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| GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS DESCRIPTION The MOC8204 device consists of a gallium arsenide infrared emitting diode optically coupled to a high voltage, silicon, phototransistor detector in a standard 6-pin DIP package. It is designed for high voltage applications and is particularly useful in copy machines and solid state relays. MOC8204 APPLICATIONS * * * * Copy Machines Interfacing and coupling systems of different potentials and impedances Monitor and Detection Circuits Solid State Relays SCHEMATIC 1 6 2 5 3 NC 4 PIN 1. ANODE 2. CATHODE 3. NO CONNECTION 4. EMITTER 5. COLLECTOR 6. BASE Parameter TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Input-Output Isolation Voltage Peak ac Voltage, 60 Hz, 1 Second Duration(1) Total Device Power Dissipation @ TA = 25C Derate above 25C EMITTER DC/Average Forward Input Current Forward Current - Peak (Pulse Width = 1s, 330 pps) LED Power Dissipation @ TA = 25C Derate above 25C DETECTOR Collector-Emitter Voltage Collector-Base Voltage Emitter-Collector Voltage Detector Power Dissipation @ TA = 25C Derate above 25C Symbol TSTG TOPR TSOL VISO PD IF IF(pk) PD VCEO VCBO VECO PD Value -55 to +150 -55 to +100 260 for 10 sec 7500 250 2.94 60 1.2 120 1.41 400 400 7 150 1.76 Units C C C Vac(pk) mW mA A mW mW/C V V V mW mW/C 2001 Fairchild Semiconductor Corporation DS300269 3/22/01 1 OF 6 www.fairchildsemi.com GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS MOC8204 ELECTRICAL CHARACTERISTICS (TA = 25C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter EMITTER Input Forward Voltage Reverse Leakage Current Capacitance DETECTOR Collector-Emitter Breakdown Voltage (IC = 1.0 mA, RBE = 1M!) Collector-Base Breakdown Voltage Emitter-Base Breakdown Voltage Collector-Emitter Dark Current TA = 25C TA = 100C (RBE = 1M!, VCE = 300 V) ICEO -- -- -- -- 100 250 nA A (IC = 100 A) (IE = 100 A) Test Conditions (IF = 10 mA) (VR = 6.0 V) (V = 0, f =1 MHz) Symbol VF IR CJ BVCEO BVCBO BVEBO Min -- -- -- 400 400 7 Typ(1) 1.2 -- 18 -- -- -- Max 15 10 -- -- -- -- Unit V A pF V V V ISOLATION CHARACTERISTICS Characteristic Output Collector Current Test Conditions Symbol (CTR)(2) V(SAT) VISO RISO CISO (VCC = 10 V, IC = 2 mA, RL = 100!) tON tOFF -- -- Min 2 (20) -- 5300 7300 -- Typ(1) -- -- -- -- 1011 0.2 5 5 -- -- Max -- 0.4 -- -- -- Units mA(%) V VAC(RMS) VAC(PEAK) ! pf s (VCE = 10 V, IF = 10 mA, RBE = 1M!) IC Collector-Emitter Saturation Voltage (IC = 0.5 mA, IF = 10 mA, RBE = 1M!) Input-Output Isolation Voltage(3) Isolation Resistance(3) Isolation Capacitance(1) Turn-On Time Turn-Off Time (II-O 1 A, Time = 1min) Notes 1. Alway design to the specified minimum/maximum electrical limits (where applicable). 2. Current Transfer Ratio (CTR) = IC /IF x 100%. 3. For this test LED pins 1 and 2 are common and phototransistor Pins 4,5 and 6 are common. www.fairchildsemi.com 2 OF 6 3/22/01 DS300269 GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS MOC8204 50 ICER, OUTPUT CURRENT (mA) ICER, OUTPUT CURRENT (mA) 20 10 5 2 1 0.5 0.2 0.1 1 2 5 10 20 IF, LED INPUT CURRENT (mA) 50 RBE = 106 VCE = 10 V TA = 25C RBE = 106 VCE = 10 V IF = 20 mA IF = 10 mA IF = 5 mA 20 10 5 2 1 -60 -40 -20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (C) 100 Figure 1. Output Current versus LED Input Current Figure 2. Output Current versus Temperature 40 ICER , OUTPUT CURRENT (mA) 10 5.0 1.0 5 1 0.05 RBE = 106 TA = 25C VF, FORWARD VOLTAGE (VOLTS) IF = 50 mA IF = 10 mA IF = 5 mA 2 1.8 PULSE ONLY PULSE OR DC 1.6 1.4 TA = -55C 25C 100C 1 10 100 IF, LED FORWARD CURRENT (mA) 1000 1.2 1 0.01 0.005 0.1 0.5 1 5 10 50 100 VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS) 300 Figure 3. Output Characteristics 300 IF = 50 mA 240 180 RBE = 106 VCE = 10 V Figure 4. Forward Characteristics ICBO, COLLECTOR-BASE CURRENT (A) 1000 ICER , DARK CURRENT (nA) 100 VCE = 300 V VCE = 100 V 10 VCE = 50 V 1 RBE = 106 120 60 0 -60 -40 IF = 10 mA IF = 5 mA -20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (C) 100 20 30 40 50 60 70 80 90 100 TA, AMBIENT TEMPERATURE (C) Figure 5. Collector-Base Current versus Temperature Figure 6. Dark Current versus Temperature DS300269 3/22/01 3 OF 6 www.fairchildsemi.com GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS MOC8204 Package Dimensions (Through Hole) PIN 1 ID. Package Dimensions (Surface Mount) 0.350 (8.89) 0.330 (8.38) 3 0.270 (6.86) 0.240 (6.10) 2 1 PIN 1 ID. 0.270 (6.86) 0.240 (6.10) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 4 5 6 0.070 (1.78) 0.045 (1.14) 0.300 (7.62) TYP 0.200 (5.08) 0.135 (3.43) 0.200 (5.08) 0.165 (4.18) 0.020 (0.51) MIN 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.300 (7.62) TYP 0.020 (0.51) MIN 0.100 (2.54) TYP 0.016 (0.41) 0.008 (0.20) 0.154 (3.90) 0.100 (2.54) 0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0 to 15 Lead Coplanarity : 0.004 (0.10) MAX Package Dimensions (0.4"Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.270 (6.86) 0.240 (6.10) 0.070 (1.78) 0.060 (1.52) 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 0.415 (10.54) 0.100 (2.54) 0.030 (0.76) SEATING PLANE 0.295 (7.49) 0.200 (5.08) 0.135 (3.43) 0.154 (3.90) 0.100 (2.54) 0.004 (0.10) MIN 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0 to 15 0.400 (10.16) TYP www.fairchildsemi.com 4 OF 6 3/22/01 DS300269 GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS MOC8204 ORDERING INFORMATION Option R2 S SD SDL W 300 300W 3S 3SD Order Entry Idenifier .R2 .S .SD .SDL .W .300 .300W .3S .3SD Description Opto Plus Reliability Conditioning Surface Mount Lead Bend Surface Mount; Tape and reel Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel QT Carrier Tape Specifications 12.0 0.1 4.85 0.20 4.0 0.1 0.30 0.05 4.0 0.1 O1.55 0.05 1.75 0.10 7.5 0.1 13.2 0.2 16.0 0.3 9.55 0.20 0.1 MAX 10.30 0.20 O1.6 0.1 User Direction of Feed DS300269 3/22/01 5 OF 6 www.fairchildsemi.com GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 6 OF 6 3/22/01 DS300269 |
Price & Availability of MOC8204
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