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solderless Datasheet PDF File

For solderless Found Datasheets File :: 422 Search Time::1.922ms
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				Semikron International
Part No.	SKIM459GD12E411
OCR Text	...igbt 4 trench gate technology ? solderless sinter technology ?v ce(sat) with positive temperature coefficient ? low inductance case ? isolated by al 2 o 3 dcb (direct copper bonded) ceramic substrate ? pressure contact technology for t...
Description	Trench IGBT Modules
File Size	302.77K / 5 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKIM406GD066HD
OCR Text	...IGBT 3 Trench Gate Technology * solderless sinter technology * VCE(sat) with positive temperature coefficient * Low inductance case * Isolated by Al2O3 DCB (Direct Copper Bonded) ceramic substrate * Pressure contact technology for thermal c...
Description	Trench IGBT Modules
File Size	203.61K / 5 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKIM429GD17E4HD
OCR Text	... IGBT 4 Trench Gate Technology solderless sinter technology Low inductance case Isolated by AL2O3 DCB (Direct Copper Bonded) ceramic substrate * Pressure contact technology for thermal contacts and electrical contacts * High short circuit ...
Description	Trench IGBT Modules
File Size	236.87K / 5 Page	View it Online	Download Datasheet

				THOMAS & BETTS CORP
Part No.	620-AG1TF
OCR Text	...2,86) .400 (10,16) .400 (10,16) solderless wrap styles: 3 level solderless wrap: add "f" to printed circuit part number. ex. 608-ag1tf pin style round solder pocket slotted round solder pocket slotted round solder pocket slotted round solde...
Description	DIP20, IC SOCKET
File Size	49.83K / 3 Page	View it Online	Download Datasheet

				THOMAS & BETTS CORP
Part No.	622-BG1F 622-CG1F
OCR Text	...2,86) .400 (10,16) .400 (10,16) solderless wrap styles: 3 level solderless wrap: add "f" to printed circuit part number. ex. 608-ag1tf pin style round solder pocket slotted round solder pocket slotted round solder pocket slotted round solde...
Description	DIP22, IC SOCKET
File Size	47.61K / 3 Page	View it Online	Download Datasheet

				J S T MFG CO LTD
Part No.	CE1 CE-100
OCR Text	...0514 o o o o o o o o o 1 2 oo o solderless splices closed-end style 1 style 2 certificate no.: e42024 lr20812 jq0607003 67 solderless splices closed-end wire combination table for closed-end splices specified by ...
Description	1.75 mm2, WIRE TERMINAL
File Size	81.76K / 3 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKIM459GD12E4
OCR Text	...IGBT 4 Trench Gate Technology * solderless sinter technology * VCE(sat) with positive temperature coefficient * Low inductance case * Isolated by Al2O3 DCB (Direct Copper Bonded) ceramic substrate * Pressure contact technology forthermal co...
Description	Trench IGBT Modules
File Size	186.93K / 5 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKIM306GD12E411
OCR Text	...igbt 4 trench gate technology ? solderless sinter technology ?v ce(sat) with positive temperature coefficient ? low inductance case ? isolated by al 2 o 3 dcb (direct copper bonded) ceramic substrate ? pressure contact technology for t...
Description	Trench IGBT Modules
File Size	287.17K / 5 Page	View it Online	Download Datasheet

				ITT CANNON
Part No.	055-604-9172310
OCR Text	...i-507 (page 123) straight plug, solderless version, without center contact* part number cable number 055-624-6703890 rg402/u * center conductor of cable is used as contact. assembly instruction ai-521 (page 123) straight plug, solderless ve...
Description	PANEL MOUNT, CABLE TERMINATED, FEMALE, SMA CONNECTOR, SOLDER, JACK
File Size	35.13K / 1 Page	View it Online	Download Datasheet

For solderless Found Datasheets File :: 422 Search Time::1.922ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |