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				List of Unclassifed Manufacturers ETC[ETC] N.A.
Part No.	NFSW036BT NFSW036B
OCR Text	...t Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~...bent / or other stress shall be applied to the board after mounting LED with solder to avoid a crack...
Description	SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED
File Size	706.32K / 14 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	TDA1518BQ TDA1518 TDA1518B
OCR Text	... printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to t...
Description	24 W BTL or 2 x 12 watt stereo car radio power amplifier
File Size	80.88K / 11 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC265LM3
OCR Text	...up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the flux to completely activate. Ref...
Description	GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz GaAs MMIC SUB-HARMONIC SMT MIXER 20 - 31 GHz
File Size	292.86K / 8 Page	View it Online	Download Datasheet

				NICHIA CORPORATION ETC[ETC] List of Unclassifed Manufacturers
Part No.	NSPG320BS
OCR Text	...commended soldering conditions Pre-Heat Pre-Heat Time Solder Bath Temperature Dipping Time Dipping Position Dip Soldering 120C Max. 60 seconds Max. 260C Max. 10 seconds Max. No lower than 3 mm from the base of the epoxy bulb. Temperature S...
Description	From old datasheet system NICHIA GREEN LED
File Size	272.73K / 15 Page	View it Online	Download Datasheet

				NXP Semiconductors Philips Semiconductors
Part No.	TDA2653A
OCR Text	... printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to t...
Description	Vertical deflection circuit
File Size	126.77K / 11 Page	View it Online	Download Datasheet

				Lite-On Technology Corporation 光宝科技股份有限公司
Part No.	LTL-523-11
OCR Text	... (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 100C Max. 60 sec. Max. 260C Max. 10 sec. Max. Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic...
Description	Black case enhance contrast ratio
File Size	256.65K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC283LM1
OCR Text	...up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the flux to completely activate. Ref...
Description	SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz
File Size	358.78K / 8 Page	View it Online	Download Datasheet

				ROHM[Rohm]
Part No.	MCH318FN106JK MCH318FN106ZP MCH31 MCH312FN106JK MCH312FN106JP MCH312FN106KK MCH312FN106KP MCH312FN106ZK MCH312FN106ZP MCH313FN106JK MCH313FN106JP MCH313FN106KK MCH313FN106KP MCH313FN106ZK MCH313FN106ZP MCH314FN106JK MCH314FN106JP MCH314FN106KK MCH314FN106KP MCH314FN106ZK MCH314FN106ZP MCH315FN106JK MCH315FN106JP MCH315FN106KK MCH315FN106KP MCH315FN106ZK MCH315FN106ZP MCH318FN106JP MCH318FN106KK MCH318FN106KP MCH318FN106ZK
OCR Text	...re completely under the solder. Pre-heating at 150+/-10C for 1 to 2min Initial measurements prior to test shall be performed after the therm...bent till 1mm by 1.0mm/s. As per 4.17 of JIS C 5101-1. The specimens shall be soldered on the specif...
Description	Multi-layer ceramic chip capacitors
File Size	207.97K / 11 Page	View it Online	Download Datasheet

				FAIRCHILD[Fairchild Semiconductor]
Part No.	RMPA1850
OCR Text	...al heating rate is 1- 2C/sec. * Pre-heat/soak: The soak temperature stage serves two purposes; the flux is activated and the board and devices achieve a uniform temperature. The recommended soak condition is: 120-150 seconds at 150C. * Refl...
Description	Quad Band GSM/GPRS Power Amplifier Module
File Size	116.02K / 9 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	TDA1516B TDA1516BQ TDA1516
OCR Text	... printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to t...
Description	24 W BTL or 2 x 12 watt stereo car radio power amplifier
File Size	94.82K / 11 Page	View it Online	Download Datasheet

For pre-bent Found Datasheets File :: 694 Search Time::2.375ms
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