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  73944-4016 Datasheet PDF File

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    73944-1201 0739441201

Molex Electronics Ltd.
Part No. 73944-1201 0739441201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-2002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0739441216

Molex Electronics Ltd.
Part No. 0739441216
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-1003LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Through Hole, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

    0739446004

Molex Electronics Ltd.
Part No. 0739446004
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
File Size 153.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 73944-1002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs 　 　

Official Product Page

    0739446006

Molex Electronics Ltd.
Part No. 0739446006
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 72 Circuits
File Size 153.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0739446008

Molex Electronics Ltd.
Part No. 0739446008
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
File Size 153.82K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0739440216

Molex Electronics Ltd.
Part No. 0739440216
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    73944-7003 0739447003

Molex Electronics Ltd.
Part No. 73944-7003 0739447003
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 153.83K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0739441217

Molex Electronics Ltd.
Part No. 0739441217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Amphenol Communications Solutions
Part No. 68739-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    0739441016

Molex Electronics Ltd.
Part No. 0739441016
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits
File Size 154.07K  /  4 Page

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Renesas Electronics Corporation
Part No. R1EX24016ATAS0G#U0
Description EEPROM, TSSOP, /Embossed Tape
Tech specs 　 　

Official Product Page

    0739444000

Molex Electronics Ltd.
Part No. 0739444000
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 72 Circuits
MOLEX Connector
File Size 154.02K  /  4 Page

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Renesas Electronics Corporation
Part No. UPD70F4016M2GJA-GAE-G
Description 32-bit Microcontrollers (Non Promotion), , /
Tech specs 　 　

Official Product Page

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