View RJK1525DPE_4272640.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

RJK1525DPJ, RJK1525DPE, RJK1525DPF
Silicon N Channel MOS FET High Speed Power Switching
REJ03G0623-0100 Rev.1.00 Apr.22,2005
Features
* Low on-resistance * Low leakage current * High speed switching
Outline
RENESAS Package code: PRSS0004AE-A RENESAS Package code: PRSS0004AE-B (Package name LDPAK(L)) (Package name LDPAK(S)-(1))
4 4
RENESAS Package code: PRSS0004AE-C (Package name LDPAK(S)-(2))
4
1 1
2
3
1
2
2
RJK1525DPE
3
3
RJK1525DPJ
D
RJK1525DPF
G
1. Gate 2. Drain 3. Source 4. Drain
S
Rev.1.00, Apr.22.2005, page 1 of 7
RJK1525DPJ, RJK1525DPE, RJK1525DPF
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to Source voltage Gate to Source voltage Drain current Drain peak current Body-Drain diode reverse Drain current Body-Drain diode reverse Drain peak current Avalanche current Avalanche energy Channel dissipation Channel to case thermal impedance Channel temperature Storage temperature Notes: 1. PW 10 s, duty cycle 1% 2. Value at Tc = 25C 3. STch = 25C, Tch 150C Symbol VDSS VGSS ID ID (pulse)Note1 IDR IDR (pulse)Note1 IAPNote3 EARNote3 Pch Note2 ch-c Tch Tstg Ratings 150 30 25 50 25 50 17 21.6 75 1.67 150 -55 to +150 Unit V V A A A A A mJ W C/W C C
Electrical Characteristics
(Ta = 25C)
Item Drain to Source breakdown voltage Zero Gate voltage drain current Gate to Source leak current Gate to Source cutoff voltage Forward transfer admittance Static Drain to Source on state resistance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total Gate charge Gate to Source charge Gate to Drain charge Body-Drain diode forward voltage Body-Drain diode reverse recovery time Body-Drain diode reverse recovery charge Notes: 4. Pulse test Symbol V(BR)DSS IDSS IGSS VGS(off) |yfs| RDS(on) Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd VDF trr Qrr Min 150 -- -- 3.0 7 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- 12 0.093 680 150 22 22 110 45 12 18 4.5 9 0.95 100 0.4 Max -- 1 0.1 4.5 -- 0.110 -- -- -- -- -- -- -- -- -- -- 1.50 -- -- Unit V A A V S pF pF pF ns ns ns ns nC nC nC V ns C Test conditions ID = 10 mA, VGS = 0 VDS = 150 V, VGS = 0 VGS = 30 V, VDS = 0 VDS = 10 V, ID = 1 mA ID = 12.5 A, VDS = 10 V Note4 ID = 12.5 A, VGS = 10 VNote4 VDS = 25 V VGS = 0 f = 1 MHz ID = 12.5 A VGS = 10 V RL = 6 Rg = 10 VDD = 120 V VGS = 10 V ID = 25 A IF = 25 A, VGS = 0 Note4 IF = 25 A, VGS = 0 diF/dt = 100 A/s
Rev.1.00, Apr.22.2005, page 2 of 7
RJK1525DPJ, RJK1525DPE, RJK1525DPF
Main Characteristics
Power vs. Temperature Derating 100
Pch (W)
Maximum Safe Operation Area 1000 Ta = 25C 300
ID (A)
100 30 10
1m
Operation in this RDS(on) DC Operation (Tc = 25C) PW = 10 ms (1shot)
75
10 s
Channel Dissipation
10 0 s s
Drain Current
50
3
1 area is limited by 0.3 0.1 0.03 0.01
25
0
50
100
150 Tc (C)
200
1
Case Temperature
100 300 1000 30 3 10 Drain to Source Voltage VDS (V)
Typical Output Characteristics 20 6.5 V 7V 16
ID (A)
Typical Transfer Characteristics 20 VDS = 10 V Pulse Test 16 6V
ID (A) Drain Current
Pulse Test
10 V
12
12
Drain Current
8
5.5 V
8 Tc = 75C 4 25C -25C
4
VGS = 5 V
0
4 8 12 Drain to Source Voltage
16 20 VDS (V)
0
2 4 6 Gate to Source Voltage
8 10 VGS (V)
Drain to Source Saturation Voltage vs. Gate to Source Voltage 8
Drain to Source Saturation Voltage VDS(on) (V) Drain to Source on State Resistance RDS(on) ()
Pulse Test
Static Drain to Source on State Resistance vs. Drain Current 1 VGS = 10 V 0.5
6
0.2 0.1 0.05
4 ID = 25 A 2 12.5 A 8.5 A 0 4 8 12 16 VGS (V) 20 Gate to Source Voltage
0.02 0.01 1 3 10 30 Drain Current Pulse Test 100 300 ID (A) 1000
