| PART |
Description |
Maker |
| 87874-3001 0878743001 |
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus Pa-S Header, Through Hole, Right Angle, Screw Mount
|
Molex Electronics Ltd.
|
| SD-70287-004 0702871009 |
2.54mm (.100") Pitch C-Grid庐 Header
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 0022282042 22-28-2042 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 85013-3093 0850133093 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ)Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭")Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛")Selective Gold (Au), 96 Circuits
|
Molex Electronics Ltd.
|
| 87911-5411 0879115411 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022284105 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022282035 22-28-2035 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Kinked PC Tails
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, with Kinked PC Tai
|
Molex Electronics Ltd.
|
| 0702800458 70280-0458 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
|
Molex Electronics Ltd.
|
| 0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0022122264 22-12-2264 |
2.54mm (.100) Pitch KK庐 Solid Header, Right Angle, with Friction Lock, 26 Circuits, 0.51渭m (20渭) Gold (Au) Plating
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 26 Circuits, 0.51μm (20μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
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