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MA4FCP300
Silicon Flip Chip PIN Diode
Features
* * * * * * Lower Series Resistance : 2.6 Lower Capacitance : 40 fF Faster Switching Speed : 40 nS Silicon Nitride Reliability Passivation Polyimide Scratch Protection Designed for Automated Pick and Place Insertion * Rugged by Design
Top View
Rev. V1
1269 Outline
A
B F
Description
M/A-COM's MA4FCP Series consists of Silicon Flip Chip PIN diodes fabricated with M/A-COM's patented HMIC process. This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics. This diode is fully passivated with Silicon Nitride and has an additional layer of Polyimide for scratch protection. These protective coatings prevent damage to the junction during automated or manual handling. This flip chip configuration is suitable for pick and place insertion.
Side View D
E
D
C
Bottom View
Applications
The small 0315 outline and low 0.12 pS RC product, make the device useful for multi-throw switch and switched phase shifter circuits requiring < 40 nS switching speeds up to 18 GHz operating frequency.
Cathode Mark
Dim . A B C D E F
inches min. 0.0269 0.0135 0.0040 0.0041 0.0124 0.0069 max. 0.0289 0.0155 0.0080 0.0061 0.0144 0.0089
(mm) min. 0.683 0.343 0.102 0.105 0.315 0.175 max. 0.733 0.393 0.203 0.155 0.365 0.225
Absolute Maximum Ratings @ 25 C 1
Parameter Absolute Maximum
Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated Power Mounting Temperature
1. 1
100 mA - 100 V - 55 C to + 125 C - 55 C to + 150 C + 175 C 150 mW + 300 C for 10 seconds
Exceeding these limits may cause permanent damage.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed.
* North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
MA4FCP300
Silicon Flip Chip PIN Diode
Electrical Specifications @ TA = +25C
Parameters @ Conditions Total Capacitance @ -10V, 1MHz Total Capacitance @ -10V, 1GHz1,3 Series Resistance @ +50mA2,3, 100MHz Series Resistance @ +50mA2,3, 1GHz Forward Voltage @ +100mA Reverse Voltage @ -10A Reverse Current @ -40V 50 - 90 % Lifetime @ + 10mA / - 6mA Steady State Thermal Resistance4 1. 2. 3. 4.
1
Rev. V1
Symbol CT CT RS RS VF VR IR TL
Units pF pF V V A ns C/W
Min.
Typ. 0.04 0.025 2.1 2.6 1.1 | -100 | 140 450
Max. 0.08 2.8 1.5 | - 10 |
| -70 |
Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance, Cp. Series resistance RS is equivalent to the total diode series resistance including the junction resistance Rj. Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package. Steady-State Thermal Resistance measured with die mounted in an ODS-186 package.
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Assembly Procedures
The following precautions should be observed to avoid damaging these devices.
Mounting Techniques
These devices were designed for insertion onto hard or soft substrates with the junction side down. They can be mounted with electrically conductive epoxy or with a low temperature solder preform. The die can also be assembled with the junction side up, and wire or ribbon bonds made to the pads.
Cleanliness
These devices should be handled in a clean environment. Do not attempt to clean die after installation.
ESD
These devices very susceptible to ESD and are rated Class 0 (0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF 10%, R = 1.5k 1%]. Even though tested die pass 100V ESD, they must be handled in a static-free environment.
Solder Die Attach using Electrically Conductive Ag Epoxy and Solder
These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted onto silkscreened circuits using Electrically Conductive Ag Epoxy, approximately 1-2 mils in thickness and cured at approximately 90C to 150 C per manufacturer's schedule. For extended cure times > 30 minutes, temperatures must be below 200 C. Sn Rich Solders ( > 30 % by Weight ) are not recommended due to the Tungsten Metallization scheme beneath the gold contacts. Indalloy or 80 Au/20 Sn Solders are acceptable. Maximum soldering temperature must be < 300 C for < 10 seconds.
General Handling
The protective polymer coating on the active areas of these devices provides scratch protection, particularly for the metal airbridge that contacts the anode. Die can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-place equipment.
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ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed.
* North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
MA4FCP300
Silicon Flip Chip PIN Diode
Circuit Mounting Dimensions ( Inches )
Rev. V1
0.013
0.012 (2) PL
0.008 (2) PL
Ordering Information
Part Number MA4FCP300 MA4FCP300-T MA4FCP300-W Packaging Die in Carrier Tape/Reel Wafer on Frame
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ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed.
* North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
MA4FCP300
Silicon Flip Chip PIN Diode
Capacitance vs Frequency
0.08 0.07 0.06 0.05 Ct (F) 0.04
Rev. V1
Ct @ -10V
0.03 0.02 0.01 0.00 0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
Frequency (GHz)
Rs vs Frequency
5.00 4.50 4.00 3.50 Rs ( Ohms ) 3.00 2.50 2.00 1.50 1.00 0.50 0.00 0.10
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed.
Rs @ 50 mA
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
Frequency (GHz)
* North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
MA4FCP300
Silicon Flip Chip PIN Diode Diode Model
Rs
Rev. V1
_
Ls = 0.6 nH
+
Ct
MA4FCP300 SPICE Model PinDiodeModel NLPINM1 Is=1.0E-14 A wBv= 100 V Vi=0.0 V wPmax= 125 mW Un= 900 cm^2/V-sec Ffe= 1.0 Wi= 7.5 um AllParams= Rr= 20 K Ohms Cjmin= 0.04 pF Tau= 0.14 usec Rs(I)= Rc + Rj(I) = 0.05 Ohm + Rj(I) Cj0= 0.07 pF Vj= 0.7 V M= 0.5 Fc= 0.5 Imax= 1.0 E+5 A/m^2 Kf=0.0 Af=1.0
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed.
5
* North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

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