|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6305 Issued Date : 1992.09.09 Revised Date : 2002.02.21 Page No. : 1/4 HMPSA14 NPN SILICON TRANSISTOR Description The HMPSA14 is designed for applications requiring extremely high current gain collector current to 500mA. Features * High D.C current Gain * HMPSA14 Complementary to HMPSA64 TO-92 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 30 V VCES Collector to Emitter Voltage ...................................................................................... 30 V VEBO Emitter to Base Voltage ............................................................................................ 10 V IC Collector Current ....................................................................................................... 500 mA Characteristics (Ta=25C) Symbol BVCBO BVCES BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Cob Min. 30 30 10 10K 20K 125 Typ. Max. 100 100 1.5 2 6 Unit V V V nA nA V V Test Conditions IC=100uA, IE=0 IC=0.1mA, VBE=0 IE=10uA, IC=0 VCB=30V, IE=0 VEB=10V, IC=0 IC=100mA, IB=0.1mA VCE=5V, IC=100mA IC=10mA, VCE=5V IC=100mA, VCE=5V IC=10mA, VCE=5V, f=100MHz VCB=10V, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF HMPSA14 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000000 1000 o Spec. No. : HE6305 Issued Date : 1992.09.09 Revised Date : 2002.02.21 Page No. : 2/4 Saturation Voltage & Collector Current hFE @ VCE=5V 25 C 125 C o Saturation Voltage (mV) 75 C o o hFE 100000 25 C 75 C o o 125 C VCE(sat) @ IC=1000IB 10000 10 100 1000 100 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 10000 VBE(ON) @ VCE=5V 10 Capacitance & Reverse-Biased Voltage ON Voltage (mV) Capacitance (pF) Cob 25 C 1000 125 C 75 C o o o 100 1 10 100 1000 1 0.1 1 10 100 Collector Current-IC (mA) Reverse-Biased Voltage (V) Cutoff Frequency & Collector Current 1000 10000 Safe Operating Area Cutoff Frequency (MHz).. . VCE=5V Collector Current-IC (mA) 1000 PT=1ms 100 PT=100ms PT=1s 100 10 10 1 10 100 1000 1 1 10 100 Collector Current (mA) Forward Voltage-VCE (V) HMPSA14 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6305 Issued Date : 1992.09.09 Revised Date : 2002.02.21 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD (mW) 500 400 300 200 100 0 0 50 100 o 150 200 Ambient Temperature-Ta ( C) HMPSA14 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6305 Issued Date : 1992.09.09 Revised Date : 2002.02.21 Page No. : 4/4 2 Marking: H MP S A14 Control Code 3 C Style: Pin 1.Emitter 2.Base 3.Collector D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMPSA14 HSMC Product Specification |
Price & Availability of HMPSA14 |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |