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chip material gap gap Datasheet PDF File

For chip material gap gap Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Pomona Electronics
Part No.	4119 4119-93 4119-600
Description	BNC Feed-Thru Termination; Impedance:600ohm; Body Style:Straight Terminator; Body material:Brass; Dielectric material:Teflon; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes
File Size	19.08K / 1 Page	View it Online	Download Datasheet

				NEC[NEC] NEC Corp. NEC, Corp.
Part No.	BP1L2Q BP1L3N BP1J3P BP1A3M BP1A4A BP1A4M BP1F3P BP1F3P-T BP1F3P-T/JM BP1J3P-T/JM BP1A4A-T BP1A4A-T/JM BP1L3N-T BP1L3N-T/JM BP1A3M-T BP1A3M-T/JM BP1A4M-T BP1A4M-T/JM BP1L2Q-T BP1L2Q-T/JM BP1J3P/JM BP1F3P/JM BP1L3N/JM
Description	Hybrid transistor ECONOLINE: RN - Custom Solutions Available- 1kVDC & 2kVDC Isolation- No Extern. Components Required- UL94V-0 Package material- No Heatsink Required- Efficiency to 85% On-chip resistor PNP silicon epitaxial transistor For mid-speed switching 片上电阻进步党硅外延晶体管中速开
File Size	91.30K / 6 Page	View it Online	Download Datasheet

				MOLEX INC
Part No.	53780-1470
Description	Wire-to-Board Header; No. of Contacts:14; Pitch Spacing:1.25mm; No. of Rows:1; Gender:Header; Series:53780; Body material:PPS Polyphenylene Sulfide; Contact material:Phosphor Bronze; Current Rating:1A; Housing Style:Right-Angle RoHS Compliant: Yes
File Size	381.97K / 5 Page	View it Online	Download Datasheet

				Analog Devices, Inc. AD[Analog Devices]
Part No.	AD53032 AD53032JSTP
Description	Silver Mica Capacitor; Capacitance:12pF; Capacitance Tolerance: /- 5%; Series:CD17; Voltage Rating:500VDC; Capacitor Dielectric material:Mica; Termination:Radial Leaded; Lead Pitch:5.9mm; Leaded Process Compatible:Yes RoHS Compliant: Yes High Performance Driver/Comparator Active Load on a Single chip DRIVER/COMPARATOR/LOAD: A Single chip that Performs the Pin Electronics Functions of Driver, Comparator and Active Load in ATE VLSI and Memory Testers
File Size	101.56K / 8 Page	View it Online	Download Datasheet

				Dielectric Laboratories, Inc.
Part No.	D20NP1R4F5PA D12NP0R4F5PA D12NP0R4B5PA D15NP1R2F5PX D12NP0R5B5PB D30NP2R4B5PA D12NP0R5F5PA D12NP0R6B5PB D20NP1R8F5PA D30NP2R4B1PX D12NP0R5F5PB D12NP0R8F5PX D12NP0R9B5PB D20NP1R4B5PB D20NP1R2F5PA D12NPR45F5PA D30NP2R4B5PB D20NP1R8F5PX D20NP1R4B5PA D30NP1R4B1PX D12NP0R8B5PX D12NP0R5F5PX D12NP0R5B5PX D20NP1R2F1PA D15NP1R1F5PA D30NP1R3C1PA D20NP1R2F1PX D20NP1R0B1PX D12NP0R4B5PX D12NP0R9F5PX D20NP1R1F5PA D12NP0R7B5PX D30NP1R3B1PB D15NP1R1F5PB D30NP1R3B1PA D30NP1R3C1PB D30NP2R4B1PA D20NP1R4B5PX D12NP0R8B5PB D20NP1R1F1PB D12NP0R6F5PB D15NP1R2F5PB D20NP1R2F1PB D12NP0R7B5PB D12NP0R6B5PA D12NPR35F5PB D20NP1R4F5PX D12NP0R6F5PA D30NP2R4B1PB D20NP1R1F5PB D20NP1R7F5PB D12NP0R4D5PB D12NP0R6F5PX D30NP1R3D1PA D12NP0R8B5PA D20NP1R0B1PA D20NP1R0B1PB D30NP1R3B1PX D15NP1R2F5PA D12NP0R4F5PX D20NP1R6F5PA D12NPR35F5PX D30NP1R4B1PA D20NP1R7F5PX D20NP1R8F5PB D12NP0R6B5PX D12NP0R4F5PB D12NP0R4D5PX D12NS2R0G5PA D12NP0R4D5PA D12NS2R0C5PA D15NP1R1F5PX D12NP0R5D5PA D12NP0R9B5PX D12NS2R0F5PX D12NS2R0J5PX D12NP0R9F5PB D30NP2R4B5PX D12NS2R0B5PB D12NS2R0F5PA D12NS2R0J5PB D30NP1R3C1PX D20NP1R6F5PX D12NS2R0B5PA D20NP1R4F5PB D12NP0R5B5PA D20NP1R1F1PA D12NP0R9B5PA D20NP1R6F5PB D12NS2R0F5PB D12NS2R0B5PX D12NS2R0G5PX D20N
Description	CAPACITOR, CERAMIC, 50 V, NP, 0.0000014 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000004 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000012 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000005 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000024 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000006 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000018 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, NP, 0.0000024 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000008 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000009 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.00000045 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, NP, 0.0000014 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, NP, 0.0000012 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000011 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, NP, 0.0000013 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, NP, 0.000001 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000007 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, NP, 0.0000011 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.00000035 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000017 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NP, 0.0000016 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, NS, 0.000002 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, BJ, 0.000043 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, PG, 0.00000008 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, PG, 0.00000008 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, PG, 0.00000007 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, PG, 0.00000007 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, PI, 0.0000002 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 100 V, PI, 0.00000006 uF, SURFACE MOUNT chip CAPACITOR, CERAMIC, 50 V, PI, 0.00000006 uF, SURFACE MOUNT chip
File Size	930.06K / 8 Page	View it Online	Download Datasheet

