limit the current in the event that the voltage at a logic pin or switch terminal goes above the V+ rail. Logic inputs can be protected by adding a 1k resistor in series with the logic input (see Figure 8). The resistor limits the input current below the threshold that produces permanent damage. Supply Sequencing and Overvoltage Protection With any CMOS device, proper power supply sequencing is required to protect the device from excessive input currents 9 FN6582.0 February 25, 2009 ISL54063, ISL54064 This method is not acceptable for the signal path inputs. Adding a series resistor to the switch input defeats the purpose of using a low rON switch. Alternatively, connecting external Schottky diodes from the V+ rail to the signal pins will shunt the fault current through the Schottky diode instead of through the internal ESD diodes, thereby protecting the switch. These Schottky diodes must be sized to handle the expected fault current.. V+ +RING Logic-Level Thresholds This switch family is 1.8V CMOS compatible (0.45V VOLMAX and 1.35V VOHMIN) over a supply range of 1.8V to 3.3V (see Figure 16). At 3.3V the VIL level is 0.5V maximum. This is still below the 1.8V CMOS guaranteed low output maximum level of 0.45V, but noise margin is reduced. At 3.3V the VIH level is 1.4V minimum. While this is above the 1.8V CMOS guaranteed high output minimum of 1.35V under most operating conditions the switch will recognize this as a valid logic high. The digital input stages draw supply current whenever the digital input voltage is not at one of the supply rails. Driving the digital input signals from GND to V+ with a fast transition time minimizes power dissipation. The ISL54063 and ISL54064 have been designed to minimize the supply current whenever the digital input voltage is not driven to the supply rails (0V to V+). For example driving the device with 2.85V logic high while operating with a 4.2V supply the device draws only 1A of current. VCOMx VNOx CLAMP OR VNCx 1k LOGIC INPUTS GND -RING High-Frequency Performance In 50 systems, the ISL54063 and ISL54064 have an ON switch -3dB bandwidth of 60MHz (see Figure 19). The frequency response is very consistent over a wide V+ range, and for varying analog signal levels. An OFF switch acts like a capacitor across the open terminals and AC couples higher frequencies, resulting in signal feed-through from a switch's input to its output. Off-Isolation is the resistance to this feed-through. Crosstalk indicates the amount of feed-through from one switch channel to another switch channel. Figure 20 details the high Off-Isolation and Crosstalk rejection provided by this part. At 100kHz, Off-Isolation is about 60dB in 50 systems, decreasing approximately 20dB per decade as frequency increases. At 1MHz, Crosstalk is about -75dB in 50 systems, decreasing approximately 20dB per decade as frequency increases. FIGURE 8. OVERVOLTAGE PROTECTION Power-Supply Considerations The ISL54063 and ISL54064 construction is typical of most single supply CMOS analog switches which have two supply pins: V+ and GND. V+ and GND provide the CMOS switch bias and sets their analog voltage limits. Unlike switches with a 5.5V maximum supply voltage, the ISL54063 and ISL54064 have a 6.5V maximum supply voltage providing plenty of head room for the 10% tolerance of 5.5V supplies due to overshoot and noise spikes. The