| PART |
Description |
Maker |
| XC17V00 DS073 XC17V16PC20C XC17V16PC20I XC17V16PC4 |
GIGATRUE 550 CAT6 PATCH 100 FT, SNAGLESS, BLACK 2M X 1 CONFIGURATION MEMORY, PQCC20
XC17V00 Series Configuration PROM XC17V00系列配置PROM
XC17V00 Series Configuration PROM 2M X 8 CONFIGURATION MEMORY, PQFP44
Advance Product Specification
From old datasheet system
|
Xilinx, Inc.
XILINX[Xilinx, Inc]
|
| ASP-135020-01 |
CONTACT CONFIGURATION NOT AVAILABLE AS STANDARD.
|
Samtec, Inc
|
| ASP-137968-01 |
CONTACT CONFIGURATION NOT AVAILABLE AS STANDARD
|
Samtec, Inc
|
| XC1736-PD8C XC1765-PD8C XC1736-CD8C XC1736-CD8M XC |
High reliability part. For price, availability and ordering contact Coilcraft Critical Products, cp@coilcraft.com
Configuration EPROM 配置存储
|
Mini-Circuits
|
| XCF01SV XCF01SVG XCF01SVO20C XCF01SVO48 XCF01SVOG2 |
Platform Flash In-System Programmable Configuration PROMS 平台Flash在系统可编程配置方案管理系统
Platform Flash In-System Programmable Configuration PROMS 8M X 1 CONFIGURATION MEMORY, PDSO48
|
Xilinx, Inc.
PROM
XILINX INC
|
| AT17F080 AT17F080-30BJC AT17F080-30BJI AT17F080-30 |
FPGA CONFIGURATION FLASH MEMORY 4M X 1 CONFIGURATION MEMORY, PQCC20
|
Atmel, Corp.
http://
Atmel Corp.
ATMEL[ATMEL Corporation]
|
| IDT72T4088L6-7BB IDT72T4098L6-7BB IDT72T4088L6-7BB |
Insulation Displacement (IDC) Connector; No. of Contacts:36; Contact Termination:IDC; Gender:Female; Pitch Spacing:0.1" RoHS Compliant: Yes 64K X 40 OTHER FIFO, 3.2 ns, PBGA208
Insulation Displacement (IDC) Connector; No. of Contacts:36; Contact Termination:IDC; Gender:Female; Pitch Spacing:0.1" RoHS Compliant: Yes 2.5伏高速TeraSync？？复员/特别提款权的FIFO 40位配
2.5 VOLT HIGH-SPEED TeraSync DDR/SDR FIFO 40-BIT CONFIGURATION 16K X 40 OTHER FIFO, 3.6 ns, PBGA208
Insulation Displacement (IDC) Connector; No. of Contacts:44; Contact Termination:IDC; Gender:Female; Pitch Spacing:0.1" RoHS Compliant: Yes 2.5伏高速TeraSync？？复员/特别提款权的FIFO 40位配
2.5 VOLT HIGH-SPEED TeraSync?? DDR/SDR FIFO 40-BIT CONFIGURATION
|
Integrated Device Technology, Inc.
INTEGRATED DEVICE TECHNOLOGY INC
|
| IRFK6J150 IRFK6H150 IRFK6H350 IRFK6J350 IRFK6JC50 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION 隔震基电力六角巴基斯坦大会平行芯片配
Lsolated Base Power HEX-pak Assembly Half Bridge Configuration
100V SINGLE HEXFET Power MOSFET in a TO-240AA package
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| MIP0210SP |
ISOLATOR 3P 25AISOLATOR 3P 25A; Poles, No. of:3; Current rating:25A; Configuration, contact:1 N/O 1 N/C; Depth, external:169mm; IP rating:IP55; Length / Height, external:174mm; Material:Steel; Power, switching AC3 max:5.5kW; Width,
Silicon MOS IC
|
PANASONIC CORP
Panasonic Semiconductor
|
| EPC1064 EPC1 EPC1213 EPC1441 EPC1441XXX EPC1064PC8 |
Configuration devices for SRAM-based LUT devices, 440,800 1-bit device with 5.0-V or 3.3-V operation
Configuration devices for SRAM-based LUT devices, 65,536 1-bit device with 3.3-V operation
Configuration devices for SRAM-based LUT devices, 65,536 1-bit device with 5.0-V operation
Configuration devices for SRAM-based LUT devices, 212,942 1-bit device with 5.0-V operation
|
Altera Corporation
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
| PSHI75D-06 PSHI75D_06 PSHI75D/06 PSHI75D06 |
IGBT Module H-Bridge Configuration
IGBT Module PSHI H-Bridge Configuration
|
Powersem GmbH
|
