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 SSG9410
18A, 30V,RDS(ON) 6m[ Elektronische Bauelemente
N-Channel Enhancement Mode Power Mos.FET
RoHS Compliant Product
SOP-8
Description
The SSG9410 provide the designer with the best Combination of fast switching, ruggedized device design, Ultra low on-resistance and cost-effectiveness.
The SOP-8 is universally preferred for all commercial industrial surface mount application and suited for low voltage applications such as DC/DC converters.
0.35 0.49 1.27Typ. 4.80 5.00 0.100.25 3.80 4.00 6.20 5.80 0.25 0.40 0.90 0.19 0.25
45
o
0.375 REF
Features
* Low on-resistance * Simple drive requirement
D 8 D 7 D 6 D 5
0 o 8
o
1.35 1.75
Dimensions in millimeters
D
* Fast switching Characteristic
Date Code
9410SC
G
1 S
2 S
3 S
4 G
S
Absolute Maximum Ratings
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current
1 3
Symbol
VDS VGS ID@TA=25 C ID@TA=70 C IDM PD@TA=25 C
o o o
Ratings
30
20 18 15 80 2.5 0.02
Unit
V V A A A W
W / oC
o
3
Total Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range
Tj, Tstg
-55~+150
C
Thermal Data
Parameter
Thermal Resistance Junction-ambient 3
Symbol
Rthj-a
Ratings
50
o
Unit
C /W
http://www.SeCoSGmbH.com/
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 1 of 4
SSG9410
Elektronische Bauelemente 18A, 30V,RDS(ON) 6m [ N-Channel Enhancement Mode Power Mos.FET
Electrical Characteristics( Tj=25 C Unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current
o Drain-Source Leakage Current (Tj=25 C)
o
Symbol
BVDSS BVDS/ Tj VGS(th) IGSS IDSS
Min.
30
_
Typ.
_
Max.
_ _
Unit
V V/ C V nA uA uA
o
Test Condition
VGS=0V, ID=250uA Reference to 25 C ,ID=1mA VDS=VGS, ID=250uA VGS= 12V VDS=30V,VGS=0 VDS=24V,VGS=0 VGS=10V, ID=18A
o
0.01
_ _ _ _ _ _
_
_ _ _ _
1.2
100
1 25 5 6
8 95
_ _
Drain-Source Leakage Current (Tj=70oC)
Static Drain-Source On-Resistance
2
RDS(ON)
_
m[
VGS=4.5V, ID=12A
VGS=2.5V, ID=6A
_
_
Total Gate Charge
2
Qg Qgs Qgd Td(ON) Tr Td(Off) Tf Ciss Coss Crss Gfs
_ _ _ _ _ _ _ _ _ _
59 10 23 16 12 96 30 5080 660 400 47
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance
2
nC
ID=18A VDS=24V VGS=4.5V
_
_ _ _
VDS=15V ID=1A nS VGS=10V RG=3.3[ RD=15[
8100
_ _
pF
VGS=0V VDS=25V f=1.0MHz
_
_
S
VDS=10V, ID=12A
Source-Drain Diode
Parameter
Forward On Voltage 2
Reverse Recovery Time
2
Symbol
VSD
Trr Qrr
Min.
_
Typ.
_
Max.
-1.2
Unit
V
Test Condition
IS=18A, VGS=0V.
Is=18A, VGS=0 dl/dt=100A/uS
_ _
43 39
_ _
nS nC
Reverse Recovery Charge
Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse widthO 300us, dutycycleO2%. 3.Surface mounted on 1 inch2 copper pad of FR4 board; 270C/W when mounted on min. copper pad.
http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 2 of 4
SSG9410
Elektronische Bauelemente 18A, 30V,RDS(ON) 6m [ N-Channel Enhancement Mode Power Mos.FET
Characteristics Curve
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
Fig 5. Forward Characteristics of Reverse Diode
http://www.SeCoSGmbH.com/
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 3 of 4
SSG9410
Elektronische Bauelemente 18A, 30V,RDS(ON) 6m[ N-Channel Enhancement Mode Power Mos.FET
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Circuit
http://www.SeCoSGmbH.com/
Fig 12. Gate Charge Waveform
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 4 of 4


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