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  XHF3-030-JF-B Datasheet PDF File

For XHF3-030-JF-B Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Molex, Inc.
Part No. 08-03-0303
Description Crimp Socket Contact; Wire Size (AWG):24-18; Contact Material:Brass RoHS Compliant: Yes BRASS, TIN LEAD FINISH, WIRE TERMINAL

File Size 96.04K  /  2 Page

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HUA FENG CIRCUIT





    Samtec, Inc
Part No. BSH-030-01-L-D-A-TR BSH-150-01-L-D-A
Description BASIC BLADE & BEAM SOCKET

File Size 858.46K  /  1 Page

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    10-84-4030

Molex Electronics Ltd.
Part No. 10-84-4030
Description 6.35mm Pitch MLX?Power Connector Header, Vertical, 3 Circuits, PA Polyamide

File Size 38.66K  /  2 Page

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    ESC Electronics
Part No. A030
Description DIP Delay Lines

File Size 110.58K  /  1 Page

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    15-80-0303

Molex Electronics Ltd.
Part No. 15-80-0303
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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    3030-10

ASM GmbH
Part No. 3030-10
Description ANALOG MULTIMETER

File Size 296.60K  /  2 Page

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    Asahi Kasei Microsystem...
Part No. MS-0030
Description Semiconductor Magnetoresistive Element

File Size 386.25K  /  8 Page

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    22-43-3030

Molex Electronics Ltd.
Part No. 22-43-3030
Description 2.5 SPOX IDT RECEPTACLE WHITE 3CKT

File Size 301.83K  /  4 Page

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    22-28-0030

Molex Electronics Ltd.
Part No. 22-28-0030
Description 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, Tin (Sn) Plating

File Size 167.68K  /  6 Page

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    MILL-MAX MFG CORP
Part No. 0305-2-57-01-47-27-10-0
Description BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL

File Size 252.03K  /  2 Page

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