Rev.1.00, Apr.22.2005, page 3 of 7
RJK1525DPJ, RJK1525DPE, RJK1525DPF
Static Drain to Source on State Resistance vs. Temperature 0.5 VGS = 10 V Pulse Test 0.4 Forward Transfer Admittance vs. Drain Current
Static Drain to Source on State Resistance RDS(on) ()
Forward Transfer Admittance |yfs| (S)
100 30 10 3 1 0.3 0.1 0.1 VDS = 10 V Pulse Test 0.3 1 3 10 ID (A) 30 100 75C
Tc = -25C
0.3
25C
0.2
ID = 25 A 12.5 A 8.5 A
0.1 0 -25
0
25
50
75
100 125 Tc (C)
150
Case Temperature
Drain Current
Body-Drain Diode Reverse Recovery Time 1000 100000 30000
Typical Capacitance vs. Drain to Source Voltage VGS = 0 f = 1 MHz
Reverse Recovery Time trr (ns)
500
100 50 20 10 5 2 1 1 3 10 30 100 300 1000 Reverse Drain Current IDR (A) Dynamic Input Characteristics 240 16 di / dt = 100 A / s VGS = 0, Ta = 25C
Capacitance C (pF)
200
10000 3000 1000 300 100 30 10 0 50 Drain to Source Voltage Crss 100 VDS (V) 150 Coss Ciss
1000
Switching Characteristics VGS = 10 V, VDD = 75 V PW = 5 s, duty < 1 % RG = 10 tr
VDS (V)
180
Drain to Source Voltage
Gate to Source Voltage
VDD = 30 V 60 V 120 V VDS
12
Switching Time t (ns)
VGS
VGS (V)
ID = 25 A
100
tf td(off) td(on)
120
8
10
tr
tf
60 VDD = 120 V 60 V 30 V 0 4 8 12 16
4
0 20
1 0.1
0.3
Gate Charge
Qg (nC)
1 3 Drain Current
10 30 ID (A)
100
Rev.1.00, Apr.22.2005, page 4 of 7
RJK1525DPJ, RJK1525DPE, RJK1525DPF
Reverse Drain Current vs. Source to Drain Voltage 50
IDR (A) Gate to Source Cutoff Voltage VGS(off) (V)
Gate to Source Cutoff Voltage vs. Case Temperature 5 VDS = 10 V ID = 10 mA 4 1 mA 3
40
Reverse Drain Current
30
20 VGS = 0 V 10 10 V 5V Pulse Test 0 0.4 0.8 1.2 1.6 VSD (V) 2.0
2
0.1 mA
1 0 -25
0
25
50
75
100 125 150 Tc (C)
Source to Drain Voltage
Case Temperature
Normalized Transient Thermal Impedance vs. Pulse Width 3
Normalized Transient Thermal Impedance s (t)
Tc = 25C
1
D=1 0.5
0.2
0.3 0.1
0.1
0.05 0.02 1 0.0 ulse tp ho 1s
0.03 0.01
ch - c(t) = s (t) * ch - c ch - c = 1.67C/W, Tc = 25C
PDM PW T
D=
PW T
0.003 0.001 10
100
1m
10 m Pulse Width PW (s)
100 m
1
10
Switching Time Test Circuit Vin Monitor D.U.T. RL 10 Vin 10 V V DD = 75 V Vin Vout 10% 10% Vout Monitor
Waveform
90%
10% 90% td(off) tf
90% td(on)
tr
Rev.1.00, Apr.22.2005, page 5 of 7
RJK1525DPJ, RJK1525DPE, RJK1525DPF
Package Dimensions
* RJK1525DPJ
JEITA Package Code
RENESAS Code
PRSS0004AE-A
Package Name LDPAK(L) / LDPAK(L)V
MASS[Typ.] 1.40g
Unit: mm
(1.4)
4.44 0.2 10.2 0.3 1.3 0.15
11.3 0.5 0.3 10.0 + 0.5 -
8.6 0.3
1.3 0.2 1.37 0.2
0.76 0.1 2.54 0.5 2.54 0.5
11.0 0.5
0.2 0.86 + 0.1 -
2.49 0.2
0.4 0.1
* RJK1525DPE
JEITA Package Code SC-83 RENESAS Code PRSS0004AE-B Package Name LDPAK(S)-(1) / LDPAK(S)-(1)V MASS[Typ.] 1.30g
Unit: mm
4.44 0.2 10.2 0.3
(1.4)
8.6 0.3
+ 0.3 - 0.5
10.0
(1.5)
(1.5)
2.49 0.2 0.2 0.1 + 0.1 -
7.8 7.0
2.2
1.37 0.2 1.3 0.2 2.54 0.5
0.3 3.0 + 0.5 -
0.2 0.86 + 0.1 -
0.4 0.1
2.54 0.5
Rev.1.00, Apr.22.2005, page 6 of 7
1.7
1.3 0.15
7.8 6.6
RJK1525DPJ, RJK1525DPE, RJK1525DPF * RJK1525DPF
JEITA Package Code RENESAS Code PRSS0004AE-C Package Name LDPAK(S)-(2) / LDPAK(S)-(2)V MASS[Typ.] 1.35g
Unit: mm
4.44 0.2 10.2 0.3
(1.4)
8.6 0.3
+ 0.3 - 0.5
2.49 0.2
10.0
(1.5)
(2.3)
0.2 0.1 + 0.1 -
7.8 7.0
2.2
1.37 0.2 1.3 0.2 2.54 0.5 0.4 0.1
0.3 5.0 + 0.5 -
0.2 0.86 + 0.1 -
2.54 0.5
Ordering Information
Part Name RJK1525DPE-LE Quantity 1000 pcs Taping Shipping Container
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.1.00, Apr.22.2005, page 7 of 7
1.7
1.3 0.15
7.8 6.6
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .2.0

▲Up To Search▲

Price & Availability of RJK1525DPE

	To Download RJK1525DPE Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .