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    Austria Mikro Systems
AMSCO[austriamicrosystems AG]
Part No. AS8413
OCR Text ...or more pairs of transducers is made possible by means of a master/slave configuration. Each pair is controlled by a AS8413 IC. No adjustments are necessary at factory or at the field, as the AS8413 is self-adaptive to the physical and envi...
Description HIGH PERFORMANCE AUTOMOTIVE SONAR INTRUSION

File Size 124.26K  /  15 Page

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    Agilent (Hewlett-Packard)
Part No. HFBR-53A3VFM HFBR-53A3VEM
OCR Text ...A3VEM/FM transceiver housing is made of high strength, heat resistant, chemically resistant, and UL 94V-0 flame retardant plastic. Recommended Solder and Wash Process The HFBR-53A3VEM/FM is compatible with industrystandard wave or hand sold...
Description HFBR-53A3VFM · 1 x 9 3.3V Fiber Optic Transceiver for Fibre Channel/Storage - Flush Shield, Metalized Housing
HFBR-53A3VEM · 1 x 9 3.3V Fiber Optic Transceiver for Fibre Channel/Storage - Extended Shield, Metalized Housing
3.3 V 1 x 9 Fiber Optic Transceivers for Fibre Channel for Fibre Channel

File Size 303.90K  /  14 Page

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    NTE3021

NTE Electronics
Part No. NTE3021
OCR Text ...nte3020) source color device is made with gallium arsenide phosphide on gallium arsenide red light emitting diode. the high efficiency red (nte3022) and orange (nte3023) source color de- vices are made with gallium arsenide phosphide on g...
Description Light emitting diode (LED). Yellow..

File Size 19.40K  /  3 Page

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    HMC-ALH216

Analog Devices
Part No. HMC-ALH216
OCR Text ...schedule. wire bonding rf bonds made with 0.003 x 0.0005 ribbon are recommended. these bonds should be thermosonically bonded with a force of 40-60 grams. dc bonds of 0.001 (0.025 mm) diameter, thermosonically bonded, are recommended. ...
Description GaAs HEMT MMIC LOW NOISE AMPLIFIER

File Size 267.56K  /  6 Page

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    KO103A KO103B KO103C KO103D KO103E

E-SWITCH
Part No. KO103A KO103B KO103C KO103D KO103E
OCR Text ...cylinder, chrome plated * Steel made tubular keys, nickel plated * Silver plated contacts and terminals * 200 combinations available 1A @ 125 VAC 0.5A @ 250 VAC 20 m max. initial @ 2-4 VDC, 100 mA 200 M min. 1,500 V rms @ sea level Pa...
Description KEYLOCK SWITCHES

File Size 942.74K  /  13 Page

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    LM75DM-33R2 LM75DM-50R2 ON0319 LM75

ONSEMI[ON Semiconductor]
Part No. LM75DM-33R2 LM75DM-50R2 ON0319 LM75
OCR Text ...In Interrupt Mode, INT/CMPTR is made active by TEMP exceeding TSET; it is unconditionally reset to its inactive state by reading any register via the 2-wire bus. If and when temperature falls below THYST, INT/CMPTR is again driven active. R...
Description 2-Wire Serial Temperature Sensor and Monitor DIGITAL TEMP SENSOR-SERIAL, 9BIT(s), 3Cel, SQUARE, SURFACE MOUNT
From old datasheet system

File Size 150.47K  /  12 Page

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    FDD3570

FAIRCHILD[Fairchild Semiconductor]
Part No. FDD3570
OCR Text ...ed in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-sta...
Description 80V N-Channel PowerTrench MOSFET

File Size 211.21K  /  8 Page

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    FDD3670

FAIRCHILD[Fairchild Semiconductor]
Part No. FDD3670
OCR Text ...ed in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-sta...
Description 100V N-Channel PowerTrench MOSFET

File Size 165.77K  /  6 Page

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    FDD5690

FAIRCHILD[Fairchild Semiconductor]
Part No. FDD5690
OCR Text ...ed in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-sta...
Description 60V N-Channel PowerTrench⑩ MOSFET
60V N-Channel PowerTrench MOSFET

File Size 205.08K  /  7 Page

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