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  solder clamp Datasheet PDF File

For solder clamp Found Datasheets File :: 3024    Search Time::1.609ms    
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    BTS734L1 BTS734-L1

Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. BTS734L1 BTS734-L1
OCR Text ... soldering point: upper side of solder edge of device pin 15. See page 16 Semiconductor Group 3 BTS 734 L1 Electrical Characteristi...clamp (inductive load switch off)11) at VON(CL) = Vbb - VOUT Thermal overload trip temperature Therm...
Description Ordering Code: Q67060-S7009
Smart Two Channel Highside Power Switch (Overload protection Current limitation Short-circuit protection Thermal shutdown)
From old datasheet system

File Size 185.31K  /  16 Page

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    CS235 CS235GDW18 CS235GDWR18 CS235GN18

ZF Electronics Corporation
CHERRY[Cherry Semiconductor Corporation]
Part No. CS235 CS235GDW18 CS235GDWR18 CS235GN18
OCR Text ...Lead Temperature soldering Wave solder (through hole styles only) .....................................................................................10 sec. max, 260C peak Reflow (SMD styles only) ............................................
Description System Photoelectric Smoke Detector

File Size 147.27K  /  6 Page

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    CXA2093 CXA2093S

SONY[Sony Corporation]
Part No. CXA2093 CXA2093S
OCR Text ...TERIAL PACKAGE MASS EPOXY RESIN solder PLATING COPPER ALLOY 0.95g 22PIN SDIP (PLASTIC) + 0.1 0.05 0.25 - 12 + 0.4 19.2 - 0.1 22 + 0.3 6.4 - 0.1 1 1.778 11 0.5 0.1 + 0.15 0.9 - 0.1 + 0.15 3.25 - 0.2 0.51 MIN ...
Description US Audio Multiplexing Decoder
Sharpness for Display

File Size 127.28K  /  11 Page

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    CXD1267AN D1267

SONY[Sony Corporation]
http://
Part No. CXD1267AN D1267
OCR Text ...RIAL PACKAGE WEIGHT EPOXY RESIN solder PLATING Cu ALLOY 0.1g -8- 0.5 0.2
Description    CCD Vertical Clock Driver
From old datasheet system

File Size 123.10K  /  8 Page

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    CXD1268 CXD1268M

SONY[Sony Corporation]
Part No. CXD1268 CXD1268M
OCR Text ...TERIAL PACKAGE MASS EPOXY RESIN solder PLATING COPPER ALLOY 0.3g -7- 0.6 0.2
Description From old datasheet system
CCD Vertical Clock Driver

File Size 111.82K  /  7 Page

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    CXL1517N CXL1518N CXL1517

SONY[Sony Corporation]
Part No. CXL1517N CXL1518N CXL1517
OCR Text ...TERIAL PACKAGE MASS EPOXY RESIN solder/PALLADIUM PLATING 42/COPPER ALLOY 0.1g -7- 0.5 0.2 7.6 0.2
Description CMOS-CCD Signal Processor

File Size 100.52K  /  7 Page

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    CXL1517 CXL1517M CXL1518M

SONY[Sony Corporation]
Part No. CXL1517 CXL1517M CXL1518M
OCR Text ...TERIAL PACKAGE MASS EPOXY RESIN solder PLATING COPPER ALLOY 0.3g -7- 0.5 0.2 1 0.45 0.1 10 6.9 + 0.1 0.2 - 0.05
Description From old datasheet system
CMOS-CCD Signal Processor

File Size 96.84K  /  7 Page

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    CXL5512M CXL5512P

SONY[Sony Corporation]
Part No. CXL5512M CXL5512P
OCR Text ...AGE WEIGHT EPOXY / PHENOL RESIN solder PLATING 42 ALLOY 0.1g CXL5512P 8PIN DIP (PLASTIC) 300mil 0.5 0.2 8 5 7.62 + 0.3 6.4 - 0.1 + 0.4 9.4 - 0.1 + 0.1 0.05 0.25 - 0 to 15 EPOXY RESIN solder PLATING COPPER ALLOY...
Description CMOS-CCD 1H Delay Line for NTSC

File Size 156.65K  /  9 Page

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    CXL5514M CXL5514P

SONY[Sony Corporation]
Part No. CXL5514M CXL5514P
OCR Text ...AGE WEIGHT EPOXY / PHENOL RESIN solder PLATING 42 ALLOY 0.1g CXL5514P 8PIN DIP (PLASTIC) 300mil 0.5 0.2 8 5 7.62 + 0.3 6.4 - 0.1 + 0.4 9.4 - 0.1 + 0.1 0.05 0.25 - 0 to 15 EPOXY RESIN solder PLATING COPPER ALLOY...
Description CMOS-CCD 1H Delay Line for PAL

File Size 142.57K  /  9 Page

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    HCPL-3700S HCPL-3700SD HCPL-3700W HCPL-3700 HCPL3700S HCPL3700V HCPL3700WV HCPL3700SD HCPL3700SDV HCPL3700SV

FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. HCPL-3700S HCPL-3700SD HCPL-3700W HCPL-3700 HCPL3700S HCPL3700V HCPL3700WV HCPL3700SD HCPL3700SDV HCPL3700SV
OCR Text ...ture Operating Temperature Lead solder Temperature EMITTER Input Current Average Surge Transient Input Voltage (Pins 2-3) Input Power Dissip...clamp Voltage VIHC2 VIHC3 VILC IIN VD1,2 VD3,4 VOL IOH ICCL ICCH CIN 6.1 7.0 7.3 V ...
Description 8-pin DIP AC/DC To Logic Interface Optocoupler

File Size 134.81K  /  11 Page

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For solder clamp Found Datasheets File :: 3024    Search Time::1.609ms    
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