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0AA61 TC3684 1206FC ALD4302 MAX1649 1727B NTE6048 LE154
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  32000 Datasheet PDF File

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    LH532000B LH532000BT

Sharp, Corp.
Sharp Corporation
Sharp Electrionic Components
Sharp Electronics Corp.
Part No. LH532000B LH532000BT
Description CMOS 2M (256K x 8/128K x 16) MROM 200万的CMOS56 × 8/128K × 16MROM
LH532000BT CMOS 1M (128K x 8) Mask Programmable ROM 48-pin TSOP

File Size 67.62K  /  7 Page

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Renesas Electronics Corporation

Part No. 84132-000
Description 4Kx4 SRAM
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    5011932000 501193-2000 SD-501193-002

Molex Electronics Ltd.
Part No. 5011932000 501193-2000 SD-501193-002
Description 1.00mm (.039) Pitch Pico-Clasp Wire-to-Board Crimp Terminal, 28-32 AWG, Leadfree, Gold Plating
MOLEX Connector

File Size 98.36K  /  3 Page

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Renesas Electronics Corporation

Part No. 7MB6320-000
Description SRAM MODULE
Tech specs    

Official Product Page

    Renesas Electronics, Corp.
Part No. 5962-9320001QXX
Description Single, Dual, Quad, 1.2&#181;A Max, Single-Supply Op Amps 8位D型锁存器

File Size 787.70K  /  18 Page

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Amphenol Communications Solutions

Part No. 10106133-2000002LF
Description PwrBlade+® , Power Connectors, 2HP PF, Right Angle, Header.
Tech specs    

Official Product Page

    M32000D4AFP

Tyco Electronics
Part No. M32000D4AFP
Description CONTROLLED Q BROADBAND RF POWER TRANSISTOR NPN SILICON

File Size 190.51K  /  5 Page

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Amphenol Communications Solutions

Part No. 10121505-320008BLF
Description HPCE VT Receptacle with enhanced wall 32P8S
Tech specs    

Official Product Page

    M32000D4BFP-80

Mitsubishi Electric Semiconductor
Part No. M32000D4BFP-80
Description SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER?????|}
File Size 447.27K  /  44 Page

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Amphenol Communications Solutions

Part No. 10119109-320007LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    KM23C32000C

Samsung Semiconductor
Part No. KM23C32000C
Description 32M-Bit (4Mx8 / 2Mx16) CMOS Mask ROM

File Size 82.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 48232-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    KM23C32000A

Samsung Semiconductor
Part No. KM23C32000A
Description 32M-Bit (2Mx16) CMOS Mask ROM

File Size 279.74K  /  4 Page

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Amphenol Communications Solutions

Part No. 10104320-009RLF
Description Universal Contact, 1.30mm Height
Tech specs    

Official Product Page

    Mitsubishi Electric Corporation
Part No. M32000D4BFP-80
Description SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER

File Size 554.58K  /  44 Page

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Amphenol Communications Solutions

Part No. 10106133-2000004LF
Description PwrBlade+® , Power Connectors, 2HP PF, Right Angle, Header.
Tech specs    

Official Product Page

    Mitsubishi Electric Corporation
Part No. M32000D4 M32000D4AFP
Description SINGLE CHIP 32 BIT CMOS MICROCOMPUTER
Single Chip 32-BIT CMOS MICROCOMPUTER

File Size 616.53K  /  45 Page

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Amphenol Communications Solutions

Part No. 10106133-2000401LF
Description PwrBlade+® , Power Connectors, 2HDP, Right Angle, Header.
Tech specs    

Official Product Page

    NEC, Corp.
Part No. PD23C32000L
Description 32M-Bit Mask-Programmble ROM(32M位掩膜可选ROM) 32兆位掩模可编程光盘(32兆位掩膜可选光盘)

File Size 130.65K  /  20 Page

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Amphenol Communications Solutions

Part No. 10106133-2000005LF
Description PwrBlade+® , Power Connectors, 2HDP PF, Right Angle, Header.
Tech specs    

Official Product Page

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