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Molex Electronics Ltd.
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| Part No. |
A-70567-0349 15-80-1221 0015801221
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| OCR Text |
...Mating Part Lock to Mating Part material - Metal material - Plating Mating material - Plating Termination material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommende... |
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
 View
it Online |
Download Datasheet
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MILL-MAX MFG CORP
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| Part No. |
0038-3-17-15-30-27-02-0
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| OCR Text |
...2/12/2011 page 1 of 2
?shell?material: brass?alloy (uns c36000) per astm b 16 properties?of?brass?alloy: chemical composition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conduct... |
| Description |
BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
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| File Size |
139.62K /
2 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
A-70567-0348 15-80-1201 0015801201
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| OCR Text |
...Mating Part Lock to Mating Part material - Metal material - Plating Mating material - Plating Termination material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommende... |
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
A-70567-0346 15-80-1161 0015801161
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| OCR Text |
...Mating Part Lock to Mating Part material - Metal material - Plating Mating material - Plating Termination material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommende... |
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
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| Part No. |
A-70567-0344 15-80-1121 0015801121
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| OCR Text |
...Mating Part Lock to Mating Part material - Metal material - Plating Mating material - Plating Termination material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommende... |
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
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|
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Molex Electronics Ltd.
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| Part No. |
A-70567-0343 15-80-1101 0015801101
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| OCR Text |
...Mating Part Lock to Mating Part material - Metal material - Plating Mating material - Plating Termination material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommende... |
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.38K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Molex Electronics Ltd.
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| Part No. |
A-70567-0341 15-80-1061 0015801061
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| OCR Text |
...Mating Part Lock to Mating Part material - Metal material - Plating Mating material - Plating Termination material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommende... |
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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