minimum recommended supply voltage is 1.8V. It is important to note that the input signal range, switching times, and ON-resistance degrade at lower supply voltages. Refer to the "Electrical Specifications" tables, beginning on page 4, and "Typical Performance Curves", beginning on page 11, for details. V+ and GND also power the internal logic and level shifters. The level shifters convert the input logic levels to V+ and GND signals levels to drive the analog switch gate terminals. A high frequency decoupling capacitor placed as close to the V+ and GND pin as possible is recommended for proper operation of the switch. A value of 0.1F is highly recommended. Leakage Considerations Reverse ESD protection diodes are internally connected between each analog-signal pin, V+ and GND. One of these diodes conducts if any analog signal exceeds the recommended analog signal range. Virtually all the analog switch leakage current comes from the ESD diodes and reversed biased junctions in the switch cell. Although the ESD diodes on a given signal pin are identical and therefore fairly well balanced, they are reverse biased differently. Each is biased to either the +Ring or -Ring and the analog input signal. This means their leakages will vary as the signal varies. The difference in the two diode leakages to the +Ring or -Ring and the reverse biased junctions at the internal switch cell constitutes the analog-signal-path leakage current. Negative Signal Capability The ISL54063 and ISL54064 contains circuitry that allows the analog input signal to swing below ground. The device has an analog signal range of 6.5V below V+ up to the V+ rail (see Figure 14) while maintaining low rON performance. For example, if V+ = 5V, then the analog input signal range is from -1.5V to +5V. If V+ = 2.7V then the range is from -3.8V to +2.7V. 10 FN6582.0 February 25, 2009 ISL54063, ISL54064 Typical Performance Curves TA = +25C, Unless Otherwise Specified 2.0 1.8 1.6 1.4 rON () 1.2 1.0 0.8 0.6 0.4 0.2 -6 V+ = 2.7V V+ = 4.5V rON () ICOM = 100mA V+ = 1.8V 1.00 0.95 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 0.45 0.40 0.35 -5 -4 -3 -2 -1 0 1 2 3 4 5 0.30 -3 -2 -1 0 1 VCOM (V) 2 3 4 5 T = -40C T = +25C T = +85C V+ = 4.5V ICOM = 100mA VCOM (V) FIGURE 9. ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE 1.00 0.95 0.90 0.85 0.80 0.75 rON () rON () 0.70 0.65 0.60 0.55 0.50 0.45 0.40 0.35 0.30 -3 -2 -1 0 1 VCOM (V) 2 3 4 5 T = -40C T = +25C T = +85C V+ = 4.3V ICOM = 100mA FIGURE 10. ON-RESISTANCE vs SWITCH VOLTAGE 1.25 1.15 1.05 0.95 0.85 0.75 0.65 0.55 0.45 0.35 -5 T = -40C -4 -3 -2 0 -1 VCOM (V) 1 2 3 4 T = +85C T = +25C V+ = 2.7V ICOM = 100mA FIGURE 11. ON-RESISTANCE vs SWITCH VOLTAGE 2.2 V+ = 1.8V 2.0 1.8 1.6 1.4 rON () 1.2 1.0 0.8 0.6 0.4 T = -40C 0.2 6 -5 -4 -3 -2 -1 VCOM (V) 0 1 2 3 T = +85C T = +25C ICOM = 100mA ANALOG SIGNAL RANGE (V) FIGURE 12. ON-RESISTANCE vs SWITCH VOLTAGE 6 5 4 3 2 1 0 -1 -2 -3 -4 -5 -6 1.5 2.0 2.5 3.0 3.5 4.0 4.5 SUPPLY VOLTAGE (V) 5.0 5.5 6.0 SIGNAL MIN SIGNAL MAX FIGURE 13. ON-RESISTANCE vs SWITCH VOLTAGE FIGURE 14. ANALOG SIGNAL RANGE vs SUPPLY VOLTAGE 11 FN6582.0 February 25, 2009 ISL54063, ISL54064 Typical Performance Curves TA = +25C, Unless Otherwise Specified (Continued) 700 650 600 550 500 450 Q (pC) 400 350 300 250 200 150 100 50 0 -5 -4 -3 -2 -1 0 1 VCOM (V) 2 3 4 5 6 V+ = 2.0V V+ = 3.3V VINH AND VINL (V) V+ = 4.5V ABSOLUTE VALUES V+ = 5.5V 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1.5 VINH VINL 2.0 2.5 3.0 V+ (V) 3.5 4.0 4.5 FIGURE 15. CHARGE INJECTION vs SWITCH VOLTAGE 160 T = -40C 140 120 100 80 60 40 20 0 T = +25C T = +85C FIGURE 16. