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Molex Electronics Ltd.
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| Part No. |
0739447201 73944-7201
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
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| File Size |
154.08K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
73944-2002LF
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| Description |
Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0739447200 73944-7200
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
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| File Size |
154.08K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
73944-1003LF
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| Description |
Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Through Hole, 5 Rows, 210 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
73944-1002LF
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| Description |
Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68739-448HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68739-442HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68739-444HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68739-446HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73944-7017 0739447017
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits
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| File Size |
154.47K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68739-440HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73944-7016 0739447016
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
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| File Size |
154.47K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
R1EX24016ATAS0G#U0
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| Description |
EEPROM, TSSOP, /Embossed Tape
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
UPD70F4016M2GJA-GAE-G
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| Description |
32-bit Microcontrollers (Non Promotion), , /
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| Tech specs |
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Official Product Page
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Price and Availability
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