				MICROSEMI CORP-COLORADO MICROSEMI[Microsemi Corporation]
Part No.	UES1401 UES1402 UES1403 UES1404 BYW80 BYW80-150 BYW80-50 BYW80-200 BYW29-200 BYW29-100 BYW29-150 BYW29-50 BYW80-100
Description	; Number of Conductors:2; Conductor Size AWG:20; No. Strands x Strand Size:7 x 28; Jacket material:Polyvinylchloride (PVC); Shielding material:Aluminum Foil/Polyester Tape; Shielding Coverage:100%; Capacitance:56pF/ft RoHS Compliant: Yes ECONOLINE: RQS & RQD - 1kVDC Isolation- Internal SMD Construction- UL94V-0 Package material- Toroidal Magnetics- Efficiency to 80% Access Control Composite Cable; Composite Conductor Types:10 Conductors 3 Pairs; Number of Conductors:16; Conductor Size AWG:18-16; No. Strands x Strand Size:7 x 26, 19 x 30; Jacket material:Thermoplastic; Number of Pairs:3 RoHS Compliant: Yes (UES1402 / UES1403 / UES1404) RECTIFIERS
File Size	137.43K / 3 Page	View it Online	Download Datasheet

				Taiyo Yuden (U.S.A.), I... http:// TAIYO-YUDEN[Taiyo Yuden (U.S.A.), Inc] Omron Electronics, LLC Bourns, Inc. Advanced Semiconductor, Inc. Samtec, Inc. KEMET Corporation
Part No.	HBK1608B10NJ-T HBK1608B10NBK-T HBK1608B10NS-T HK1608B10NJ-T HK1608B10NK-T HK1608B10NS-T HK1608 HK1005R10J-T HK1608R10J-T HK1608R10K-T HK1608R10S-T HK1608R12J-T HK1608R12K-T HK1608R12S-T HK2125R12S-T HK1005 HK100510NJ-T HK100510NK-T HK100510NS-T HK10052N7S HK10053N9J HK10053N9J-T HK10053N9K-T HK10053N9S-T HK1005R10K-T HK1005R10S-T HK1005R12J-T HK1005R12K-T HK1005R12S-T HK1005XXXX HK16083N9J-T HK16083N9K-T HK16083N9S-T HK1608XXXX HK2125 HK212510NJ-T HK212510NK-T HK212510NS-T HK21253N9J-T HK21253N9K-T HK21253N9S-T HK2125R10J-T HK2125R10K-T HK2125R10S-T HK2125R12J-T HK2125R12K-T HK160810NS-T HK160810NK-T HK160810NJ-T
Description	MULTILAYER chip INDUCTOR FOR HIGH FREQUENCY HK SERIES Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body material:Aluminum; Series:PT06; No. of Contacts:4; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight RSNTR 6.00MHZ 33PF 0.5% CER SMD-3.4X7.4 -40 85C T&R RES,TF,15,1%,1/16W,0603 MULTILAYER chip INDUCTOR FOR HIGH FREQUENCY HK SERIES 多层片式电感的高HK系列 TV 8C 8#8(TWIN) SKT WALL RECP 多层片式电感的高频HK系列 CAP 0.22UF 100V 10% X7R AXIAL TR-14 多层片式电感的高频HK系列 Circular Connector; Body material:Aluminum; Series:PT06; No. of Contacts:3; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Socket; Insert Arrangement:12-3 多层片式电感的高频HK系列 MULTILAYER chip INDUCTOR FOR HIGH FREQUENCY HK SERIES 多层片式电感的高频HK系列 Circular Connector; No. of Contacts:4; Series:; Body material:Aluminum; Connecting Termination:Solder; Connector Shell Size:12; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:12-4 多层片式电感的高频HK系列 RSNTR 16.00MHZ 33PF 0.1% CER SMD-3.4X7.4 -40 85C T&R RSNTR 6.00MHZ 33PF 0.5% CER SMD-3.4X7.4 -40 85C T&R
File Size	103.46K / 2 Page	View it Online	Download Datasheet

				MICROSEMI[Microsemi Corporation]
Part No.	UES702 BYW77-100 BYW77-150 UES703 BYW31-100 BYW31-150 BYW31-50 BYW77-50 UES701
Description	RECTIFIERS Shielded Multiconductor Cable; Number of Conductors:4; Conductor Size AWG:22; No. Strands x Strand Size:7 x 30; Jacket material:Fluoropolymer; Shielding material:Aluminum Foil/Polyester Tape; Shielding Coverage:100% RoHS Compliant: Yes
File Size	117.57K / 3 Page	View it Online	Download Datasheet

				Pomona Electronics
Part No.	1330-0
Description	Banana Plug; Current Rating:15A; Body material:Brass; Color:Black; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Spring material:Beryllium Copper; Voltage Rating:5000V INTERCONNECTION DEVICE
File Size	66.69K / 1 Page	View it Online	Download Datasheet

				Cypress Semiconductor Corp.
Part No.	CYWM6935
Description	Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:20; No. Strands x Strand Size:7 x 28; Jacket material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes; Capacitance:56pF/ft; Conductor material:Copper RoHS Compliant: Yes WirelessUSB LR Radio Module
File Size	545.95K / 5 Page	View it Online	Download Datasheet

For chip material gap gap Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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