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE 40 T = -40C 35 30 25 tOFF (ns) 20 15 10 5 0 T = +25C T = +85C tON (ns) 1.8 3.3 V+ (V) 4.5 5.5 1.8 3.3 V+ (V) 4.5 5.5 FIGURE 17. TURN - ON TIME vs SUPPLY VOLTAGE FIGURE 18. TURN - OFF TIME vs SUPPLY VOLTAGE 0 V+ = 1.8V TO 5.5V -1 NORMALIZED GAIN (dB) -10 -20 -30 CROSSTALK (dB) V+ = 1.8V TO 5.5V RL = 50 VIN = 1VRMS @ 0VDC OFFSET -2 -3 -4 -5 -40 -50 -60 CROSSTALK -70 -80 -90 OFF-ISOLATION RL = 50 VIN = 1VRMS @ 0VDC OFFSET 1k 10k 100k 1M 10M FREQUENCY (Hz) 100M 1G -100 -110 1k 10k 100k 1M FREQUENCY (Hz) 10M 100M FIGURE 19. FREQUENCY RESPONSE FIGURE 20. CROSSTALK AND OFF-ISOLATION 12 FN6582.0 February 25, 2009 ISL54063, ISL54064 Typical Performance Curves TA = +25C, Unless Otherwise Specified (Continued) Die Characteristics 0.05 SUBSTRATE POTENTIAL (POWERED UP): 0.04 707mVRMS 360mVRMS THD+N (%) 0.03 GND (DFN Paddle Connection: Tie to GND or Float) TRANSISTOR COUNT: 432 PROCESS: Submicron CMOS 0.02 177mVRMS 0.01 V+ = 3.3V VBIAS = 0VDC RL =32 0 20 100 200 1k 2k FREQUENCY (Hz) 10k 20k FIGURE 21. TOTAL HARMONIC DISTORTION vs FREQUENCY 13 FN6582.0 February 25, 2009 ISL54063, ISL54064 Thin Dual Flat No-Lead Plastic Package (TDFN) 2X 0.10 C A A D 2X 0.10 C B L10.3x3A 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL A A1 E MIN 0.70 - NOMINAL 0.75 0.20 REF MAX 0.80 0.05 NOTES - 6 INDEX AREA TOP VIEW B A3 b D D2 E // A 0.10 C 0.08 C 0.20 2.95 2.25 2.95 1.45 0.25 3.0 2.30 3.0 1.50 0.50 BSC 0.30 3.05 2.35 3.05 1.55 5, 8 7, 8 7, 8 - E2 e k 0.25 0.25 0.30 10 5 0.35 8 2 3 Rev. 3 3/06 C SEATING PLANE SIDE VIEW A3 L N D2 (DATUM B) 1 2 D2/2 7 8 Nd NOTES: 6 INDEX AREA (DATUM A) 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. NX k E2 E2/2 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N 8 N-1 NX b e (Nd-1)Xe REF. BOTTOM VIEW C L NX (b) 5 SECTION "C-C" CC e TERMINAL TIP (A1) L1 9L 5 0.10 M C A B 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Compliant to JEDEC MO-229-WEED-3 except for D2 dimensions. FOR ODD TERMINAL/SIDE 14 FN6582.0 February 25, 2009 ISL54063, ISL54064 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) D A B L10.1.8x1.4A 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL MIN 0.45 NOMINAL 0.50 0.127 REF 0.15 1.75 1.35 0.20 1.80 1.40 0.40 BSC 0.35 0.45 0.40 0.50 10 2 3 0 12 0.45 0.55 0.25 1.85 1.45 MAX 0.55 0.05 NOTES 5 2 3 3 4 Rev. 3 6/06 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on D and E side, respectively. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. 8. Maximum allowable burrs is 0.076mm in all directions. 6 INDEX AREA 2X 2X 0.10 C N E 1 0.10 C 2 A A1 TOP VIEW A3 b 0.10 C 0.05 C SEATING PLANE A1 SIDE VIEW A D C E e L L1 N (DATUM A) PIN #1 ID L1 NX L 1 2 NX b 5 10X 0.10 M C A B 0.05 M C 5 7 e BOTTOM VIEW (DATUM B) Nd Ne NX (b) 5 (A1) C L L SECTION "C-C" CC 2.20 1.00 0.60 e TERMINAL TIP 9. JEDEC Reference MO-255. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 1.00 0.50 1.80 0.40 0.20 0.40 10 LAND PATTERN 0.20 All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 15 FN6582.0 February 25, 2009 |
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